PDF HLMP-6405A Data sheet ( Hoja de datos )

Número de pieza	HLMP-6405A
Descripción	SUBMINIATURE T-3/4 LED DIFFUSED and CLEAR LAMPS
Fabricantes	Fairchild Semiconductor
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No Preview Available ! SUBMINIATURE T-3/4 LED DIFFUSED and CLEAR LAMPS HIGH EFF. RED YELLOW GREEN AIGaAs RED HLMP-6305A HLMP-6405A HLMP-6505A HLMP-Q105A Water Clear Water Clear Water Clear Water Clear MV6700A MV6300A MV6400A HLMP-Q150A Red Diffused Yellow Diffused Green Diffused Red Diffused PACKAGE DIMENSIONS .024 (.6) .016 (.4) .276 (7.0) MIN .087 (2.2) .079 (2.0) .091 (2.3) .083 (2.1) FEATURES • Subminiature T-3/4 transfer molded • Low package profile • Axial leads • Wide viewing angle • SMT versions DIA .075 (1.9) .063 (1.6) .010 (.26) .002 (.06) .020 (.5) .012 (.3) .058 (1.48) .050 (1.28) .056 (1.44) .048 (1.24) .031 (.78) .023 (.58) CATHODE MARK (COLOR STRIPE ON SIDE OF PACKAGE) DESCRIPTION These T-3/4 subminiature LED lamps feature a square-base, transfer molded package for surface mount applications. A tinted diffused or water clear epoxy lens  available in AIGaAs red, high-efficiency red, green, and yellow  produces wide-angle beam emission and sharp on/off contrast. They are available with gullwing lead bends for top mounting, as well as yoke lead bends and Z-bends for mounting to the back of a PCB. NOTES: ALL DIMENSIONS ARE IN INCHES (mm). ABSOLUTE MAXIMUM RATING (TA =25°C) Parameter Power Dissipation Average Forward Current Peak Forward Current (1 µS pulsewidth, 0.1% DF) Lead Soldering Time at 260° C Operating Temperature Storage Temperature HLMP-6305A MV6700A 135 30 90 5 -55 to +100 -55 to +100 HLMP-6405A MV6300A 85 20 60 5 -55 to +100 -55 to +100 HLMP-6505A MV6400A 135 30 90 5 -50 to +100 -50 to +100 HLMP-Q105A HLMP-Q150A 85 30 300 5 -20 to +100 -20 to +100 UNITS mW mA mA sec °C °C  2001 Fairchild Semiconductor Corporation DS300000 2/27/01 1 OF 5 www.fairchildsemi.com 1 page SUBMINIATURE T-3/4 LED DIFFUSED and CLEAR LAMPS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. DS300000 2/27/01 5 OF 5 www.fairchildsemi.com 5 Page

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