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Número de pieza | MBRAF3200T3G | |
Descripción | Surface Mount Schottky Power Rectifier | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! MBRAF3200T3G
Surface Mount
Schottky Power Rectifier
This device employs the Schottky Barrier principle in a large area
metal−to−silicon power diode. State−of−the−art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes in surface mount
applications where compact size and weight are critical to the system.
Features
• Small Compact Surface Mountable Package with J−Bend Leads
• Rectangular Package for Automated Handling
• Highly Stable Oxide Passivated Junction
• Very High Blocking Voltage − 200 V
• 150°C Operating Junction Temperature
• Guard−Ring for Stress Protection
• This is a Pb−Free Device
Mechanical Charactersistics
• Case: Epoxy, Molded, Epoxy Meets UL 94, V−0
• Weight: 95 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Cathode Polarity Band
• Device Meets MSL 1 Requirements
• ESD Ratings: Machine Model = A
ESD Ratings: Human Body Model = 1B
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(TL = 100°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
VRRM
VRWM
VR
IF(AV)
IFSM
200
3.0
100
V
A
A
Operating Junction Temperature
TJ −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
3.0 AMPERE
200 VOLTS
SMA−FL
CASE 403AA
PLASTIC
STYLE 6
MARKING DIAGRAM
AYWW
RACG
G
RAC = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBRAF3200T3G SMA−FL 5000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 0
1
Publication Order Number:
MBRAF3200T3/D
1 page |
Páginas | Total 4 Páginas | |
PDF Descargar | [ Datasheet MBRAF3200T3G.PDF ] |
Número de pieza | Descripción | Fabricantes |
MBRAF3200T3G | Surface Mount Schottky Power Rectifier | ON Semiconductor |
MBRAF3200T3G | Surface Mount Schottky Power Rectifier | ON Semiconductor |
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