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PDF LTD141ECEF Data sheet ( Hoja de datos )
| Número de pieza | LTD141ECEF | |
| Descripción | TFT LCD Module | |
| Fabricantes | Toshiba | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de LTD141ECEF (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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To: Proview Electronics Co., Ltd.
APPROVAL SIGNATURE
SPECIFICATION
FOR
TOSHIBA MATSUSHITA DISPLAY TECHNOLOGY
TFT-LED MODULE
LTD141ECEF
SPECIFICATION No. :
LTD141ECEF
DATE OF ISSUE : 2003-04-15
(DATE OF EXPIRY : 2006-04-14)
H. Yamaguchi
General Manager
Quality Assurance Div.
<Engineering Department to contact as per SPECIFICATION>
TV/PC/Monitor-Use Marketing & Engineering Dept.
AVC-Use LTD Div.
Toshiba Matsushita Display Technology Co.,Ltd
1-9-2, Hatara-cho, Fukaya-shi, Saitama, 366-0032, JAPAN
1 page  
Specification No.
Sheet 4
For Installation in Assembly
(1) The C-MOS LSIs used in LED module are very sensitive to ESD (Electro-static Discharge).
Ambient humidity of working area is recommended to be higher than 50%(RH).
Person handling LED modules should be grounded with wrist band. Tools like soldering iron and screw driver, and
working benches should be grounded.
The grounding should be done through a resistor of 0.5-1MΩ in order to prevent spark of ESD.
(2) When remove protection film from LED panel, peer off the film slowly (more than three seconds) from the edge of the
panel, using a soft-pointed tweezers covered by Teflon or adherent tape.
(3) Reduce dust level in working area. Especially the level of metal particle should be decreased.
Use finger stalls or soft and dust-free gloves in order to keep clean appearance of LED module when handled for
incoming inspection and assembly.
Σ(4) When LED panel becomes dirty, wipe off the panel surface softly with absorbent cotton or another soft cloth.
If necessary, breathe upon the panel surface and then wipe off immediately and softly again.
If the dirt can not be wiped off, absorbent cotton wetted a little with normal-hexane or petroleum benzine can be used for
wiping the panel.
Be careful not to spill this solvent into the inside of LED module. Driver ICs and PCB area used inside LED module may
be damaged by the solvent.
Σ(5) AVOID THE CONDENSATION OF WATER
Wipe off a spot or spots of water of mist and chemicals of mist on LED panel softly with absorbent cotton or another
cloth as soon as possible if happened, otherwise discoloration or stain may be caused. If water invade into LED module,
it may cause LED module damages.
Σ(6) Do not expose LED module to the gas (which is not normally contained in the atmosphere), it may cause mis-operation
or defects.
Σ(7) DO NOT APPLY MECHANICAL FORCES.
Do not bend or twist LED module even momentary when LED module is installed an enclosure of the system. Bending
or twisting LED module may cause its damages.
Make sure to design the enclosure that bending/twisting forces are not applied to LED module when it is installed in the
system.
Refrain from strong mechanical shock like dropping from the working bench or knocking against hard object.
These may cause glass of the panel crack, damage of FL or other mis-operation.
Σ(8) Refrain from excessive force like pushing the surface of LED panel. This may cause damage of the panel or electrical
parts on PCB.
Σ(9) Do not put heavy object such as tools, books, etc., and do not pile up LED modules.
Be careful not to touch surface of the polarizer laminated to the panel with any hard and sharp object. The polarizer is so
soft that it can easily scratched, even the protect film covers it.
(10) When inserting or disconnecting the connectors to LED module, be sure not to apply force against PCB, nor connecting
cables, otherwise internal connection of PCB and TAB drivers may be damaged.
Do not fasten screws while putting cables like those for interface or FL between LED module and the enclosure.
Make sure to insert the module FL connector to the inverter connector in correct position.
If incorrect, this may cause smoke or burn of electrical parts by high voltage of FL circuit.
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
←# Special ←& Addition
New No.LTD141ECEF
Old No. NL-LTD141ECEE
← Change
5 Page 
2.4 Electrical Specifications
2.4.1 Circuit Diagram
Specification No.
Sheet 10
X-driver IC
CN1
DC/DC
converter
Gray scale
Manipulation
Voltage
Generation
Circuit
Panel
Controller
Liquid Crystal Panel
1024 x 768 pixels
Backlight
2.4.2 Sequence of Power Supplies and Signals
10ms (Max.)
20us (Min.)
3.0V
V DD 0.2V
65ms (Max.)
60ms (Min.)
10ms (Max.) 500ms (Min.)
3.0V
40ms (Max.)
0ms (Min.)
0.2V
0.2V
CLK-
IN0- - IN2-
CLK+
IN0+ - IN2+
10%
10%
10ms (Min.) 10ms (Min.)
Backlight
Toshiba Matsushita Display Technology Co.,Ltd
Date: 2003-04-15
Date: 2003-03-20
←# Special ←& Addition
New No.LTD141ECEF
Old No. NL-LTD141ECEE
← Change
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet LTD141ECEF.PDF ] | |
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