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Número de pieza HFA1105
Descripción 330MHz/ Low Power/ Current Feedback Video Operational Amplifier
Fabricantes Intersil Corporation 
Logotipo Intersil Corporation Logotipo



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HFA1105
September 1998
File Number 3395.6
330MHz, Low Power, Current Feedback
Video Operational Amplifier
The HFA1105 is a high speed, low power current feedback
amplifier built with Intersil’s proprietary complementary
bipolar UHF-1 process.
This amplifier features an excellent combination of low
power dissipation (58mW) and high performance. The slew
rate, bandwidth, and low output impedance (0.08) make
this amplifier a good choice for driving Flash ADCs.
Component and composite video systems also benefit from
this op amp’s excellent gain flatness, and good differential
gain and phase specifications. The HFA1105 is ideal for
interfacing to Intersil’s line of video crosspoint switches
(HA4201, HA4600, HA4314, HA4404, HA4344), to create
high performance, low power switchers and routers.
The HFA1105 is a low power, high performance upgrade for
the CLC406. For a comparable amplifier with output disable
or output limiting functions, please see the data sheets for
the HFA1145 and HFA1135 respectively.
For Military grade product, please refer to the HFA1145/883
data sheet.
Ordering Information
PART NUMBER
(BRAND)
HFA1105IP
TEMP.
RANGE (oC)
PACKAGE
-40 to 85 8 Ld PDIP
PKG. NO.
E8.3
HFA1105IB
(H1105I)
HFA11XXEVAL
-40 to 85 8 Ld SOIC
M8.15
DIP Evaluation Board for High Speed
Op Amps
Features
• Low Supply Current . . . . . . . . . . . . . . . . . . . . . . . . 5.8mA
• High Input Impedance . . . . . . . . . . . . . . . . . . . . . . . 1M
• Wide -3dB Bandwidth. . . . . . . . . . . . . . . . . . . . . . 330MHz
• Very Fast Slew Rate . . . . . . . . . . . . . . . . . . . . . . 1000V/µs
• Gain Flatness (to 75MHz) . . . . . . . . . . . . . . . . . . . . 0.1dB
• Differential Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.02%
• Differential Phase . . . . . . . . . . . . . . . . . . . . 0.03 Degrees
• Pin Compatible Upgrade for CLC406
Applications
• Flash A/D Drivers
• Video Switching and Routing
• Professional Video Processing
• Video Digitizing Boards/Systems
• Multimedia Systems
• RGB Preamps
• Medical Imaging
• Hand Held and Miniaturized RF Equipment
• Battery Powered Communications
Pinout
HFA1105
(PDIP, SOIC)
TOP VIEW
NC 1
-IN 2
+IN 3
V- 4
-
+
8 NC
7 V+
6 OUT
5 NC
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999

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HFA1105 pdf
HFA1105
overshoot (Note: Capacitive feedback will cause the same
problems due to the feedback impedance decrease at higher
frequencies). At higher gains, however, the amplifier is more
stable so RF can be decreased in a trade-off of stability for
bandwidth.
The table below lists recommended RF values for various
gains, and the expected bandwidth. For a gain of +1, a
resistor (+RS) in series with +IN is required to reduce gain
peaking and increase stability.
GAIN
(ACL)
-1
RF ()
425
BANDWIDTH
(MHz)
300
+1 510 (+RS = 510)
+2 510
270
330
+5 200
300
+10 180
130
Non-Inverting Input Source Impedance
For best operation, the DC source impedance seen by the
non-inverting input should be 50Ω. This is especially
important in inverting gain configurations where the non-
inverting input would normally be connected directly to GND.
Pulse Undershoot and Asymmetrical Slew Rates
The HFA1105 utilizes a quasi-complementary output stage to
achieve high output current while minimizing quiescent supply
current. In this approach, a composite device replaces the
traditional PNP pulldown transistor. The composite device
switches modes after crossing 0V, resulting in added
distortion for signals swinging below ground, and an
increased undershoot on the negative portion of the output
waveform (See Figures 5, 8, and 11). This undershoot isn’t
present for small bipolar signals, or large positive signals.
Another artifact of the composite device is asymmetrical slew
rates for output signals with a negative voltage component.
The slew rate degrades as the output signal crosses through
0V (See Figures 5, 8, and 11), resulting in a slower overall
negative slew rate. Positive only signals have symmetrical
slew rates as illustrated in the large signal positive pulse
response graphs (See Figures 4, 7, and 10).
PC Board Layout
The amplifier’s frequency response depends greatly on the
care taken in designing the PC board. The use of low
inductance components such as chip resistors and chip
capacitors is strongly recommended, while a solid
ground plane is a must!
Attention should be given to decoupling the power supplies.
A large value (10µF) tantalum in parallel with a small value
(0.1µF) chip capacitor works well in most cases.
Terminated microstrip signal lines are recommended at the
device’s input and output connections. Capacitance,
parasitic or planned, connected to the output must be
minimized, or isolated as discussed in the next section.
Care must also be taken to minimize the capacitance to
ground at the amplifier’s inverting input (-IN), as this
capacitance causes gain peaking, pulse overshoot, and if
large enough, instability. To reduce this capacitance, the
designer should remove the ground plane under traces
connected to
-IN, and keep connections to -IN as short as possible.
An example of a good high frequency layout is the
Evaluation Board shown in Figure 2.
Driving Capacitive Loads
Capacitive loads, such as an A/D input, or an improperly
terminated transmission line will degrade the amplifier’s
phase margin resulting in frequency response peaking and
possible oscillations. In most cases, the oscillation can be
avoided by placing a resistor (RS) in series with the output
prior to the capacitance.
Figure 1 details starting points for the selection of this
resistor. The points on the curve indicate the RS and CL
combinations for the optimum bandwidth, stability, and
settling time, but experimental fine tuning is recommended.
Picking a point above or to the right of the curve yields an
overdamped response, while points below or left of the curve
indicate areas of underdamped performance.
RS and CL form a low pass network at the output, thus limiting
system bandwidth well below the amplifier bandwidth of
270MHz (for AV = +1). By decreasing RS as CL increases (as
illustrated in the curves), the maximum bandwidth is obtained
without sacrificing stability. In spite of this, the bandwidth
decreases as the load capacitance increases. For example, at
AV = +1, RS = 62, CL = 40pF, the overall bandwidth is limited
to 180MHz, and bandwidth drops to 75MHz at AV = +1,
RS = 8, CL = 400pF.
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HFA1105 arduino
Die Characteristics
DIE DIMENSIONS:
59 mils x 59 mils x 19 mils
1500µm x 1500µm x 483µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
Metallization Mask Layout
-IN
HFA1105
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.5kÅ
TRANSISTOR COUNT:
75
SUBSTRATE POTENTIAL (Powered Up):
Floating
(Recommend Connection to V-)
HFA1105
NC
V+
OUT
+IN
V- NC
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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