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PDF HIP2122 Data sheet ( Hoja de datos )

Número de pieza HIP2122
Descripción High Frequency Half-Bridge Drivers
Fabricantes Intersil Corporation 
Logotipo Intersil Corporation Logotipo



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No Preview Available ! HIP2122 Hoja de datos, Descripción, Manual

100V, 2A Peak, High Frequency Half-Bridge Drivers with
Rising Edge Delay Timer
HIP2122, HIP2123
The HIP2122 and HIP2123 are 100V, high frequency, half-bridge
MOSFET driver ICs. They are based on the popular ISL2100A and
ISL2101A half-bridge drivers. Like the ISL2100A, two logic
inputs, LI and HI, control both bridge outputs, LO and HO. All logic
inputs are VDD tolerant.
These drivers have a programmable dead-time to insure
break-before-make operation between the high-side and low-side
drivers. The dead-time is adjustable up to 220ns. The internal
logic does not prevent both outputs from turning on
simultaneously if both inputs are high simultaneously for a time
greater than the programmed delay.
A single PWM logic input controls both bridge outputs (HO, LO).
An enable pin (EN), when low, drives both outputs to a low state.
All logic inputs are VDD tolerant and the HIP2122 has CMOS
inputs with hysteresis for superior operation in noisy
environments.
The HIP2122 has hysteretic inputs with thresholds that are
proportional to VDD. The HIP2123 has 3.3V logic/TTL compatible
inputs.
Two package options are provided. The 10 lead 4x4 DFN package
has standard pinouts. The 9 lead 4x4 DFN package omits pin 2 to
comply with 100V conductor spacing per IPC-2221.
Features
• 9 Ld TDFN “B” Package Compliant with 100V Conductor
Spacing Guidelines per IPC-2221
• Break-Before-Make Dead-Time Prevents Shoot-through and is
adjustable up to 220ns
• Bootstrap Supply Max Voltage to 114VDC
• Wide Supply Voltage Range (8V to 14V)
• Supply Undervoltage Protection
• CMOS Compatible Input Thresholds with Hysteresis (HIP2122)
• 1.6Ω/1Ω Typical Output Pull-up/Pull-down Resistance
• On-Chip 1Bootstrap Diode
Applications
• Telecom Half-Bridge DC/DC Converters
• UPS and Inverters
• Motor Drives
• Class-D Amplifiers
• Forward Converter with Active Clamp
Related Literature
FN7668, HIP2120, HIP2121 “100V, 2A Peak, High Frequency
Half-Bridge Drivers with Adjustable Dead Time Control and
PWM Input”
HALF
BRIDGE
PWM
CONTROLLER
HIP2122, HIP2123
VDD
HB
HI
LI
RDT
HO
HS
VSS
EPAD
LO
100V MAX
SECONDARY
CIRCUITS
FEEDBACK
WITH
ISOLATION
FIGURE 1. TYPICAL APPLICATION
200
160
140
120
100
80
60
40
20
8 16 24 32 40 48 56 64
RDT (k)
FIGURE 2. DEAD-TIME vs TIMING RESISTOR
80
December 23, 2011
FN7670.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Copyright Intersil Americas Inc. 2011. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.

1 page




HIP2122 pdf
HIP2122, HIP2123
Absolute Maximum Ratings
Supply Voltage, VDD, VHB - VHS (Notes 5, 6) . . . . . . . . . . . . . . . -0.3V to 18V
LI and HI Input Voltage (Note 6) . . . . . . . . . . . . . . . . . . .-0.3V to VDD + 0.3V
Voltage on LO (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD + 0.3V
Voltage on HO (Note 6) . . . . . . . . . . . . . . . . . . . . . VHS - 0.3V to VHB + 0.3V
Voltage on HS (Continuous) (Note 6) . . . . . . . . . . . . . . . . . . . . . -1V to 110V
Voltage on HB (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118V
Average Current in VDD to HB Diode . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Maximum Recommended Operating
Conditions
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V to 14V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 100V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . .(Repetitive Transient) -5V to 105V
Voltage on HB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VHS + 8V to VHS + 14V and
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD - 1V to VDD + 100V
HS Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <50V/ns
Thermal Information
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
10 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . .
42
4
9 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . . .
42
4
Max Power Dissipation at +25°C in Free Air
10 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0W
9 Ld TDFN (Notes 7, 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1W
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-55°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
ESD Ratings
Human Body Model Class 2 (Tested per JESD22-A114E). . . . . . . . . . 3000V
Machine Model Class B (Tested per JESD22-A115-A). . . . . . . . . . . . . . 300V
Charged Device Model Class IV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. The HIP2122 and HIP2123 are capable of derated operation at supply voltages exceeding 14V. Figure 20 shows the high-side voltage derating curve
for this mode of operation.
6. All voltages referenced to VSS unless otherwise specified.
7. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
8. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications VDD = VHB = 12V, VSS = VHS = 0V, RDT = 0K, PWM= 0V, No Load on LO or HO, Unless Otherwise Specified.
Boldface limits apply over the operating temperature range, -40°C to +125°C.
PARAMETERS
SYMBOL
TEST CONDITIONS
TA = +25°C
TA = -40°C to +125°C
MIN TYP MAX MIN (Note 9) MAX (Note 9) UNITS
SUPPLY CURRENTS
VDD Quiescent Current
VDD Operating Current
Total HB Quiescent Current
Total HB Operating Current
HB to VSS Current, Quiescent
HB to VSS Current, Operating
INPUT PINS
IDD80
IDD8k
IDDO80k
IDDO8k
IHB
IHBO
IHBS
IHBSO
RDT = 80k
RDT = 8k
f = 500kHz, RDT = 80k
f = 500kHz, RDT = 8k
LI = HI = 0V
f = 500kHz
LI = HI = 0V; VHB = VHS = 114V
f = 500kHz; VHB = VHS = 114V
- 470 850
- 1.0 2.1
- 2.5 3
- 3.4 4
- 65 115
- 2.0 2.5
- 0.05 1.5
- 1.2 1.5
-
-
-
-
-
-
-
-
900 µA
2.2 mA
3 mA
4 mA
150 µA
3 mA
10 µA
1.6 mA
Low Level Input Voltage
Threshold
VIL HIP2122 (CMOS)
3.7 4.4 -
2.7
-V
Low Level Input Voltage
Threshold
VIL HIP2123 (3.3V/TTL)
1.4 1.8 -
1.2
-V
High Level Input Voltage
Threshold
VIH HIP2122 (CMOS)
- 6.54 7.93
5.3
8.2 V
High Level Input Voltage
Threshold
VIH HIP2123 ((3.3V/TTL)
- 1.8 2.2
-
2.4 V
5 FN7670.0
December 23, 2011

