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What is HCS74K?

This electronic component, produced by the manufacturer "Intersil Corporation", performs the same function as "Radiation Hardened Dual-D Flip-Flop with Set and Reset".


HCS74K Datasheet PDF - Intersil Corporation

Part Number HCS74K
Description Radiation Hardened Dual-D Flip-Flop with Set and Reset
Manufacturers Intersil Corporation　
Logo Intersil Corporation Logo　


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HCS74MS
September 1995
Radiation Hardened Dual-D
Flip-Flop with Set and Reset
Features
Pinouts
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm2/mg
• Single Event Upset (SEU) Immunity < 2 x 10-9 Errors/
Bit-Day (Typ)
• Dose Rate Survivability: >1 x 1012 RAD (Si)/s
• Dose Rate Upset >1010 RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55oC to +125oC
• Significant Power Reduction Compared to LSTTL ICs
14 LEAD CERAMIC DUAL-IN-LINE
METAL SEAL PACKAGE (SBDIP)
MIL-STD-1835 CDIP2-T14, LEAD FINISH C
TOP VIEW
R1N 1
D1 2
CP1 3
S1N 4
Q1 5
Q1N 6
GND 7
14 VCC
13 R2N
12 D2
11 CP2
10 S2N
9 Q2
8 Q2N
• DC Operating Voltage Range: 4.5V to 5.5V
• Input Logic Levels
- VIL = 30% of VCC Max
- VIH = 70% of VCC Min
• Input Current Levels Ii ≤ 5µA at VOL, VOH
Description
The Intersil HCS74MS is a Radiation Hardened positive
edge triggered flip-flop with set and reset.
The HCS74MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCS74MS is supplied in a 14 lead Ceramic flatpack
(K suffix) or a SBDIP Package (D suffix).
14 LEAD CERAMIC METAL SEAL
FLATPACK PACKAGE (FLATPACK)
MIL-STD-1835 CDFP3-F14, LEAD FINISH C
TOP VIEW
R1
D1
CP1
S1
Q1
Q1
GND
1 14
2 13
3 12
4 11
5 10
69
78
VCC
R2
D2
CP2
S2
Q2
Q2
Ordering Information
PART NUMBER
HCS74DMSR
HCS74KMSR
HCS74D/Sample
HCS74K/Sample
HCS74HMSR
TEMPERATURE RANGE
-55oC to +125oC
-55oC to +125oC
+25oC
+25oC
+25oC
SCREENING LEVEL
Intersil Class S Equivalent
Intersil Class S Equivalent
Sample
Sample
Die
PACKAGE
14 Lead SBDIP
14 Lead Ceramic Flatpack
14 Lead SBDIP
14 Lead Ceramic Flatpack
Die
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
83
Spec Number 518772
File Number 2142.2

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HCS74K equivalent
Specifications HCS74MS
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Quiescent Current
Output Current (Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage Current
Noise Immunity
Functional Test
CP to Q, Q
S to Q
S to Q
R to Q
R to Q
SYMBOL
(NOTES 1, 2)
CONDITIONS
ICC VCC = 5.5V, VIN = VCC or GND
IOL VCC = 4.5V, VIN = VCC or GND,
VOUT = 0.4V
IOH VCC = 4.5V, VIN = VCC or GND,
VOUT = VCC -0.4V
VOL
VCC = 4.5V and 5.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), IOL = 50µA
VOH
VCC = 4.5V and 5.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), IOH = -50µA
IIN VCC = 5.5V, VIN = VCC or GND
FN VCC = 4.5V, VIH = 0.70(VCC),
VIL = 0.30(VCC), (Note 3)
TPHL VCC = 4.5V
TPLH VCC = 4.5V
TPLH VCC = 4.5V
TPHL VCC = 4.5V
TPHL VCC = 4.5V
TPLH VCC = 4.5V
TEMPERATURE
+25oC
+25oC
200K RAD
LIMITS
MIN MAX UNITS
- 0.4 mA
4.0 - mA
+25oC
-4.0 - mA
+25oC
- 0.1 V
+25oC
+25oC
+25oC
VCC
-0.1
-
-
-
±5
-
V
µA
-
+25oC
+25oC
+25oC
+25oC
+25oC
+25oC
2 32 ns
2 31 ns
2 31 ns
2 32 ns
2 29 ns
2 30 ns
NOTES:
1. All voltages referenced to device GND.
2. AC measurements assume RL = 500Ω, CL = 50pF, Input TR = TF = 3ns, VIL = GND, VIH = VCC.
3. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
TABLE 5. BURN-IN AND OPERATING LIFE TEST, DELTA PARAMETERS (+25oC)
PARAMETER
GROUP B
SUBGROUP
DELTA LIMIT
ICC 5 6µA
IOL/IOH
5 -15% of 0 Hour
Spec Number 518772
87


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On this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for HCS74K electronic component.


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