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PDF NTMFS4C13NT1G Data sheet ( Hoja de datos )

Número de pieza NTMFS4C13NT1G
Descripción Power MOSFET ( Transistor )
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No Preview Available ! NTMFS4C13NT1G Hoja de datos, Descripción, Manual

NTMFS4C13N
Power MOSFET
30 V, 38 A, Single NChannel, SO8 FL
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
CPU Power Delivery
DCDC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
C(Nuortreen1t)RqJA
TA = 25°C
TA = 80°C
Power Dissipation
RqJA (Note 1)
Continuous Drain
C(Nuortreen1t)RqJA 10 s
TA = 25°C
TA = 25°C
TA = 80°C
Power Dissipation
RqJA 10 s (Note 1)
Continuous Drain
C(Nuortreen2t)RqJA
Steady
State
TA = 25°C
TA = 25°C
TA = 80°C
Power Dissipation
RqJA (Note 2)
Continuous Drain
C(Nuortreen1t)RqJC
TA = 25°C
TC = 25°C
TC =80°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain Current TA = 25°C, tp = 10 ms
Current Limited by Package
TA = 25°C
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source DV/DT
Single Pulse DraintoSource Avalanche
Energy (TJ = 25°C, VGS = 10 V, IL = 21 Apk,
L = 0.1 mH, RGS = 25 W) (Note 3)
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
VDSS
VGS
ID
PD
ID
PD
ID
PD
ID
PD
IDM
IDmax
TJ,
TSTG
IS
dV/dt
EAS
TL
30 V
±20 V
13.0 A
9.7
2.46 W
19.1 A
14.3
5.32 W
7.2 A
5.4
0.75 W
38 A
29
21.6 W
106
70
55 to
+150
19
7.0
22
A
A
°C
A
V/ns
mJ
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
3. This is the absolute maximum rating. Parts are 100% tested at TJ = 25°C,
VGS = 10 V, IL = 15 Apk, EAS = 11 mJ.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
9.1 mW @ 10 V
13.8 mW @ 4.5 V
D (58)
ID MAX
38 A
G (4)
S (1,2,3)
NCHANNEL MOSFET
MARKING
DIAGRAM
1
SO8 FLAT LEAD
CASE 488AA
STYLE 1
D
SD
S 4C13N
S AYWZZ
GD
D
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceabililty
ORDERING INFORMATION
Device
NTMFS4C13NT1G
Package
SO8 FL
(PbFree)
Shipping
1500 /
Tape & Reel
NTMFS4C13NT3G SO8 FL
(PbFree)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
November, 2013 Rev. 2
1
Publication Order Number:
NTMFS4C13N/D

1 page




NTMFS4C13NT1G pdf
NTMFS4C13N
TYPICAL CHARACTERISTICS
1000
900
800
700
600
500
400
300
200
100
0
0
Ciss
Coss
VGS = 0 V
TJ = 25°C
Crss
5 10 15 20 25
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
1000
100
VDD = 15 V
ID = 15 A
VGS = 10 V
tf
td(off)
tr
10 td(on)
1
1 10 100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
100
10 ms
10 100 ms
1 ms
1
0 V < VGS < 10 V
Single Pulse
0.1 TC = 25°C
RDS(on) Limit
Thermal Limit
0.01 Package Limit
0.01 0.1
1
10 ms
dc
10 100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
11
10 QT
9
8
7
6
5
4
Qgs
3
2
1
0
02
Qgd
46
TJ = 25°C
VDD = 15 V
VGS = 10 V
ID = 30 A
8 10 12 14 16
Qg, TOTAL GATE CHARGE (nC)
Figure 8. GatetoSource and
DraintoSource Voltage vs. Total Charge
30
VGS = 0 V
25
20
15
TJ = 125°C
TJ = 25°C
10
5
0
0.4 0.5 0.6 0.7 0.8 0.9 1.0
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
12
ID = 15 A
10
8
6
4
2
0
25 50 75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
http://onsemi.com
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