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PDF EMSBC Data sheet ( Hoja de datos )
| Número de pieza | EMSBC | |
| Descripción | THIN FILM EMSBC SERIES | |
| Fabricantes | MSI | |
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Layout varies with value.
THIN FILM EMSBC SERIES
EMSBC SERIES
The EMSBC series back contact chip resistor offers a space-saving design in a 0.020" x 0.020" size that
requires only one wire bond. The chip backside provides the other contact with eutectic or conductive
epoxy attachment to the substrate. Wire bonding is made to the notched pad on top of the chip. EMSBC's
offer the high stability, low noise, and low T.C.R. of thin film while providing greater flexibility in hybrid
designs. Excellent for use in Vision Recognition Systems.
MECHANICAL DATA
SIZE
SUBSTRATE
RESISTOR
BOND PADS
BACKSIDE SURFACE
0.020" x 0.020" x 0.010" (±0.003")
SILICON
TANTALUM NITRIDE
15,000 Å ALUMINUM TYPICAL
(GOLD BOND PADS OPTIONAL)
GOLD; Suitable for eutectic or conductive epoxy bonding
ELECTRICAL DATA
RESISTANCE RANGE
TOLERANCES
T.C.R.
5Ω TO 1.2MΩ
0.05%, 0.1%, 0.25%, 0.5% 1%, 2%, 5%, 10% (RESISTOR VALUE DEPENDENT)
±250ppm STANDARD; ±100ppm Available ≥ 500Ω, ≤ 250KΩ
SERIES DATA
CURRENT NOISE
DIELECTRIC BREAKDOWN
INSULATION RESISTANCE
OPERATING VOLTAGE
POWER RATING
SHORT TERM OVERLOAD
HIGH TEMP EXPOSURE
THERMAL SHOCK
MOISTURE RESISTANCE
STABILITY
OPERATING TEMP RANGE
STRAY DISTRIBUTED
CAPACITANCE
SILICON
-35dB MAX. 100Ω TO 250KΩ TYPICAL
-20dB MAX. < 100Ω OR > 250KΩ
400 V MIN.
1012Ω MIN.
100 V MAX.
250 mW TOTAL (70°C DERATED LINEARLY TO 150°C) P = E2/R
5X RATED POWER, 25°C, 5 SEC., ±0.25% MAX. ∆R/R: ±0.1% MSI TYPICAL
150°C, 100 HRS., ±0.25% MAX. ∆R/R: ±0.03% MSI TYPICAL
MIL-STD 202, METHOD 107F, ±0.25% MAX. ∆R/R: ±0.1% MSI TYPICAL
MIL-STD 202, METHOD 106, ±0.5% MAX. ∆R/R: ±0.1% MSI TYPICAL
1000 HRS., 70°C, 100% POWER, ±0.5% MAX. ∆R/R: ±0.1% MSI TYPICAL
-55°C TO +125°C
2pF
PART NUMBER DESIGNATION
EMSBC 2
X
X
SERIES SUBSTRATE
RESISTIVE
FILM
S = Silicon
T = Tantalum
Nitride
XXXXX
OHMIC VALUE
X
TOLERANCE
5-Digit Number: 1st
4 Digits Are
Significant
With "R" As Decimal
Point When
required.
5th Digit Represents
Number of Zeros.
Q = 0.05%**
B = 0.10%**
C = 0.25%
D = 0.5%
F = 1%
G = 2%
J = 5%
K = 10%
X
OPTION
E = Aluminum
Bond Pads
Std.
F = ±100ppm/°C
G = Gold Bond
Pads Optional
EXAMPLES: EMSBC 2ST-10001F-E = 10KΩ, ±1% STANDARD T.C.R.
** Consult Sales for available values
MINI-SYSTEMS, INC.
THIN FILM DIVISION
20 DAVID ROAD, N. ATTLEBORO, MA 02760
508-695-0203 FAX: 508-695-6076
DCN TF 142-B-0306
Free Datasheet http://www.Datasheet-PDF.com/
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