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PDF PC81713NIP0F Data sheet ( Hoja de datos )
| Número de pieza | PC81713NIP0F | |
| Descripción | Low Input Current Photocoupler | |
| Fabricantes | Sharp | |
| Logotipo |  |
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PC8171xNSZ0F
Series
PC8171xNSZ0F Series
DIP 4pin High CMR,
Low Input Current
Photocoupler
■ Description
PC8171xNSZ0F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in SMT gullw-
ing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V, CTR is 100% to
600% at input current of 0.5mA and CMR is MIN.
10kV/µs.
■ Features
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Low input current type (IF=0.5mA)
4. High collector-emitter voltage(VCEO : 80V)
5. High noise immunity due to high common rejection
voltage (CMR : MIN. 10kV/µs)
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC8171)
2. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers
2. Facsimiles
3. Telephones
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: D2-A03302EN
1 Date Jun. 30. 2005
© SHARP Corporation
1 page  
PC8171xNSZ0F Series
■ Model Line-up
Lead Form Through-Hole SMT Gullwing
Package
Sleeve
100pcs/sleeve
Taping
2 000pcs/reel
PC81710NSZ0F PC81710NIP0F
PC81711NSZ0F PC81711NIP0F
PC81712NSZ0F PC81712NIP0F
Model No. PC81713NSZ0F PC81713NIP0F
PC81715NSZ0F PC81715NIP0F
PC81716NSZ0F PC81716NIP0F
PC81718NSZ0F PC81718NIP0F
Rank mark
with or without
A
B
C
A or B
B or C
A, B or C
IC [mA]
(IF=0.5mA, VCE=5V, Ta=25˚C)
0.5 to 3.0
0.6 to 1.5
0.8 to 2.0
1.0 to 2.5
0.6 to 2.0
0.8 to 2.5
0.6 to 2.5
Please contact a local SHARP sales representative to inquire about production status.
Sheet No.: D2-A03302EN
5
5 Page 
PC8171xNSZ0F Series
● Cleaning instructions
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
Sheet No.: D2-A03302EN
11
11 Page | ||
| Páginas | Total 14 Páginas | |
| PDF Descargar | [ Datasheet PC81713NIP0F.PDF ] | |
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