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PDF NVD3055-094 Data sheet ( Hoja de datos )
| Número de pieza | NVD3055-094 | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD3055-094, NVD3055-094
Power MOSFET
12 A, 60 V, N−Channel DPAK / IPAK
Designed for low voltage, high speed switching applications in power
supplies, converters and power motor controls and bridge circuits.
Features
• Lower RDS(on)
• Lower VDS(on)
• Lower and Tighter VSD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
• NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
ID
ID
IDM
PD
TJ, Tstg
60
60
"20
"30
Vdc
Vdc
Vdc
12
10
45
48
0.32
2.1
1.5
−55 to
+175
Adc
Apk
W
W/°C
W
W
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, L = 1.0 mH
IL(pk) = 11 A, VDS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
RqJC
RqJA
RqJA
TL
61 mJ
3.13 °C/W
71.4
100
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommen-
ded Operating Conditions is not implied. Extended exposure to stresses above
the Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in. pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
94 mW
ID MAX
12 A
N−Channel
D
G
S
MARKING
DIAGRAMS
4
Drain
4 DPAK
12
3
CASE 369C
STYLE 2
1
Gate
2
Drain
3
Source
1 23
4
IPAK
CASE 369D
STYLE 2
4
Drain
12 3
Gate Drain Source
55094
Y
WW
G
= Device Code
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering andshipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2013
April, 2013 − Rev. 8
1
Publication Order Number:
NTD3055−094/D
http://www.Datasheet4U.com
1 page  
NTD3055−094, NVD3055−094
12
10
8
Q1
6
QT
Q2
VGS
4
2
ID = 12 A
TJ = 25°C
0
0 21 4 6 81 0
QG, TOTAL GATE CHARGE (nC)
2
Figure 8. Gate−To−Source and Drain−To−Source
Voltage versus Total Charge
100
tr
td(off)
10
tf
td(on)
VDS = 30 V
ID = 12 A
VGS = 10 V
1
1 10 100
RG, GATE RESISTANCE (OHMS)
Figure 9. Resistive Switching Time
Variation versus Gate Resistance
DRAIN−TO−SOURCE DIODE CHARACTERISTICS
16
14
VGS = 0 V
TJ = 25°C
12
10
8
6
4
2
0
0.6 0.68 0.76 0.84 0.92
VSD, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
1
Figure 10. Diode Forward Voltage versus Current
SAFE OPERATING AREA
The Forward Biased Safe Operating Area curves define
the maximum simultaneous drain −to−source voltage and
drain current that a transistor can handle safely when it is
forward biased. Curves are based upon maximum peak
junction temperature and a case temperature (TC) of 25°C.
Peak repetitive pulsed power limits are determined by using
the thermal response data in conjunction with the procedures
discussed in AN569, “T ransient Thermal Resistance −
General Data and Its Use.”
Switching between the of f−state and the on −state may
traverse any load line provided neither rated peak current
(IDM) nor rated voltage (V DSS) is exceeded and the
transition time (tr,tf) do not exceed 10ms. In addition the total
power averaged over a complete switching cycle must not
exceed (TJ(MAX) − TC)/(RqJC).
A Power MOSFET designated E−FET can be safely used
in switching circuits with unclamped inductive loads. For
reliable operation, the stored energy from circuit inductance
dissipated in the transistor while in avalanche must be less
than the rated limit and adjusted for operating conditions
differing from those specified. Although industry practice is
to rate in terms of energy, avalanche energy capability is not
a constant. The energy rating decreases non−linearly with an
increase of peak current in avalanche and peak junction
temperature.
Although many E −FETs can withstand the stress of
drain−to−source avalanche at currents up to rated pulsed
current (I DM), the ener gy rating is specified at rated
continuous current (ID), in accordance with industry custom.
The energy rating must be derated for temperature as shown
in the accompanying graph (Figure 12). Maximum energy at
currents below rated continuous ID can safely be assumed to
equal the values indicated.
http://onsemi.com
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