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PDF DMS935E1 Data sheet ( Hoja de datos )

Número de pieza DMS935E1
Descripción Silicon NPN epitaxial planar type
Fabricantes Panasonic 
Logotipo Panasonic Logotipo



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This product complies with the RoHS Directive (EU 2002/95/EC).
DMS935E1
Silicon NPN epitaxial planar type (Tr)
Silicon epitaxial planar type (CCD load device)
For CCD output circuits
Features
Two elements incorporated into one package (Tr + CCD load device)
High transition frequency fT
Contributes to miniaturization of sets, reduction of component count.
Eco-friendly Halogen-free package
Basic Part Number
DSC2G03 + CCD load device (Individual)
Packaging
Embossed type (Thermo-compression sealing): 8000 pcs / reel (standard)
Absolute Maximum Ratings Ta = 25°C
Parameter
Symbol
Rating
Collector-base voltage (Emitter open) VCBO
Collector-emitter voltage (Base open)
Tr1
Emitter-base voltage (Collector open)
VCEO
VEBO
Collector current
IC
CCD Limiting element voltage
load device Limiting element current
Vmax
Imax
Total power dissipation *
PT
Overall Junction temperature
Tj
Storage temperature
Tstg
Note) *: Measuring on substrate at 17 mm × 10 mm × 1 mm
30
20
3
50
40
10
125
150
–55 to +150
Unit
V
V
V
mA
V
mA
mW
°C
°C
Package
Code
SSMini6-F3-B
Pin Name
1: Emitter
2: Base
3: Gate
4: Source
5: Drain
6: Collector
Marking Symbol: X0
Internal Connection
(C) (D) (S)
6 54
Tr FET
12 3
(E) (B) (G)
Electrical Characteristics Ta = 25°C±3°C
Tr1
Parameter
Symbol
Conditions
Min Typ Max
Collector-base voltage (Emitter open)
VCBO IC = 100 µA, IE = 0
30
Emitter-base voltage (Collector open)
VEBO IE = 10 µA, IC = 0
3
Base-emitter voltage
VBE VCE = 10 V, IC = 2 mA
740
Forward current transfer ratio
hFE VCE = 10 V, IC = 2 mA
100 250
Transition frequency
fT VCE = 10 V, IC = 15 mA
1 300
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Unit
V
V
mV
MHz
CCD load device
Parameter
Symbol
Conditions
Min Typ Max
Pinchi off current
IP VDS = 10 V, VG = 0
3.8
Output impedance
ZO VDS = 10 V, VG = 0
0.05
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
5.2
Unit
mA
mW
Publication date: December 2010
Ver. BED
1
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DMS935E1 pdf
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for general applications (such as office equipment, communications
equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book.
Consult our sales staff in advance for information on the following applications:
Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment,
life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of
the products may directly jeopardize life or harm the human body.
It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with
your using the products described in this book for any special application, unless our company agrees to your using the products in
this book for any special application.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20100202
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