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PDF IP4223CZ6 Data sheet ( Hoja de datos )
| Número de pieza | IP4223CZ6 | |
| Descripción | Dual USB 2.0 integrated ESD protection | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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IP4223CZ6
Dual USB 2.0 integrated ESD protection
Rev. 1 — 17 October 2011
Product data sheet
1. Product profile
1.1 General description
The IP4223CZ6 is designed to protect I/O lines sensitive to capacitive load, such as
USB 2.0, ethernet, Digital Video Interface (DVI) and so on, from damage due to
ElectroStatic Discharge (ESD). It incorporates four pairs of ultra low capacitance rail-to-rail
ESD protection diodes plus a Zener diode to provide protection to signal and supply
components from ESD voltages up to 8 kV contact discharge. Protection is supply
voltage independent due to the rail-to-rail diodes being connected to the Zener diode.
The device is encapsulated in a small 6-lead SOT457 (SC-74) Surface-Mounted
Device (SMD) plastic package.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
ESD protection up to 8 kV contact discharge; IEC 61000-4-2, level 4 compliant
Four pairs of ultra low input capacitance (C(I/O-GND) = 1.5 pF) ESD rail-to-rail protection
diodes
Low voltage clamping due to integrated Zener diode
Small 6-lead TSOP6 (SOT457) SMD package
1.3 Applications
General-purpose downstream ESD protection for high-frequency analog signal ports
and high-speed serial data transmission ports in:
Cellular phone and Personal Communication System (PCS) mobile handsets
PC/notebook USB 2.0/IEEE1394 ports
DVI
Cordless telephones
Wireless data (WAN/LAN) systems
Mobile Internet Devices (MID)
Portable Media Players (PMP)
High-Definition Multimedia Interface (HDMI)
Free Datasheet http://www.Datasheet-PDF.com/
1 page  
NXP Semiconductors
10. Soldering
IP4223CZ6
Dual USB 2.0 integrated ESD protection
3.45
1.95
0.95
3.3 2.825
0.95
0.45 0.55
(6×) (6×)
0.7
(6×)
0.8
(6×)
2.4
Fig 3. Reflow soldering footprint SOT457 (SC-74)
5.3
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sot457_fr
1.475
5.05
1.475
1.5
(4×)
0.45
(2×)
1.45
(6×)
2.85
Fig 4. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
sot457_fw
IP4223CZ6
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 October 2011
© NXP B.V. 2011. All rights reserved.
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| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet IP4223CZ6.PDF ] | |
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