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PDF SZESD7002 Data sheet ( Hoja de datos )
| Número de pieza | SZESD7002 | |
| Descripción | Low Capacitance ESD Protection Diode | |
| Fabricantes | ON Semiconductor | |
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ESD7002, SZESD7002
Transient Voltage
Suppressors
Low Capacitance ESD Protection Diode
for High Speed Data Line
The ESD7002 transient voltage suppressor is designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines. The flow−through style
package allows for easy PCB layout and matched trace lengths
necessary to maintain consistent impedance between high speed
differential lines such as USB 3.0 and HDMI.
Features
• Low Capacitance (0.3 pF Typical, I/O to GND)
• Diode capacitance matching
• Protection for the Following IEC Standards:
• IEC 61000−4−2 (Level 4)
• Low ESD Clamping Voltage
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Typical Applications
• USB2.0/3.0
• LVDS
• HDMI
• High Speed Differential Pairs
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ −55 to +125 °C
Storage Temperature Range
Tstg − 55 to +150 °C
Lead Solder Temperature −
Maximum (10 Seconds)
TL 260 °C
IEC 61000−4−2 Contact (ESD)
IEC 61000−4−2 Air (ESD)
ESD
ESD
±8 kV
±15 kV
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
MARKING
DIAGRAM
SC−70
CASE 419
STYLE 4
72 MG
G
1
72 = Specific Device Code
M = Date Code
G = Pb−Free Package
(*Note: Microdot may be in either location)
PIN CONFIGURATION
AND SCHEMATIC
Pin 1 Pin 2
Pin 3
=
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
January, 2014 − Rev. 3
1
Publication Order Number:
ESD7002/D
Free Datasheet http://www.datasheet4u.com/
1 page  
ESD7002, SZESD7002
Without ESD7002
With ESD7002
Figure 11. USB3.0 Eye Diagram with and without ESD7002 at 5 Gb/s
1
0.5
0
−0.5
−1
−1.5
−2
−2.5
−3
−3.5
−4
1.E+06
1.E+07
1.E+08
1.E+09
FREQUENCY (Hz)
Figure 12. Typical Insertion Loss
ORDERING INFORMATION
Device
Package
Shipping†
ESD7002WTT1G
SC−70
(Pb−Free)
3000 / Tape & Reel
SZESD7002WTT1G*
SC−70
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
http://onsemi.com
5
Free Datasheet http://www.datasheet4u.com/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SZESD7002.PDF ] | |
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