NSHC271J16TRJ1F Datasheet PDF - NIC
| Part Number | NSHC271J16TRJ1F | |
| Description | Stacked Film Capacitor Chips | |
| Manufacturers | NIC | |
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Stacked Film Capacitor Chips
NSHC Series
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 0603, 0805, 1206, 1210, 1913 AND 2416 SIZES
• WIDE TEMPERATURE RANGE UP TO +125OC (100pF ~ 0.1μF)
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY AND VOLTAGE BIAS
CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Case Sizes
0603
0805
1206
1210
1913
2416
100pF ~ 0.0027μF 100pF ~ .01μF 3300pF ~ .047μF .012μF ~ .1μF .047μF ~ .1μF .12μF ~ .22μF
16Vdc (12Vrms), 50Vdc (40Vrms)
±5% Std, ±2% Opt.
-55°C ~ +125°C (0.12μF ~ 0.22μF voltage derated above +105°C)
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds or
175% of Rated Voltage for 5 Seconds (except 1913 and 2416 case sizes)
±3% ΔC Maximum Over Temperature Range
ENVIRONMENTAL CHARACTERISTICS
Life Test At +125°C
Capacitance Change
Within ±2% of Initial Value
1,000 Hours at 125% of
Dissipation Factor
0.68% Maximum
Rated Voltage
Insulation Resistance
1 Gigohm Minimum
Resistance to Soldering Heat
+260°C Peak
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Humidity Load Life:
(1) 1000 Hours, +40°C
(2) 500 Hours, +60°C
(3) 500 Hours +85°C/85% RH
Capacitance Change
Dissipation Factor
Insulation Resistance
(1) & (2) Within ±2% of Initial value (3) Within ±10% of initial value
(1) & (2) 0.90% Maximum (3) 1.2% maximum
(1) 1 Gigohm Minimum (2) 0.5 Gigohm Minimum (3) 0.01 Gigohm min.
Solderability with
25% Wt Rosin-Methanol Flux
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature
250 260°C
200
150
Cool Down
100
Time above 230°C
50 30 sec. max.
25 Ramp-up
25°C ~ 150°C
0 90 sec. max.
Pre-heat
150°C ~ 180°C
120 sec. max.
Time
Solder within 1 year. Storage at +30°C and 60% RH
RECOMMENDED LAND
PATTERN (mm)
Case Code EIA Size A B C
J1 0603 0.6 2.0 0.7
A1, A2
0805 0.8 2.4 1.1
B1, B2, B3
1206 1.8 3.6 1.4
C2, C3
1210 1.8 3.6 2.3
D5, D6
1913 3.0 5.6 3.0
E6, E7, E8
2416 4.0 7.0 3.8
A
B
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
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Stacked Film Capacitor Chips
NSHC 100V Series
FEATURES
• STACKED METALLIZED POLYPHENYLENE SULFIDE (PPS) FILM
• STANDARD EIA 1913, 2416, 2820 AND 2825 SIZES
• WIDE TEMPERATURE RANGE UP TO +105OC
• HIGH HEAT AND MOISTURE RESISTANT
• VERY STABLE TEMPERATURE, FREQUENCY, VOLTAGE, BIAS AND
nDIELECTRIC ABSORPTION CHARACTERISTICS
• SUITABLE FOR REFLOW SOLDERING
• TAPE AND REEL PACKAGING
NSHC IS
RECOMMENDED
FOR NEW DESIGNS
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
SPECIFICATIONS
Capacitance Range
Voltage Ratings
Capacitance Tolerance
Temperature Range
Dissipation Factor (20°C)
Insulation Resistance (20°C)
Dielectric Withstanding Voltage
Temperature Characteristic
Dielectric Absorption
1913
0.01 ~ 0.027μF
Case Sizes
2416
2820
0.033 ~ .068μF
0.082 ~ 0.12μF
100Vdc (40Vrms) max.
±5% Std, ±2% Opt.
-55°C ~ +105°C
0.6% max. @ 1KHz
3 Gigohms Minimum
150% of Rated Voltage 60 Seconds
±1% ΔC Maximum Over Temperature Range Typical
0.05 ~ 0.10% Typical
2825
0.015 ~ 0.22μF
ENVIRONMENTAL CHARACTERISTICS
Life Test At +105°C
Capacitance Change
Within ±2% of Initial Value
1,000 Hours at 125% of
Dissipation Factor
0.66% Maximum
Rated Voltage
Insulation Resistance
1 Gigohm Minimum
Resistance to Soldering Heat
+260°C Peak
Capacitance Change
Dissipation Factor
Insulation Resistance
Within ±3% of Initial Value
0.66% Maximum
1 Gigohm Minimum
Capacitance Change
Within ±3% of initial value
Humidity Load Life:
Dissipation Factor
0.90% maximum @ 1KHz
1000 Hours, +40°C/95% RH Insulation Resistance
1 Gigohm minimum
Dielectric Withstanding
130% of rated voltage for 60 seconds
Solderability with
25% Wt Rosin-Methanol Flux
90% Minimum Coverage After 2.5 Second Dip into 255°C Solder Pot
RECOMMENDED REFLOW PROFILE
(maximum 2 times)
300
Peak Temperature 260°C
250 +250°C 30 sec. max.
200
150
Cool Down
100
Time above 220°C
50 90 sec. max.
25 Ramp-up
25°C ~ 150°C
0 90 sec. max.
Pre-heat
150°C ~ 180°C
150 sec. max.
Time
Solder within 6 year. Storage at +35°C and 85% RH
RECOMMENDED LAND
PATTERN (mm)
EIA Size A B C
1913 2.6 6.6 3.0
2416 3.8 7.8 3.8
2820 4.5 9.0 4.6
2825 4.5 9.0 5.7
A
B
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for NSHC271J16TRJ1F electronic component. |
| Information | Total 6 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Download | [ NSHC271J16TRJ1F.PDF Datasheet ] | |
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