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PDF XC9401 Data sheet ( Hoja de datos )
| Número de pieza | XC9401 | |
| Descripción | Off-line Controllers | |
| Fabricantes | Torex Semiconductor | |
| Logotipo |  |
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XC9401 Series
Off-line Controllers for LED Lighting
ETR3201-006
■GENERAL DESCRIPTION
The XC9401 series are off-line controller ICs for LED lighting. Through optimization of the external components, these ICs
can be mad e to operate i n a rang e from 85VAC to 270VAC, as well as by DC input, and a diversit y of specifications can b e
achieved by selecting components appropriate for the circuit configuration. Fixed off-time control is used for the basic control
method, and by detecting the current that flows to the external power MOSFET, the current that flows to the LED is monitored
to provide a stable power supply for LED lighting. Two product series differing by function type are available, the XC9401A
type and the XC9401B type.
The circuit configuration of type A is designed for the power factor, achieving a high power factor by synchronizing the LED
current to the inp ut current (sine wave). In this circu it config uration, a high-c apacity, high- withstand volt age e lectrolytic
capacitor is not necessary after the bridge rectifier circuit from the AC input. The input filter removes high frequency switching
noise from the AC line, allowing a small-capacity ceramic capacitor to be used.
Type B ho lds the pe ak curre nt due to s witching that flo ws to the extern al po wer MOSF ET const ant, enabling the L ED
current to b e kept const ant. B y ke eping th e LED curr ent constant, this circuit configuration m akes it possible to achieve a
stable light source with high efficiency.
■APPLICATIONS
■TYPICAL APPLICATION CIRCUITS
●LED lights ( <=10W )
●LED lamps
●LED tube lights
●LED spot lights
●LED stands
(XC9401B605MR-G 100VAC Non-isolation buck Type)
100VAC
/110VAC
L1
1mH
BR1
B4S
R5
33kΩ
■FEATURES
Operating Voltage :
VDD Input Voltage Range :
Fixed Off-time
:
Protection Circuits :
Dimming :
85VAC ~ 270VAC
9V ~ 15V
6.0μs
Thermal Shutdown 150oC (TYP.)
VDD Over voltage protection, VDD=18V (TYP.)
UVLO, VDD=6.5V (TYP.)
Over current protection
VISEN=0.7V (TYP.)
PWM Dimming
C1
0.1μF/250V
+ C2
10μF/250V
NF
EN/DIM
R6
33kΩ
C3
10μF/25V
ZD1
12V
D1
RF071M2S
C4
1uF/100V
VDD
GATE
ISEN
GND
R7
20Ω
L2
3.3mH
Q1
IPD60R3K3C6
R3
2.2Ω
R4
JP
Package :
SOT-26
Operating
Ambient Temperature
: -40 oC ~ +85oC
Environmentally Friendly : EU RoHS Compliant, Pb Free
LED
20Series/110mA
■SOLUTION EXAMPLES
Input Voltage
Product Type Isolation / Non-Isolation Topology
Efficiency
Power Factor
100VAC / 110VAC XC9401B605MR
Non-Isolation
Buck
91%
0.6
XC9401B605MR 83%
220VAC / 240VAC
XC9401A605MR
Isolation Fl
yback
82% 0.9
0.6
220VAC / 240VAC XC9401B605MR
Non-Isolation
Buck
87%
0.6
DC / 12VAC
XC9401B605MR -
XC9401B605MR -
Buck
Buck-Boost
88%
86%
-
-
*Due to dispersion of constant values of external components, the above values may be deviated.
Please understand that the above are typical values. For details, refer to the XC9401 Series Application Notes.
1/19 http://www.Datasheet4U.com
1 page  
XC9401
Series
■ELECTRICAL CHARACTERISTICS
XC9401 Series, Type A
PARAMETER
SYMBOL
CONDITIONS
VDD Voltage Range
ISEN Voltage
VSINE Voltage Range (*2)
UVLO Detect Voltage
UVLO Release Voltage
UVLO Hysteresis Width
Supply Current (*5)
Stand-by Current (*6)
VDD Overvoltage Protection Voltage
VDD Overvoltage Protection
Release Voltage
VDD
VISEN
VSINE
VUVLO
VUVLOR
VUVLOH
IDD
ISTB
VOVP
VOVPR
9
VISEN=SWEEP (*1), VSINE =1V 0.2644
GND
VDD=SWEEP (*3) 5.5
VDD=SWEEP (*4) 6.5
VUVLOH=VUVLOR - VUVLO -
VDD=VEN/DIM=15V -
VDD=15V, VEN/DIM=GND,
VSINE=GND
VDD=SWEEP (*3) , VEN/DIM=VDD 17
VDD=SWEEP (*4), VEN/DIM=VDD 15.5
MIN.
TYP.
-
0.2783
-
6.5
7.5
1.1
250
- 225
18
16.5
MAX.
