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PDF VMMK-1225 Data sheet ( Hoja de datos )
| Número de pieza | VMMK-1225 | |
| Descripción | 0.5 to 26 GHz Low Noise E-PHEMT | |
| Fabricantes | AVAGO | |
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VMMK-1225
0.5 to 26 GHz Low Noise E-PHEMT
in a Wafer Scale Package
Data Sheet
Description
Avago Technologies has combined it’s industry leading E-
pHEMT technology with a revolutionary chip scale package.
The VMMK-1225 can produce an LNA with high dynamic
range, high gain and low noise figure that operates off of a
single position DC power supply. The GaAsCap wafer scale
sub-miniature leadless package is small and ultra thin, yet
can be handled and placed with standard 0402 pick and
place assembly.
The use of 0.25 micron gates allow a ultra low noise figure
(below 1dB from 500 MHz to 12 GHz) with respectable as-
sociated gain. With a flat transconductance over bias and
frequency the VMMK-1225 provides excellent linearity
of over 22 dBm and power over 10 dBm at one dB com-
pression. This product is easy to use since it requires only
positive DC voltages for bias and low matching coeffi-
cients for simple impedance matching to 50 Ω systems.
The VMMK-1225 is intended for any 500MHz to 26.5GHz
application including 802.11abgn WLAN, WiMax, BWA
802.16 & 802.20 and military applications.
GaAsCap 0402, 1.05mm x 0.55mm x 0.25mm
t"YY
Gate t"YY
Drain
Pin Connections (Top View)
Notes: Top view package marking provides orientation
Features
• Sub-miniature 0402 (1mm x 0.5mm)
Surface Mount Leadless Package
• Low height (0.25mm)
• Frequency Range DC to 26.5 GHz
• Enhancement Mode[1]
• 0.25 micron gate width
• Tape and Reel packaging option available
Specifications
• 0.87dB Fmin
• 11dB Ga
• +23 dBm output 3rd order intercept
• +8 dBm output power
Applications
• 2.4 GHz, 3.5GHz, 5-6GHz WLAN and WiMax notebook
computer, access point and mobile wireless
applications
• DBS 10 to 13 GHz receivers
• VSAT and SATCOM 13 to 18 GHz systems
• 802.16 & 802.20 BWA systems
• WLL and MMDS Transceivers
• General purpose discrete E-pHEMT for other ultra low
noise applications
Notes:
1. The Avago enhancement mode pHEMT devices do not require a
negative gate bias voltage as they are “normally off”. They can help
simplify the design and reduce the cost of receivers and transmitters
in many applications from 500 MHz to 18 GHz
gate source
Notes:
“A” = Device Code
“YY” = Year Code
drain
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model = MM20 V (class A)
ESD Human Body Model = 100 V (Class O)
Refer to Avago Application Note A004R:
Electrostatic Discharge, Damage and Control.
1 page  
VMMK-1225 Typical Scattering Parameters and Noise Parameters, TA=25°C, Vds=2V, Ids=20mA [1]
Freq S11
S21
GHz Mag.
Ang.
dB Mag.
Ang.
2
0.95 -42.72 19.01 8.92
148.51
3
0.92 -62.66 18.46 8.38
134.49
4
0.88 -81.48 17.82 7.78
121.19
5
0.85 -98.49 17.11 7.17
109.28
6
0.81 -114.47 16.36 6.58
98.09
7
0.79 -129.09 15.64 6.05
87.68
8
0.77 -142.63 14.91 5.56
77.86
9
0.75 -155.20 14.16 5.11
68.55
10 0.74 -166.71 13.47 4.71 59.82
11 0.73 -177.38 12.81 4.37 51.64
12 0.73 172.73 12.17 4.06 43.68
13 0.73 163.36 11.58 3.79 36.07
14 0.72 154.49 11.00 3.55 28.75
15 0.72 146.17 10.48 3.34 21.67
16 0.73 137.93 9.99 3.16 14.53
17 0.73 129.96 9.52 2.99
7.56
18 0.73 122.52 9.05 2.83
0.89
19 0.74 114.96 8.61 2.69 -5.89
20 0.74 107.64 8.19 2.57 -12.53
21 0.75 100.69 7.77 2.44 -19.05
22 0.76 93.20 7.38 2.34 -25.66
23 0.76 86.08 7.01 2.24 -32.37
24 0.77 79.35 6.66 2.15 -38.72
25 0.78 72.88 6.31 2.07 -45.30
26 0.78 66.18 5.94 1.98 -51.81
S12
Mag. Ang.
