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PDF NTMFS4985NF Data sheet ( Hoja de datos )

Número de pieza NTMFS4985NF
Descripción Power MOSFET ( Transistor )
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No Preview Available ! NTMFS4985NF Hoja de datos, Descripción, Manual

NTMFS4985NF
Power MOSFET
30 V, 65 A, Single NChannel, SO8 FL
Features
Integrated Schottky Diode
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are PbFree and are RoHS Compliant
Applications
CPU Power Delivery
Synchronous Rectification for DCDC Converters
Low Side Switching
Telecom Secondary Side Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
C(Nuorrteen1t)RqJA
TA = 25°C
TA = 85°C
VDSS
VGS
ID
30
±20
23.9
17.2
Power Dissipation
RqJA (Note 1)
Continuous Drain
Current
10 sec
RqJA
v
TA = 25°C
TA = 25°C
TA = 85°C
PD
ID
3.04
36
26
Power Dissipation
RqJA, t v 10 sec
Continuous Drain
C(Nuorrteen2t)RqJA
Steady
State
TA = 25°C
TA = 25°C
TA = 85°C
PD
ID
7.0
17.5
12.6
Power Dissipation
RqJA (Note 2)
Continuous Drain
C(Nuorrteen1t)RqJC
TA = 25°C
TC = 25°C
TC = 85°C
PD
ID
1.63
65
47
Power Dissipation
RqJC (Note 1)
TC = 25°C PD 22.73
Pulsed Drain
Current
tp=10ms TA = 25°C
IDM
195
Current limited by package
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
TA = 25°C
IDmaxpkg
TJ,
TSTG
IS
dV/dt
100
55 to
+150
64
6
Single Pulse DraintoSource Avalanche
Energy (VDD = 50 V, VGS = 10 V, IL = 33 Apk,
L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
EAS
TL
54
260
Unit
V
V
A
W
A
W
A
W
A
W
A
A
°C
A
V/ns
mJ
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
3.4 mW @ 10 V
5.0 mW @ 4.5 V
ID MAX
65 A
NCHANNEL MOSFET
D (5, 6)
G
(4)
S (1, 2, 3)
1
SO8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
SD
S 4985NF
S AYWZZ
GD
D
4895NF = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
ZZ = Lot Traceability
ORDERING INFORMATION
Device
NTMFS4985NFT1G
Package
SO8FL
(PbFree)
Shipping
1500 /
Tape & Reel
NTMFS4985NFT3G SO8FL
5000 /
(PbFree) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
July, 2012 Rev. 2
1
Publication Order Number:
NTMFS4985NF/D

1 page




NTMFS4985NF pdf
NTMFS4985NF
TYPICAL PERFORMANCE CURVES
2800
2600
2400
2200
2000
1800
1600
1400
1200
1000
800
600
400
200
0
0
VGS = 0 V
Ciss TJ = 25°C
Coss
Crss
5 10 15 20 25
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
10 QT
8
6
4 Qgs Qgd
ID = 30 A
2 TJ = 25°C
VDD = 15 V
VGS = 10 V
0
0 4 8 12 16 20 24 28 32
QG, TOTAL GATE CHARGE (nC)
Figure 8. GatetoSource and
DraintoSource Voltage vs. Total Charge
1000
100
VDD = 15 V
ID = 10 A
VGS = 10 V
10
td(off)
tf
tr
td(on)
1
1 10 100
1000
100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time
Variation vs. Gate Resistance
VGS = 20 V
Single Pulse
TC = 25°C
10 ms
10 100 ms
1 ms
1 10 ms
0.1
0.01
0.1
RDS(on) LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1 10
dc
100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
10.0
9.0 VGS = 0 V
8.0 TJ = 25°C
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
60
55 ID = 33 A
50
45
40
35
30
25
20
15
10
5
0
25 50 75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
http://onsemi.com
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