5 Page





HIP2122 arduino
HIP2122, HIP2123
Functional Description
Functional Overview
The HIP2122/23 have independent control inputs, LI and HI, for
each output; LO and HO. When LI is low, LO is low and likewise,
when HI is low, HO is low. The output negative transitions occur
with minimal (and fixed) propagation delays.
The positive transitions of each output are delayed by the
programmed delay as set by RDT. With 80k, the delay is
nominally 25ns. With 8k, the delay is nominally 220ns. Resistors
values less than 8k and greater than 80k are not recommended.
The delay time as a function of RDT is approximately
tDT(ns) = 2/RDT.
Delaying the rising edge but not the falling edge of each output is
the technique that prevents shoot-thru. Please note that there is
no logic that prevents both outputs from being on if both inputs
are on simultaneously.
The enable pin, EN, when low, drives both outputs to a low state.
When the PWM input transitions, it is necessary to insure that
both bridge FETS are not on at the same time to prevent
shoot-through currents (break before make). The programmable
dead time forces both outputs to be off before either of the
bridge FETs is driven on. An 8kresistor connected between RDT
and VSS results in a nominal dead time of 250ns. An 80k
results with a minimum nominal dead time of 50ns. Resistors
values less than 8k and greater than 80k are not recommended.
Dead-time as a function of RDT is nominally tDT(ns) = 2/RDT.
The high-side driver bias is established by the boot capacitor
connected between HB and HS. The charge on the boot capacitor
is provided by the internal boot diode that is connected to VDD.
The current path to charge the boot capacitor occurs when the
low-side bridge FET is on. This charge current is limited in
amplitude by the inherent resistance of the boot diode and by the
drain-source voltage of the low-side FET. Assuming that the on
time of the low-side FET is sufficiently long to fully charge the
boot capacitor, the boot voltage will charge very close to VDD
(less the boot diode drop and the low-side FET on voltage).
When the HI input transitions high, the high-side bridge FET is
driven on after the delay time. Because the HS node is connected
to the source of the high-side FET, the HS node will rise almost to
the level of the bridge voltage (less the conduction voltage across
the bridge FET). Because the boot capacitor voltage is referenced
to the source voltage of the high-side FET, the HB node is VDD
volts above the HS node and the boot diode is reversed biased.
Because the high-side driver circuit is referenced to the HS node,
the HO output is now approximately VHB + VBRIDGE above
ground.
During the low to high transition of the HS node, the boot
capacitor sources the necessary gate charge to fully enhance the
high-side bridge FET gate. After the gate is fully charged, the boot
capacitor no longer sources the charge to the gate but continues
to provide bias current to the high-side driver. It is clear that the
charge of the boot capacitor must be substantially larger than
the required charge of the high-side FET and high-side driver
otherwise the boot voltage will sag excessively. If the boot
capacitor value is too small for the required maximum of on-time
of the high-side FET, the high-side UV lockout may engage
resulting with an unexpected operation.
Application Information
Selecting the Boot Capacitor Value
The boot capacitor value is chosen not only to supply the internal
bias current of the high-side driver but also, and more
significantly, to provide the gate charge of the driven FET without
causing the boot voltage to sag excessively. In practice, the boot
capacitor should have a total charge that is about 20 times the
gate charge of the driven power FET for approximately a 5% drop
in voltage after the charge has been transferred from the boot
capacitor to the gate capacitance.
The following parameters are required to calculate the value of
the boot capacitor for a specific amount of voltage droop. In this
example, the values used are arbitrary. They should be changed
to comply with the actual application.
VDD = 10V
VDD can be any value between 7 and 14VDC
VHB = VDD - 0.6V = VHO High side driver bias voltage (VDD - boot diode
voltage) referenced to VHS
Period = 1ms
This is the longest expected switching period
IHB = 100µA
Worst case high side driver current when
xHO = high
(this value is specified for VDD = 12V but the
error is not significant)
RGS = 100k
Gate-source resistor
(usually not needed)
Ripple = 5%
Desired ripple voltage on the boot capacitor
(larger ripple is not recommended)
Igate_leak = 100nA
Qgate80V = 64nC
From the FET vendor’s datasheet
From Figure 21
12
ID = 33A
10
VDS = 80V
VDS = 50V
8 VDS = 20V
6
4
2
0
0 10 20 30 40 50 60 70 80
QG TOTAL GATE CHARGE (nC)
FIGURE 21. TYPICAL GATE CHARGE OF A POWER FET
The following equations calculate the total charge required for
the Period. This equation assumes that all of the parameters are
constant during the period duration. The error is insignificant if
the ripple is small.
11 FN7670.0
December 23, 2011

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