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ON Semiconductor - Power MOSFET ( Transistor )

Numéro de référence NTTFS4985NF
Description Power MOSFET ( Transistor )
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NTTFS4985NF fiche technique
NTTFS4985NF
Power MOSFET
30 V, 64 A, Single NChannel, WDFN8
Features
Integrated Schottky Diode
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are PbFree and are RoHS Compliant
Applications
CPU Power Delivery
Synchronous Rectification for DCDC Converters
Low Side Switching
Telecom Secondary Side Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
3.5 mW @ 10 V
5.2 mW @ 4.5 V
ID MAX
64 A
NChannel MOSFET
D
Parameter
Symbol Value Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
Current RqJA (Note 1)
Power Dissipation
(Note 1)
RqJA
TA = 25°C
TA = 85°C
TA = 25°C
Continuous Drain
C(Nuortreen1t)RqJA 10 s
TA = 25°C
TA = 85°C
Power Dissipation
RqJA 10 s (Note 1)
Continuous Drain
Current RqJA (Note 2)
Steady
State
TA = 25°C
TA = 25°C
TA = 85°C
Power Dissipation
RqJA (Note 2)
TA = 25°C
Continuous Drain
Current RqJC (Note 1)
TC = 25°C
TC = 85°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
ID
PD
ID
PD
ID
PD
IDM
TJ,
Tstg
30 V
±20 V
22 A
15.9
2.69 W
32.4 A
23.4
5.85 W
16.3 A
11.7
1.47 W
64
46
22.73
A
W
192
55 to
+150
A
°C
G
1
WDFN8
(m8FL)
CASE 511AB
S
MARKING DIAGRAM
1
SD
S 4985 D
S AYWWG D
GGD
4985
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping
NTTFS4985NFTAG WDFN8 1500 / Tape &
(PbFree)
Reel
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
32 A
6.0 V/ns
NTTFS4985NFTWG WDFN8 5000 / Tape &
(PbFree)
Reel
Single Pulse DraintoSource Avalanche Energy
(TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 32 Apk, L = 0.1 mH, RG = 25 W)
EAS
52 mJ
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
TL 260 °C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 2 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size of 90 mm2.
© Semiconductor Components Industries, LLC, 2012
January, 2012 Rev. 1
1
Publication Order Number:
NTTFS4985NF/D
Free Datasheet http://www.datasheet4u.com/

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