15
0.2922
1.8
7.5
8.5
-
300
280
19
17.5
UNITS
V
V
V
V
V
V
μA
μA
V
V
Ta=25 oC
CIRCUIT
①
①
①
①
①
①
①
①
①
①
VDD Overvoltage Protection
Hysteresis Width
VOVPH
VOVPH=VOVP - VOVPR -
1.5 -
V
①
VDD Overvoltage Protection
Discharge Current (*7)
IOVP VDD=19V -
30 - mA
①
GATE “H” ON Resistance
GATE “L” ON Resistance
OFF Time (*9)
Minimum ON Time
Current Limit Voltage (*10)
Thermal Shutdown Temperature (*11)
Thermal Shutdown Release
Temperature
Thermal Shutdown Hysteresis Width
PWM Dimmer Delay Time1 (*12)
PWM Dimmer Delay Time2 (*13)
EN/DIM “H” Voltage
EN/DIM “L” Voltage
EN/DIM Bias Current
RGATEH
RGATEL
tOFF
tONMIN
VLIM
TTSD
TTSDR
THYS
tPWMDIM1
tPWMDIM2
VEN/DIMH
VEN/DIML
IEN/DIMH
IGATE = -10mA
RGATEH = (VDD-VGATE) / IGATE
VISEN=1V, R1=300Ω
RGATEL= VGATE / IR1 (*8)
VISEN=0.4V, VSINE=1V -
VISEN=1V -
VISEN=SWEEP, VSINE=1.4V 0.65
-
-
VEN/DIM=2.2V to GND
VEN/DIM=GND to 2.2V
GND
VEN/DIM=15V -
2 58Ω
- 5-Ω
6 - μs
0.2 - μs
0.70
0.95
V
- 150 -
oC
130 -
oC
20 - oC
- 0.3 4.0 μs
100 140 200 μs
2.2 - 15.0 V
- 0.4 V
- 32 μA
③
④
①
①
①
①
①
①
②
②
①
①
①
Unless otherwise stated, GND standard, VDD=13V, VEN/DIM=VDD, VISEN=GND, VSINE=5.5V
(*1) ISEN pin voltage measured at start of GATE pin switching.
(*2) Indicates VSINE pin voltage at which OFF TIME 6μs switching becomes possible.
(*3) VDD pin voltage measured when GATE pin=L occurs.
(*4) VDD pin voltage measured when GATE pin=H occurs.
(*5) Indicates internal supply current when “H” level is input into EN/DIM pin and all circuits are activated. (When not switching.)
(*6) Indicates internal supply current when “L” level is input into EN/DIM pin and the switching circuit is stopped.
(*7) Indicates the current that discharges the capacitance between the VDD and GND pins at VOVP.
(*8) Please refer to P.7 “CIRCUIT④”.
(*9) May not be fixed at 6μs when UVLO is detected or during DIM signal control.
(*10) When the current limit voltage VLIM is exceeded, off time is extended to about 140μs to prevent element damage.
For details, refer to the operation description.
(*11) To protect the IC from thermal destruction, thermal shutdown activates when the chip temperature reaches 150oC and forcibly sets the GATE
pin voltage to “L”. When the chip temperature falls to 130oC, operation resumes.
(*12) Time from attainment of EN/DIM “L” voltage until GATE pin=L.
(*13) Time from attainment of EN/DIM “H” voltage until GATE pin=H.
5/19
5 Page 
XC9401
Series
■OPERATIONAL EXPLANATION (Continued)
<Over Current Limit>
When the switching current of the external power MOSFET is in th e over-current state and the ISEN pin voltage reaches 0.7V
(TYP.), L level voltage is output to the GA TE pin and the ex ternal po wer MOSFE T is turned off. In addition, the of f time is
temporarily extended from the normal 6.0 μs (TYP.) to 140μs (TYP.). When the I SEN pin voltage falls to 0.7V (T YP.) or less
after the extended off time, normal operation resumes.
When LED+ and LED- short circuit in the reference circuit shown in Fig.1, the current slope of the coil (L2) becomes smaller
during the off time than the slope during normal switching, which prevents sufficient discharge during the 6.0μs (TYP.) off time.
During the mi nimum on tim e, the e xternal power MOSFET Q1 always turns on, and th us the coil c urrent gradually increases.
The ISEN pin voltage becomes higher at the same time as the coil curre nt increases, and when the ISEN pin voltag e reaches
0.7V (TYP.), the off time is extended to 140μs (TYP.). (Refer to Fig.3)
Fig.3. Over Current Limit (Fig.1. Operation when LED+ and LED- short-circuit in the reference circuit)
<Under-voltage lockout circuit>
When the V DD pin voltage falls to the UVLO Detect Voltage (VUVLO) or lo wer, the GAT E pin volta ge is forcibl y s et to “L” to
prevent incorre ct pulse outp ut. W hen the V DD pin vo ltage rises to the UVLO Release Voltage (VUVLOR) or higher, s witching
resumes.
A UVLO stop simply stops pulse output; it is not a shutdown state and the internal circuitry continues to operate.
<VDD over-voltage protection circuit>
When the V DD pin v oltage ris es to the VDD Overvoltage Pr otection Volta ge (V OVP) or hi gher, the c harge of the c apacitance
between the VDD pin and GND pin is discharged by the resistance and transistor connected between the VDD pin and GND pin
in order to prevent withstand voltage destruction in the internal circuitry. The GATE pin voltage at this time is forcibly set to “L”.
When the VDD pin voltage falls to the VDD Overvoltage Protection Release Voltage (VOVPR) or lower, switching is resumed.
<Thermal shutdown>
To protect the IC from thermal destruction, thermal shutdown activates when the chip temperature reaches 150 oC (TYP.) and
forcibly sets the GATE pin voltage to “L”. When the chip temperature falls to 130 oC (TYP.), switching is resumed.
11/19
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet XC9401.PDF ] | |
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