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NVF6P02 fiches techniques PDF

ON Semiconductor - Power MOSFET ( Transistor )

Numéro de référence NVF6P02
Description Power MOSFET ( Transistor )
Fabricant ON Semiconductor 
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NVF6P02 fiche technique
NTF6P02, NVF6P02
Power MOSFET
-10 Amps, -20 Volts
PChannel SOT223
Features
Low RDS(on)
Logic Level Gate Drive
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ101
Qualified and PPAP Capable*
These Devices are PbFree and are RoHS Compliant
Typical Applications
Power Management in Portables and BatteryPowered Products,
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
DraintoSource Voltage
VDSS
20
GatetoSource Voltage
VGS ±8.0
Drain Current (Note 1)
Continuous @ TA = 25°C
Continuous @ TA = 70°C
Single Pulse (tp = 10 ms)
ID 10
ID 8.4
IDM 35
Total Power Dissipation @ TA = 25°C
PD 8.3
Operating and Storage Temperature Range TJ, Tstg
55 to
+150
Unit
Vdc
Vdc
Adc
Apk
W
°C
Single Pulse DraintoSource Avalanche
Energy Starting TJ = 25°C
(VDD = 20 Vdc, VGS = 5.0 Vdc,
IL(pk) = 10 A, L = 3.0 mH, RG = 25W)
EAS
150 mJ
Thermal Resistance
Junction to Lead (Note 1)
Junction to Ambient (Note 2)
Junction to Ambient (Note 3)
RqJL
RRqqJJAA
°C/W
15
71.4
160
Maximum Lead Temperature for Soldering
Purposes, 1/8from case for 10 seconds
TL
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Steady State.
2. When surface mounted to an FR4 board using 1” pad size,
(Cu. Area 1.127 sq in), Steady State.
3. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu. Area 0.412 sq in), Steady State.
http://onsemi.com
10 AMPERES
20 VOLTS
RDS(on) = 44 mW (Typ.)
S
G
D
PChannel MOSFET
MARKING DIAGRAM
& PIN ASSIGNMENT
4
1
23
SOT223
CASE 318E
STYLE 3
Drain
4
AYW
6P02G
G
1 23
Gate Drain Source
A = Assembly Location
Y = Year
W = Work Week
6P02 = Specific Device Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NTF6P02T3G
SOT223
(PbFree)
4000 / Tape &
Reel
NVF6P02T3G*
SOT223
(PbFree)
4000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
August, 2013 Rev. 6
1
Publication Order Number:
NTF6P02T3/D
Free Datasheet http://www.datasheet4u.com/

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