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What is HB52E649E12-A6B?

This electronic component, produced by the manufacturer "Elpida Memory", performs the same function as "512 MB Registered SDRAM DIMM 64-Mword 72-bit/ 100 MHz Memory Bus/ 1-Bank Module (18 pcs of 64 M 4 Components) PC100 SDRAM".


HB52E649E12-A6B Datasheet PDF - Elpida Memory

Part Number HB52E649E12-A6B
Description 512 MB Registered SDRAM DIMM 64-Mword 72-bit/ 100 MHz Memory Bus/ 1-Bank Module (18 pcs of 64 M 4 Components) PC100 SDRAM
Manufacturers Elpida Memory 
Logo Elpida Memory Logo 


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HB52E649E12-A6B/B6B
512 MB Registered SDRAM DIMM
64-Mword × 72-bit, 100 MHz Memory Bus, 1-Bank Module
(18 pcs of 64 M × 4 Components)
PC100 SDRAM
E0020H20 (Ver. 2.0)
Aug. 20, 2001 (K)
Description
The HB52E649E12 belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been developed
as an optimized main memory solution for 8-byte processor applications. The HB52E649E12 is a 64M × 72
× 1-bank Synchronous Dynamic RAM Registered Module, mounted 18 pieces of 256-Mbit SDRAM
(HM5225405BTT) sealed in TSOP package, 1 piece of PLL clock driver, 2 pieces of register driver and 1
piece of serial EEPROM (2-kbit) for Presence Detect (PD). An outline of the HB52E649E12 is 168-pin
socket type package (dual lead out). Therefore, the HB52E649E12 makes high density mounting possible
without surface mount technology. The HB52E649E12 provides common data inputs and outputs.
Decoupling capacitors are mounted beside each TSOP on the module board.
Features
Fully compatible with : JEDEC standard outline 8-byte DIMM
: Intel PCB Reference design (Rev.1.2)
168-pin socket type package (dual lead out)
Outline: 133.37 mm (Length) × 43.18 mm (Height) × 4.00 mm (Thickness)
Lead pitch: 1.27 mm
3.3 V power supply
Clock frequency: 100 MHz (max)
LVTTL interface
Data bus width: × 72 ECC
Single pulsed RAS
4 Banks can operates simultaneously and independently
Burst read/write operation and burst read/single write operation capability
Programmable burst length: 1/2/4/8
2 variations of burst sequence
Sequential
Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd.

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HB52E649E12-A6B equivalent
HB52E649E12-A6B/B6B
Serial PD Matrix*1
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value Comments
0 Number of bytes used by 1 0 0 0 0 0 0 0 80 128
module manufacturer
1 Total SPD memory size
0 0 0 0 1 0 0 0 08
256 byte
2 Memory type
0 0 0 0 0 1 0 0 04
SDRAM
3 Number of row addresses bits 0 0 0 0 1 1 0 1 0D 13
4 Number of column addresses 0 0 0 0 1 0 1 1 0B 11
bits
5 Number of banks
0 0 0 0 0 0 0 1 01
1
6 Module data width
0 1 0 0 1 0 0 0 48
72 bit
7 Module data width (continued) 0 0 0 0 0 0 0 0 00 0 (+)
8 Module interface signal levels 0 0 0 0 0 0 0 1 01 LVTTL
9 SDRAM cycle time
(highest CE latency)
10 ns
1 0 1 0 0 0 0 0 A0
CL = 3
10
SDRAM access from Clock
0 1 1 0 0 0 0 0 60
(highest CE latency)
6 ns
*7
11 Module configuration type
0 0 0 0 0 0 1 0 02
ECC
12 Refresh rate/type
1 0 0 0 0 0 1 0 82
Normal
(7.8125 µs)
Self refresh
13 SDRAM width
0 0 0 0 0 1 0 0 04
64M × 4
14 Error checking SDRAM width 0 0 0 0 0 1 0 0 04
×4
15 SDRAM device attributes:
0 0 0 0 0 0 0 1 01
minimum clock delay for back-to-
back random column addresses
1 CLK
16 SDRAM device attributes:
Burst lengths supported
0 0 0 0 1 1 1 1 0F
1, 2, 4, 8
17 SDRAM device attributes:
0 0 0 0 0 1 0 0 04
number of banks on SDRAM
device
4
18 SDRAM device attributes:
CE latency
(-A6B)
0 0 0 0 0 1 1 0 06
2/3
(-B6B)
0 0 0 0 0 1 0 0 04
3
19 SDRAM device attributes:
S latency
0 0 0 0 0 0 0 1 01
0
20 SDRAM device attributes:
W latency
0 0 0 0 0 0 0 1 01
0
21 SDRAM device attributes
0 0 0 1 1 1 1 1 1F
Registered
Data Sheet E0020H20
5


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Featured Datasheets

Part NumberDescriptionMFRS
HB52E649E12-A6BThe function is 512 MB Registered SDRAM DIMM 64-Mword 72-bit/ 100 MHz Memory Bus/ 1-Bank Module (18 pcs of 64 M 4 Components) PC100 SDRAM. Elpida MemoryElpida Memory

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