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PDF L6221N Data sheet ( Hoja de datos )

Número de pieza L6221N
Descripción QUAD DARLINGTON SWITCH
Fabricantes STMicroelectronics 
Logotipo STMicroelectronics Logotipo



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No Preview Available ! L6221N Hoja de datos, Descripción, Manual

L6221A L6221AD
® L6221N
. FOUR NON INVERTING INPUTS WITH
ENABLE
. OUTPUT VOLTAGE UP TO 50 V
. OUTPUT CURRENT UP TO 1.8 A
. VERY LOW SATURATION VOLTAGE
. TTL COMPATIBLE INPUTS
. INTEGRAL FAST RECIRCULATION DIODES
DESCRIPTION
The L6221 monolithic quad darlington switch is de-
signedfor high current, high voltageswitching appli-
cations. Each of the four switches is controlled by a
logic input and all four are controlled by a common
enableinput.All inputsareTTL-compatiblefor direct
connection to logic circuits.
Eachswitch consists of an open-collectordarlington
transistor plus a fast diodefor switchingapplications
with inductive device loads. The emitters of the four
switches are commoned. Any number of inputsand
outputs of the same device may be paralleled.
QUAD DARLINGTON SWITCH
Powerdip 12 + 2 + 2
Multiwatt 15
SO16+2+2
ORDERING NUMBERS:
L6221A (Powerdip)
L6221N (Multiwatt15)
L6221AD (SO16+2+2)
BLOCK DIAGRAM
July 1998
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L6221N pdf
TEST CIRCUITS
(X) = Referred to Multiwatt package
X = Referred to Powerdip package
Figure 1 : Logic supply current.
L6221A - L6221AD - L6221N
Set V IN = 4.5V, V EN = 0.8V, or V IN = 0.8V, V EN = 4.5V, for I S (all outputs off)
Set V IN = 2V, V EN = 2V, for I S (all outputs on)
Figure 2 : Output Sustaining Voltage.
Figure 3 : Output Leakage Current.
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L6221N arduino
L6221A - L6221AD - L6221N
MOUNTING INSTRUCTION
The Rth j-amb of the L6221A can be reduced by sol-
deringthe GND pins to a suitablecopperarea of the
printed circuit board (Fig. 23) or to an external
heatsink (Fig. 24).
The diagram of figure 25 shows the maximum dis-
sipable power Ptot and the Rth j-amb as a function of
the side ” α” of two equal square copper areas hav-
Figure 23 : Example of P.C. Board Copper Area
Which is Used as Heatsink
ing a thickness of 35µ (1.4 mils). During soldering
the pins temperature must not exceed 260 °C and
the soldering time must not be longer than 12 sec-
onds.
The external heatsink or printed circuit copper area
must be connected to electrical ground.
Figure 24 : External Heatsink Mounting Example
Figure 25 : Maximum Dissipable Power and Junc-
tion to Ambient Thermal Resistance
versus Side ” α
Figure 26 : Maximum Allowable Power Dissipa-
tion versus Ambient Temperature
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