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PDF 20A45C Data sheet ( Hoja de datos )

Número de pieza 20A45C
Descripción COLOR TELEVISION SERVICE MANUAL
Fabricantes Toshiba 
Logotipo Toshiba Logotipo



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No Preview Available ! 20A45C Hoja de datos, Descripción, Manual

FILE NO. 050-200519
(MFR’S VERSION A)
SERVICE MANUAL
COLOR TELEVISION
20A45C
DOCUMENT CREATED IN JAPAN, April, 2005

1 page




20A45C pdf
GENERAL SPECIFICATIONS
G-1 TV
System
CRT
Color System
Speaker
G-2 Tuning
System
G-3 Power
Sound Output
NTSC3.58+4.43 /PAL60Hz
Broadcasting System
Tuner and
Receive CH
Intermediate
Frequency
Preset CH
Stereo/Dual TV Sound
Tuner Sound Muting
Power Source
Power Consumption
G-4 Regulation
Protector
G-5 Temperature
G-6 Operating Humidity
CRT Size / Visual Size
CRT Type
Magnetic Field BV/BH
Position
Size
Impedance
MAX
10%(Typical)
System
Destination
CH Coverage
Picture(FP)
Sound(FS)
FP-FS
AC
DC
Stand by (at AC)
Per Year
Power Fuse
Safety
Radiation
X-Radiation
Operation
Storage
at AC
20 inch / 508.0mmV
Normal
+0.45G/0.18G
NTSC
2Speaker
Front
2 x 4.7 Inch
8 ohm
2.5+2.5 W
-W
No
US System M
1Tuner
USA(W/ CABLE)
2 - 69, 4A, A-5 - A-1,
A - I, J - W, W+1 - W+84
45.75MHz
41.25MHz
4.50MHz
No
Yes
Yes
120V AC 60Hz
90 W at AC 120 V 60 Hz
5 W at AC 120 V 60 Hz
-- kWh/Year
Yes
CSA
IC
HWC
+5oC ~ +40oC
-20oC ~ +60oC
Less than 80% RH
A3-1

5 Page





20A45C arduino
DISASSEMBLY INSTRUCTIONS
2. REMOVAL AND INSTALLATION OF
FLAT PACKAGE IC
REMOVAL
1. Put Masking Tape (cotton tape) around the Flat Package
IC to protect other parts from any damage.
(Refer to Fig. 2-1.)
NOTE
Masking is carried out on all the parts located within 10
mm distance from IC leads.
3. When IC starts moving back and forth easily after
desoldering completely, pickup the corner of the IC using a
tweezers and remove the IC by moving with the IC
desoldering machine. (Refer to Fig. 2-3.)
NOTE
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC leads
or solder lands under the IC when removing it.
Blower type IC
desoldering
machine
Masking Tape
(Cotton Tape)
IC
Tweezers
Fig. 2-1
2. Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 2-2.)
NOTE
Do not rotate or move the IC back and forth , until IC
can move back and forth easily after desoldering the
leads completely.
Blower type IC
desoldering machine
IC
Fig. 2-3
4. Peel off the Masking Tape.
5. Absorb the solder left on the pattern using the Braided
Shield Wire. (Refer to Fig. 2-4.)
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
Braided Shield Wire
Soldering Iron
IC
Fig. 2-2
IC pattern
Fig. 2-4
B2-1

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