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PDF HCD-ZX6 Data sheet ( Hoja de datos )

Número de pieza HCD-ZX6
Descripción COMPONENT Hi-Fi STEREO SYSTEM SERVICE MANUAL
Fabricantes Sony　
Logotipo Sony Logotipo



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HCD-ZX6/ZX8
SERVICE MANUAL
Ver 1.1 2004. 09
E Model
• HCD-ZX6/ZX8 are the tuner,
deck, CD and amplifier
section in FST-ZX6/ZX8.
(Photo: HCD-ZX8)
Amplifier section
HCD-ZX8
Mexican models:
The following measured at AC 127 V, 60 Hz
DIN power output (rated):
140 × 2 + 140 × 2 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
180 × 2 + 180 × 2 watts
(6 ohms at 1 kHz, 10% THD)
Other models:
The following measured at AC 120, 220, 240 V, 50/60 Hz
DIN power output (rated):
140 × 2 + 140 × 2 watts
(6 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
180 × 2 + 180 × 2 watts
(6 ohms at 1 kHz, 10% THD)
HCD-ZX6
Mexican models:
The following measured at AC 127 V, 60 Hz
DIN power output (rated):
220 + 220 watts
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
280 + 280 watts
(4 ohms at 1 kHz, 10% THD)
CD
Section
TAPE
Section
Model Name Using Similar Mechanism
CD Mechanism Type
Base Unit Name
Optical Pick-up Name
Model Name Using Similar Machanism
Tape Mechanism Type
NEW
CDM79B-F1BD81
BU-F1BD81A
KSM-215DCP/C2RP
HCD-GN880
CWM43RR35
SPECIFICATIONS
Other models:
The following measured at AC 120, 220, 240 V, 50/60 Hz
DIN power output (rated):
220 + 220 watts
(4 ohms at 1 kHz, DIN)
Continuous RMS power output (reference):
280 + 280 watts
(4 ohms at 1 kHz, 10% THD)
Inputs
PHONO IN (phono jack):
sensitivity 3 mV,
impedance 47 kOhms
MIC (phone jack):
sensitivity 1 mV,
impedance 10 kOhms
GAME INPUT AUDIO L/R (phono jacks):
sensitivity 250 mV,
impedance 47 kOhms
GAME INPUT VIDEO (phono jack):
1 Vp-p, 75ohms
VIDEO/MD IN L/R (phono jacks):
sensitivity 250 mV/450 mV,
impedance 47 kOhms
– Continued on next page –
COMPONENT Hi-Fi STEREO SYSTEM
9-879-083-02
2004I04-1
© 2004. 09
Sony Corporation
Audio Group
Published by Sony Engineering Corporation
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HCD-ZX6 pdf
HCD-ZX6/ZX8
TABLE OF CONTENTS
1. SERVICE NOTE
1-1. Service Position of CD BU Block ....................................... 6
1-2. Service Position of TC Mechanism, Panel Board ............... 7
1-3. Service Position of Power Board ........................................ 8
1-4. Service Position of CD Changer ......................................... 8
2. GENERAL
List of Button Locations and Reference Pages ........................ 9
3. DISASSEMBLY
3-1. Case ................................................................................... 13
3-2. Loading Panel .................................................................... 13
3-3. Front Panel Section ........................................................... 14
3-4. Tape Mechanism ............................................................... 14
3-5. Game-in/hp Board, Mic Board .......................................... 15
3-6. Back Panel Section ............................................................ 15
3-7. CD Mechanism Section ..................................................... 16
3-8. Main Board ....................................................................... 17
3-9. Table Assy ......................................................................... 17
3-10. SE-130 Board .................................................................... 18
3-11. TD Belt .............................................................................. 18
3-12. DC Motor (M901) ............................................................. 19
3-13. Optical Pick-up ................................................................. 19
3-14. BD81A Board ................................................................... 20
4. TEST MODE ..................................................................... 21
5. MECHANICAL ADJUSTMENTS ............................... 25
6. ELECTRICAL ADJUSTMENTS ................................. 25
7. DIAGRAMS
7-1. Circuit Boards Location .................................................... 29
7-2. Note for Printed Wiring Boards
and Schematic Diagrams .................................................. 29
7-3. Waveforms ......................................................................... 29
7-4. Printed Wiring Board –BD Section– ................................. 30
7-5. Schematic Diagram –BD Section– .................................... 31
7-6. Printed Wiring Boards –Loading Section– ....................... 32
7-7. Schematic Diagram –Loading Section– ............................ 33
7-8. Schematic Diagram –Main Section (1/4)– ........................ 34
7-9. Schematic Diagram –Main Section (2/4)– ........................ 35
7-10. Schematic Diagram –Main Section (3/4)– ........................ 36
7-11. Schematic Diagram –Main Section (4/4)– ........................ 37
7-12. Printed Wiring Board –Main Section– .............................. 38
7-13. Printed Wiring Boards –Power Section– ........................... 39
7-14. Schematic Diagram –Power Section (1/2)– ...................... 40
7-15. Schematic Diagram –Power Section (2/2)– ...................... 41
7-16. Printed Wiring Board –Panel Section– .............................. 42
7-17. Schematic Diagram –Panel Section– ................................ 43
7-18. Printed Wiring Boards –Volume Section– ........................ 44
7-19. Printed Wiring Board –Mic Section– ................................ 45
7-20. Schematic Diagram –Volume, Mic Section– .................... 46
7-21. Schematic Diagram –Switch Section– .............................. 47
7-22. Printed Wiring Boards –Switch Section (1/2)– ................. 48
7-23. Printed Wiring Boards –Switch Section (2/2)– ................. 49
7-24. Printed Wiring Boards –Jack Section– .............................. 50
7-25. Schematic Diagram –Jack Section– .................................. 51
7-26. Printed Wiring Board –Surround Section– ....................... 52
7-27. Schematic Diagram –Surround Section– .......................... 53
7-28. Printed Wiring Boards –Transformer Section– ................. 54
7-29. Schematic Diagram –Transformer Section– ..................... 55
7-30. IC Block Diagrams ............................................................ 56
7-31. IC Pin Descriptions ........................................................... 57
8. EXPLODED VIEWS
8-1. Back Panel Section ............................................................ 65
8-2. Front Panel Section (1) ...................................................... 66
8-3. Front Panel Section (2) ...................................................... 67
8-4. Chassis Section ................................................................. 68
8-5. CD Mechanism Section (1) ............................................... 69
8-6. CD Mechanism Section (2) ............................................... 70
9. ELECTRICAL PARTS LIST ........................................ 71
5

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