|
|
PDF ILX553B Data sheet ( Hoja de datos )
| Número de pieza | ILX553B | |
| Descripción | 5150-pixel CCD Linear Sensor | |
| Fabricantes | Sony | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de ILX553B (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
5150-pixel CCD Linear Sensor (B/W)
ILX553B
Description
The ILX553B is a reduction type CCD linear sensor
developped for DPPC, multifunction printers. This
sensor reads A4-size documents at a density of 600
DPI at high speed of 16MHZ.
22 pin DIP (Plastic)
Features
• Number of effective pixels: 5150 pixels
• Pixel size:
7µm × 7µm (7µm pitch)
• Clamp circuit is on-chip
• Ultra high sensitivity/Ultra low lag
• Maximum data rate: 16MHz
• Single 12V power supply
• Input clock pulse:
CMOS 5V drive
• Package:
22 pin Plastic DIP (400mil)
Block Diagram
Absolute Maximum Ratings
• Supply voltage
VDD
• Operating temperature
• Storage temperature
15
–10 to +60
–30 to +80
V
°C
°C
Pin Configuration (Top View)
GND 1
GND 2
GND 3
GND 4
VOUT 5
VDD 6
GND 7
φ1 8
GND 9
GND 10
GND 11
1
5150
22 GND
21 GND
20 φLH
19 φRS
18 GND
17 φCLP
16 φROG
15 φ2
14 GND
13 GND
12 GND
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E01Y36
1 page  
Clock Timing Chart 2
t4
φROG
φ1
φLH
t6
t1
φ2
t2
Clock Timing Chart 3
φ1
φLH
φ2
φRS
t9
t7
φCLP
t13
ILX553B
t5
t3
t7
t6
t10 t11
t8
t14 t15
t12
VOUT
t16 t17
–5–
5 Page 
ILX553B
3) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering
iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool
sufficiently.
c) To dismount an imaging device, do not use a solder suction equipment. When using an electric
desoldering tool, ground the controller. For the control system, use a zero cross type.
4) Dust and dirt protection
a) Operate in clean environments.
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces.
Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity
ionized air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to
scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
– 11 –
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet ILX553B.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ILX553A | 5150-pixel CCD Linear Sensor (B/W) |  Sony Corporation |
| ILX553B | 5150-pixel CCD Linear Sensor | Sony |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |