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PDF PC123F02J00F Data sheet ( Hoja de datos )
| Número de pieza | PC123F02J00F | |
| Descripción | DIP 4pin Reinforced Insulation Type Photocoupler | |
| Fabricantes | SHARP | |
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PC123N02J00F
Series
PC123N02J00F Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■ Description
PC123N02J00F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP , available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
■ Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at I
VCE=5V)
4. Several CTR ranks available
F=5 mA,
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5kV)
8. Lead-free and RoHS directive compliant
■ Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 file No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No. PC123)
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No. PC123)
6. Approved by FIMKO, EN60065, EN60950, (as model
No. PC123)
7. Recognized by CSA file No. CA95323 (as model No.
PC123)
8. Approved by VDE, DIN EN60747-5-2( ∗) (as an op-
tion), file No. 40008087 (as model No. PC123)
9. Package resin : UL flammability grade (94V - 0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■ Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of dif ferent po-
tentials and impedances
4. Over voltage detection
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARPin order to obtain the latest device specification sheets before using any SHARPdevice.
Sheet No.: D2-A09401EN
1 Date Sep. 1. 2006 http://www.Datasheet4U.com
© SHARP Corporation
1 page  
■ Absolute Maximum Ratings
Parameter
Forward current
*1 Peak forward current
Input
Reverse voltage
Power dissipation
Output
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Total power dissipation
*2 Isolation voltage
Operating temperature
Storage temperature
*2 Soldering temperature
*1 Pulse width≤100ms, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
Symbol
IF
IFM
VR
P
VCEO
VECO
IC
PC
Ptot
Viso(rms)
Topr
Tstg
Tsol
Rating
50
1A
6V
70
70
6V
50
150
200
5
−30 to +100
−55 to +125
260
(Ta=25̊C)
Unit
mA
mW
V
mA
mW
mW
kV
̊C
̊C
̊C
PC123N02J00F Series
■ Electro-optical Characteristics
Input
Output
Transfer
charac−
teristics
Parameter
Forward voltage
Reverse current
Terminal capacitance
Collector dark current
Collector-emitter breakdown voltage
Emitter-collector breakdown voltage
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
Response time
Rise time
Fall time
Symbol
VF
IR
Ct
ICEO
BVCEO
BVECO
IC
VCE(sat)
RISO
Cf
fC
tr
tf
Condition
IF=20mA
VR=4V
V=0, f=1kHz
VCE=50V, IF=0
IC=0.1mA, IF=0 70
IE=10μA, IF=0 6
IF=5mA, VCE=5V
IF=20mA, IC=1mA
DC500V, 40 to 60%RH
V=0, f=1MHz
VCE=5V, IC=2mA, RL=100Ω, −3dB
VCE=2V, IC=2mA, RL=100Ω
MIN.
−
−−
−
−−
2.5
−
5×1010
−
−
−
−
TYP.
1.2
30
−−
−−
−
0.1
1×1011
0.6
80
41
31
(Ta=25̊C)
MAX. Unit
1.4 V
10 μA
250 pF
100 nA
V
nA
20 mA
0.2 V
−Ω
1 pF
− kHz
8 μs
8 μs
Sheet No.: D2-A09401EN
5
5 Page 
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering :
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
(˚C)
300 Terminal : 260˚C peak
(package surface : 250˚C peak)
PC123N02J00F Series
200
100 Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
0 0 1 2 3 4 (min)
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the
below listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice
Other notice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
Sheet No.: D2-A09401EN
11
11 Page | ||
| Páginas | Total 16 Páginas | |
| PDF Descargar | [ Datasheet PC123F02J00F.PDF ] | |
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