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PDF NB3U23C Data sheet ( Hoja de datos )
| Número de pieza | NB3U23C | |
| Descripción | 1.2V Dual Channel CMOS Buffer - Translator | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NB3U23C
1.2 V Dual Channel CMOS
Buffer / Translator
Description
The NB3U23C is a 2−input, 2−output buffer/voltage translator for
UFS (Universal Flash Storage) in portable consumer applications such
as mobile phones, tablets, cameras, etc. This dual channel CMOS
buffer accepts 1.8 V CMOS input and translates it to 1.2 V CMOS
output. The device is powered using single supply of 1.2 V ±5%.
The NB3U23C is packaged in 2 ultra−small 6−pin packages: the 6
pin SC70 and a 6 pin thin UDFN package.
Features
• Operating Frequency: 52 MHz (Max)
• Propagation Delay: 5 ns (Max)
• Low Standby Current: < 10 mA at 1.2 V VDD
• Low Phase Noise Floor: −150 dBc/Hz (Typ)
• Rise/Fall Times (tr/tf): 2 ns (Max)
• ESD Protection Exceeds JEDEC Standards
♦ 2000 V Human−Body Model (JS−001−2012)
♦ 200 V Machine Model (JESD22−A115C)
♦ 1000 V Charged−Device Model (JESDC101E)
• Operating Supply Voltage Range (VDD): 1.2 V ±5%
• Operating Temperature Range (Industrial): −40°C to 85°C
• These are Pb−Free Devices
http://onsemi.com
MARKING
DIAGRAMS
6
SC−70
SQ SUFFIX
1 CASE 419B
23CMG
G
1
23C = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
UDFN6
MN SUFFIX
CASE 517CW
C = Device Code
M = Date Code
CM
VDD
IN1 1
5
1
6 OUT1
IN2 3 2
2
4 OUT2
GND
Figure 1. Simplified Logic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. 6
1
Publication Order Number:
NB3U23C/D
1 page  
NB3U23C
PACKAGE DIMENSIONS
E
2X
bbb H D
e
6X ccc C
SC−88/SC70−6/SOT−363
CASE 419B−02
ISSUE Y
D
A
2X
aaa H D
D
6 54
E1
L2
1 23
aaa C
2X 3 TIPS
H
L
DETAIL A
GAGE
PLANE
B
TOP VIEW
6X b
ddd M C A-B D
A2
A
DETAIL A
A1
SIDE VIEW
C
SEATING
PLANE
c
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A −−− −−− 1.10 −−− −−− 0.043
A1 0.00 −−− 0.10 0.000 −−− 0.004
A2 0.70 0.90 1.00 0.027 0.035 0.039
b 0.15 0.20 0.25 0.006 0.008 0.010
C 0.08 0.15 0.22 0.003 0.006 0.009
D 1.80 2.00 2.20 0.070 0.078 0.086
E 2.00 2.10 2.20 0.078 0.082 0.086
E1 1.15 1.25 1.35 0.045 0.049 0.053
e 0.65 BSC
0.026 BSC
L 0.26 0.36 0.46 0.010 0.014 0.018
L2 0.15 BSC
0.006 BSC
aaa 0.15
0.006
bbb 0.30
0.012
ccc 0.10
0.004
ddd 0.10
0.004
RECOMMENDED
SOLDERING FOOTPRINT*
6X
0.30
6X
0.66
2.50
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NB3U23C.PDF ] | |
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