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PDF NX7002AKS Data sheet ( Hoja de datos )
| Número de pieza | NX7002AKS | |
| Descripción | MOSFET ( Transistor ) | |
| Fabricantes | NXP Semiconductors | |
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NX7002AKS
60 V, dual N-channel Trench MOSFET
Rev. 1 — 1 March 2012
Product data sheet
1. Product profile
1.1 General description
Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small
SOT363 (SC-88) Surface-Mounted Device (SMD) plastic package using Trench MOSFET
technology.
1.2 Features and benefits
Very fast switching
Trench MOSFET technology
ESD protection
1.3 Applications
Relay driver
High-speed line driver
Low-side load switch
Switching circuits
1.4 Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Per transistor
VDS drain-source voltage
VGS gate-source voltage
ID drain current
Static characteristics
RDSon
drain-source on-state
resistance
Conditions
Tj = 25 °C
VGS = 10 V; Tamb = 25 °C
VGS = 10 V; ID = 100 mA; Tj = 25 °C
[1]
Min Typ Max Unit
--
-20 -
--
60 V
20 V
170 mA
- 3 4.5 Ω
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 1 cm2.
1 page  
NXP Semiconductors
NX7002AKS
60 V, dual N-channel Trench MOSFET
103
Zth(j-a)
(K/W)
102
10
duty cycle = 1
0.75
0.5
0.33 0.25
0.2
0.1
0.05
0.02
0.01
0
1
017aaa480
10-1
10-5
10-4
10-3
10-2
10-1
1
10 102 103
tp (s)
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103
Zth(j-a)
(K/W)
102
duty cycle = 1
0.75
0.33
0.2
0.5
0.25
0.1
0.05
10
0.01
0.02
0
017aaa481
1
10-1
10-5
10-4
10-3
10-2
FR4 PCB, mounting pad for drain 1 cm2
10-1
1
10 102 103
tp (s)
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
NX7002AKS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 March 2012
© NXP B.V. 2012. All rights reserved.
5 of 15
5 Page 
NXP Semiconductors
10. Soldering
NX7002AKS
60 V, dual N-channel Trench MOSFET
2.65
2.35 1.5 0.6 0.5
(4×) (4×)
0.4 (2×)
0.5 0.6
(4×) (2×)
0.6
(4×)
1.8
Fig 19. Reflow soldering footprint for SOT363 (TSSOP6)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot363_fr
1.5
4.5 0.3 2.5
1.5
1.3 1.3
2.45
5.3
Fig 20. Wave soldering footprint for SOT363 (TSSOP6)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot363_fw
NX7002AKS
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 1 March 2012
© NXP B.V. 2012. All rights reserved.
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