0.03 62.56
0.05 50.55
0.06 39.47
0.07 29.48
0.07 20.68
0.08 12.23
0.08 4.59
0.08 -2.42
0.08 -8.97
0.08 -15.21
0.08 -20.51
0.08 -25.92
0.08 -31.20
0.07 -35.48
0.07 -39.63
0.07 -43.76
0.07 -47.66
0.07 -51.22
0.07 -54.78
0.06 -58.37
0.06 -62.24
0.06 -65.41
0.06 -69.57
0.06 -72.63
0.06 -76.40
S22
Mag. Ang.
0.78 -22.76
0.74 -33.18
0.69 -42.88
0.65 -51.36
0.60 -59.27
0.56 -66.63
0.53 -73.61
0.50 -80.46
0.47 -86.77
0.45 -92.81
0.43 -98.99
0.42 -104.88
0.40 -110.71
0.40 -116.24
0.39 -121.82
0.38 -127.93
0.38 -133.93
0.38 -139.67
0.38 -145.51
0.38 -151.20
0.37 -156.42
0.37 -162.46
0.38 -168.85
0.38 -175.43
0.38 178.40
MSG/MAG
dB
33.45
30.07
27.08
24.89
23.06
21.51
20.20
19.02
18.01
17.11
16.34
15.64
15.00
14.43
13.96
13.52
13.09
12.70
12.36
12.05
11.72
11.42
11.26
10.99
10.70
Typical Noise Parameters
Freq Fmin
GHz dB
2 0.15
3 0.23
4 0.3
5 0.37
6 0.44
7 0.51
8 0.58
9 0.66
10 0.73
11 0.8
12 0.87
13 0.94
14 1.01
15 1.09
16 1.16
17 1.23
Г opt
Mag.
0.78
0.707
0.637
0.573
0.515
0.462
0.415
0.373
0.338
0.308
0.284
0.265
0.252
0.245
0.244
0.248
Г opt
Ang.
16.80
24
31.7
40
48.8
58.2
68.1
78.6
89.7
101.3
113.5
126.2
139.5
153.4
167.8
-177.3
Rn/50
0.19
0.19
0.18
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.1
0.09
0.09
0.08
0.08
0.08
Ga
dB
21.31
19.92
18.63
17.45
16.37
15.41
14.55
13.79
13.15
12.61
12.17
11.85
11.63
11.52
11.51
11.62
Note:
1. S-parameters are measured in 50 Ohm test environment.
40.00
35.00
30.00
25.00
20.00
15.00
10.00
5.00
0.00
0
5 10 15 20
FREQUENCY (GHz)
Figure 15. MSG/MAG and S21 vs Frequency at 2V 20mA
MSG/MAG
S21
25 30
5
5 Page 
Outline Drawing
Top and Side View
0.5mm • AYY
1.05mm
Bottom View
0.85mm
0.725mm
0.33mm
0.25mm
Notes:
1. • indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
.014 [0.356]
.014 [0.356]
.022 [0.559]
.010 [0.254]
.020 [0.508]
Notes:
1. 0.010” Rogers RO4350
11
.005 [0.127]
.008 [0.203]
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
from topside if using a vacuum collet.
3. Recommended attachment is solder paste. Please
see Figure 14 for recommended solder reflow profile.
Conductive epoxy is not recommended. Hand
soldering is not recommended.
4. Apply solder paste using either a stencil printer or
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade
RF performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp to avoid damage
due to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260ºC for 20 to 40 sec. Verify that the
profile will not expose device beyond these limits.
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
Allow the module to dry before testing.
300
250 Peak = 250 ± 5 °C
Melting point = 218 °C
200
150
100
50
Ramp 1 Preheat Ramp 2 Reflow
0
0 50 100 150 200
SECONDS
Cooling
250
300
Figure 19. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Part Number Ordering Information
Part Number
No. of Devices
VMMK-1225-BLKG
100
VMMK-1225-TR1G
5000
Container
antistatic bag
7” Reel
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet VMMK-1225.PDF ] | |
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