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PDF NCL30082ADMR2G Data sheet ( Hoja de datos )
| Número de pieza | NCL30082ADMR2G | |
| Descripción | Dimmable Quasi-Resonant Primary Side Current-Mode Controller | |
| Fabricantes | ON Semiconductor | |
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NCL30082
Product Preview
Dimmable Quasi-Resonant
Primary Side Current-Mode
Controller for LED Lighting
with Thermal Fold-back
http://onsemi.com
The NCL30082 is a PWM current mode controller targeting isolated
flyback and non−isolated constant current topologies. The controller
operates in a quasi−resonant mode to provide high efficiency. Thanks
to a novel control method, the device is able to precisely regulate a
constant LED current from the primary side. This removes the need
for secondary side feedback circuitry, biasing and an optocoupler.
The device is highly integrated with a minimum number of external
components. A robust suite of safety protection is built in to simplify
the design. This device supports analog/digital dimming as well as
thermal current fold−back. While the NCL30082 has integrated fixed
overvoltage protection, the designer has the flexibility to program a
lower OVP level.
Features
Micro8
DM SUFFIX
CASE 846A
MARKING DIAGRAM
8
AAx
AYWG
G
1
• Quasi−resonant Peak Current−mode Control Operation
• Primary Side Sensing (no optocoupler needed)
• Wide VCC Range
• Source 300 mA / Sink 500 mA Totem Pole Driver with 12 V Gate
Clamp
• Precise LED Constant Current Regulation ±1% Typical
AAx = Specific Device Code
x = C or D
A = Assembly Location
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
• Line Feed−forward for Enhanced Regulation Accuracy
• Low LED Current Ripple
• 250 mV ±2% Guaranteed Voltage Reference for Current Regulation
• ~ 0.9 Power Factor with Valley Fill Input Stage
• Low Start−up Current (13 mA typ.)
• Analog or Digital Dimming
• Thermal Fold−back
PIN CONNECTIONS
SD
ZCD
CS
GND
1
DIM
VIN
VCC
DRV
(Top View)
• Wide Temperature Range of −40 to +125°C
• Pb−free, Halide−free MSL1 Product
• Robust Protection Features
♦ Over Voltage / LED Open Circuit Protection
Typical Applications
♦ Over Temperature Protection
• Integral LED Bulbs
♦ Secondary Diode Short Protection
♦ Output Short Circuit Protection
♦ Shorted Current Sense Pin Fault Detection
• LED Power Driver Supplies
• LED Light Engines
♦ Latched and Auto−recoverable Versions
♦ Brown−out
♦ VCC Under Voltage Lockout
♦ Thermal Shutdown
This document contains information on a product under development. ON Semiconductor
reserves the right to change or discontinue this product without notice.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 32 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. P2
1
Publication Order Number:
NCL30082/D
1 page  
NCL30082
Table 3. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values TJ = 25°C, VCC = 12 V;
For min/max values TJ = −40°C to +125°C, Max TJ = 150°C, VCC = 12 V)
Description
Test Condition
Symbol
Min Typ
STARTUP AND SUPPLY CIRCUITS
Supply Voltage
Startup Threshold
Minimum Operating Voltage
Hysteresis VCC(on) – VCC(off)
Internal logic reset
Over Voltage Protection
VCC OVP threshold
VCC increasing
VCC decreasing
VCC decreasing
VCC(on)
VCC(off)
VCC(HYS)
VCC(reset)
VCC(OVP)
16 18
8.2 8.8
8–
3.5 4.5
26 28
VCC(off) noise filter
VCC(reset) noise filter−
Startup current
Startup current in fault mode
Supply Current
Device Disabled/Fault
Device Enabled/No output load on pin 5
Device Switching (Fsw = 65 kHz)
VCC > VCC(off)
Fsw = 65 kHz
CDRV = 470 pF,
Fsw = 65 kHz
tVCC(off)
tVCC(reset)
ICC(start)
ICC(sFault)
ICC1
ICC2
ICC3
–5
– 20
– 13
– 46
0.8 1.2
– 2.3
– 2.7
CURRENT SENSE
Maximum Internal current limit
Leading Edge
(Tj = −25°C to
Blanking
125°C)
Duration
for
VILIM
VILIM
tLEB
0.95 1
250 300
Leading Edge
(Tj = −40°C to
Blanking
125°C)
Duration
for
VILIM
tLEB 240 300
Input Bias Current
Propagation delay from current detection to gate off−state
Threshold for immediate fault protection activation
Leading Edge Blanking Duration for VCS(stop)
Blanking time for CS to GND short detection VpinVIN = 1 V
Blanking time for CS to GND short detection VpinVIN = 3.3 V
GATE DRIVE
DRV high
Ibias
tILIM
VCS(stop)
tBCS
tCS(blank1)
tCS(blank2)
– 0.02
– 50
1.35 1.5
– 120
6–
2–
Drive Resistance
DRV Sink
DRV Source
RSNK
RSRC
– 13
– 30
Drive current capability
DRV Sink (Note 4)
DRV Source (Note 4)
Rise Time (10% to 90%)
Fall Time (90% to 10%)
DRV Low Voltage
DRV High Voltage
4. Guaranteed by design
5. OTP triggers when RNTC = 4.7 kW
CDRV = 470 pF
CDRV = 470 pF
VCC = VCC(off)+0.2 V
CDRV = 470 pF,
RDRV = 33 kW
CDVRCVC==43700
V
pF,
RDRV = 33 kW
ISNK
ISRC
tr
tf
VDRV(low)
VDRV(high)
– 500
– 300
– 40
– 30
8–
10 12
Max Unit
V
20
9.4
–
5.5
30 V
– ms
–
30 mA
60 mA
mA
1.4
4.0
5.0
1.05 V
350 ns
350 ns
– mA
150 ns
1.65 V
– ns
12 ms
4 ms
W
–
–
mA
–
–
– ns
– ns
–V
14 V
http://onsemi.com
5
5 Page 
NCL30082
TYPICAL CHARACTERISTICS
49.0
48.5
48.0
47.5
47.0
46.5
46.0
45.5
45.0
44.5
44.0
−40 −20 0 20 40 60 80 100 120
TJ, JUNCTION TEMPERATURE (°C)
Figure 21. VREF(on) vs. Junction Temperature
2.400
2.395
2.390
2.385
2.380
2.375
2.370
−40 −20 0 20 40 60 80 100 120
TJ, JUNCTION TEMPERATURE (°C)
Figure 22. VHL vs. Junction Temperature
2.300
2.295
2.290
2.285
2.280
2.275
2.270
−40 −20 0 20 40 60 80 100 120
TJ, JUNCTION TEMPERATURE (°C)
Figure 23. VLL vs. Junction Temperature
28.0
27.5
27.0
26.5
26.0
−40 −20 0 20 40 60 80 100 120
TJ, JUNCTION TEMPERATURE (°C)
Figure 24. tHL(BLANK) vs. Junction Temperature
187.0
186.5
186.0
185.5
185.0
184.5
184.0
−40 −20 0 20 40 60 80 100
TJ, JUNCTION TEMPERATURE (°C)
Figure 25. VVLY1−2/2−3 vs. Junction
Temperature
120
198
197
196
195
194
193
192
191
−40 −20 0 20 40 60 80 100
TJ, JUNCTION TEMPERATURE (°C)
Figure 26. VVLY2−1/3−2 vs. Junction
Temperature
120
http://onsemi.com
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