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Número de pieza | HC125 | |
Descripción | Quad buffer/line driver; 3-state | |
Fabricantes | NXP Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HC125 (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
No Preview Available ! INTEGRATED CIRCUITS
DATA SHEET
74AHC125; 74AHCT125
Quad buffer/line driver; 3-state
Product specification
Supersedes data of 1999 Jan 11
File under Integrated Circuits, IC06
1999 Sep 27
1 page Philips Semiconductors
Quad buffer/line driver; 3-state
Product specification
74AHC125; 74AHCT125
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
VI
VO
Tamb
DC supply voltage
input voltage
output voltage
operating ambient temperature
range
tr,tf (∆t/∆f) input rise and fall rates
CONDITIONS
74AHC
74AHCT
UNIT
MIN. TYP. MAX. MIN. TYP. MAX.
2.0 5.0 5.5 4.5 5.0 5.5 V
0 − 5.5 0 − 5.5 V
0 − VCC 0 − VCC V
see DC and AC −40 +25 +85 −40 +25 +85 °C
characteristics per −40 +25 +125 −40 +25 +125 °C
device
VCC = 3.3 V ±0.3 V − − 100 − − − ns/V
VCC = 5 V ±0.5 V − − 20 − − 20
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V).
SYMBOL
PARAMETER
CONDITIONS
VCC DC supply voltage
VI input voltage range
IIK DC input diode current
VI < −0.5 V; note 1
IOK DC output diode current
VO < −0.5 V or VO > VCC + 0.5 V; note 1
IO DC output source or sink current −0.5 V < VO < VCC + 0.5 V
ICC DC VCC or GND current
Tstg storage temperature range
PD power dissipation per package for temperature range: −40 to +125 °C; note 2
MIN. MAX. UNIT
−0.5 +7.0 V
−0.5 +7.0 V
− −20 mA
− ±20 mA
− ±25 mA
− ±75 mA
−65 +150 °C
− 500 mW
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.
1999 Sep 27
5
5 Page Philips Semiconductors
Quad buffer/line driver; 3-state
Product specification
74AHC125; 74AHCT125
PACKAGE OUTLINES
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
y
Z
14
D
pin 1 index
1
e
EA
X
c
HE
vM A
8
A2
A1
7
bp
wM
Q
(A3)
A
Lp
L
detail X
θ
0 2.5 5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT max. A1 A2 A3 bp
c D(1) E(1) e
HE
L
Lp
Q
v
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
inches
0.069
0.010
0.004
0.057
0.049
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.050
0.244
0.228
0.041
0.039
0.016
0.028
0.024
0.01
w y Z (1)
0.25
0.01
0.1
0.7
0.3
0.004
0.028
0.012
θ
8o
0o
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT108-1
IEC
076E06S
REFERENCES
JEDEC
EIAJ
MS-012AB
EUROPEAN
PROJECTION
ISSUE DATE
95-01-23
97-05-22
1999 Sep 27
11
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet HC125.PDF ] |
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