DataSheetWiki


HCTS365D fiches techniques PDF

Intersil Corporation - Radiation Hardened Hex Buffer/Line Driver Non-Inverting

Numéro de référence HCTS365D
Description Radiation Hardened Hex Buffer/Line Driver Non-Inverting
Fabricant Intersil Corporation 
Logo Intersil Corporation 





1 Page

No Preview Available !





HCTS365D fiche technique
HCTS365MS
September 1995
Radiation Hardened
Hex Buffer/Line Driver Non-Inverting
Features
Pinouts
• 3 Micron Radiation Hardened CMOS SOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/
Bit-Day (Typ)
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Fanout (Over Temperature Range)
- Bus Driver Outputs: 15 LSTTL Loads
• Military Temperature Range: -55oC to +125oC
16 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T16, LEAD FINISH C
TOP VIEW
OE1 1
A1 2
Y1 3
A2 4
Y2 5
A3 6
Y3 7
GND 8
16 VCC
15 OE2
14 A6
13 Y6
12 A5
11 Y5
10 A4
9 Y4
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Input Current Levels Ii 5µA @ VOL, VOH
Description
The Intersil HCTS365MS is a Radiation Hardened non-
inverting hex buffer and line driver with Tri-state outputs. The
output enables (OE1 and OE2) control the three-state out-
puts. If either OE1 or OE2 is high the outputs will be in a
High impedance state. For Data, OE1 and OE2 must be
Low.
16 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP4-F16, LEAD FINISH C
TOP VIEW
OE1
A1
Y1
A2
Y2
A3
Y3
GND
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
VCC
OE2
A6
Y6
A5
Y5
A4
Y4
The HCTS365MS utilizes advanced CMOS/SOS technology
to achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family
Ordering Information
PART NUMBER
HCTS365DMSR
HCTS365KMSR
HCTS365D/Sample
HCTS365K/Sample
HCTS365HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
16 Lead SBDIP
16 Lead Ceramic Flatpack
16 Lead SBDIP
16 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
1
Spec Number 518637
File Number 3070.1

PagesPages 10
Télécharger [ HCTS365D ]


Fiche technique recommandé

No Description détaillée Fabricant
HCTS365D Radiation Hardened Hex Buffer/Line Driver Non-Inverting Intersil Corporation
Intersil Corporation
HCTS365DMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting Intersil Corporation
Intersil Corporation
HCTS365HMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting Intersil Corporation
Intersil Corporation
HCTS365K Radiation Hardened Hex Buffer/Line Driver Non-Inverting Intersil Corporation
Intersil Corporation

US18650VTC5A

Lithium-Ion Battery

Sony
Sony
TSPC106

PCI Bus Bridge Memory Controller

ATMEL
ATMEL
TP9380

NPN SILICON RF POWER TRANSISTOR

Advanced Semiconductor
Advanced Semiconductor


www.DataSheetWiki.com    |   2020   |   Contactez-nous  |   Recherche