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PDF WS1403 Data sheet ( Hoja de datos )

Número de pieza WS1403
Descripción CDMA PCS 3x3 Power Amplifier Module
Fabricantes AVAGO 
Logotipo AVAGO Logotipo



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WS1403
CDMA PCS 3x3 Power Amplifier Module
(1850-1910 MHz)
Data Sheet
Description
The WS1403 is a CDMA Personal Communication Service
(PCS) Power Amplifier (PA), designed for handsets
operating in the 1850~1910 MHz bandwidth.
Digital mode control of CoolPAM reduces current
consumption, which enables extended talk time of
mobile devices.
The WS1403 meets stringent CDMA linearity
requirements to and beyond 28 dBm output power. The
3 mm x 3 mm form factor 8-pin surface mount package
is self contained, incorporating 50 ohm input and output
matching networks.
Features
  Excellent linearity
  Low quiescent current
  High efficiency
  PAE at 28 dBm: 39.8%
  PAE at 17 dBm: 22.3%
  8-pin surface mounting package
  3 mm x 3 mm x 1.0 mm
  Internal 50 ohm matching networks for both RF input
and output
  RoHS compliant
Applications
  Digital CDMA PCS
  Wireless Local loop
Order Information
Functional Block Diagram
Part Number
WS1403-TR1
WS1403-BLK
No. of Devices
1,000
100
Container
7”Tape and Reel
BULK
Vref (1)
Vcont (2)
RF
INPUT
(3)
MMIC
BIAS CIRCUIT & CONTROL LOGIC
INPUT
MATCH
DA
INTER
STAGE
MATCH
PA
Vcc1 (4)
Vcc2 (5)
OUTPUT
MATCH
MODULE
RF
OUTPUT
(6)
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WS1403 pdf
Evaluation Board Description
Vref
Vcont
R1
0 ohm
RF In
C3
100pF
1 Vref
C4
100pF
2 Vcont
3 RF In
Vcc1
C5
2.2µF
C1
100pF
4 Vcc1
Figure 6. Evaluation board schematic
GND 8
GND 7
RF Out 6
Vcc2 5
RF Out
C2
150pF
Vcc2
C6
2.2µF
3
4
1403
PYYWW
AAAAA
Figure 7. Evaluation board assembly diagram

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WS1403 arduino
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs naturally in the
environment. With the increase in voltage potential, the
outlet of neutralization or discharge will be sought. If the
acquired discharge route is through a semiconductor
device, destructive damage will result.
ESD countermeasure methods should be developed and
used to control potential ESD damage during handling
in a factory environment at each manufacturing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface mount package is
sensitive to damage induced by absorbed moisture and
temperature.
Avago Technologies follows JEDEC Standard J-STD 020B.
Each component and package type is classified for
moisture sensitivity by soaking a known dry package at
various temperatures and relative humidity, and times.
After soak, the components are subjected to three
consecutive simulated reflows.
The out of bag exposure time maximum limits are
determined by the classification test describe below
which corresponds to a MSL classification level 6 to 1
according to the JEDEC standard IPC/JEDEC J-STD-020B
and J-STD-033.
WS1403 is MSL3. Thus, according to the J-STD-033 p.11
the maximum Manufacturers Exposure Time (MET) for
this part is 168 hours. After this time period, the part
would need to be removed from the reel, de-taped and
then re-baked. MSL classification reflow temperature
for the WS1403 is targeted at 260°C +0/-5°C. Figure
19 and Table 7 show typical SMT profile for maximum
temperature of 260 +0/-5°C.
Table 5. ESD Classification
Pin # Name
1 Vref
2 Vcont
3 RF In
4 Vcc1
5 Vcc2
6 RF Out
7 GND
8 GND
Description
Reference Voltage
Control Voltage
RF Input
Supply Voltage
Supply Voltage
RF Output
Ground
Ground
Note:
1. Module products should be considered extremely ESD sensitive.
HBM
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
±2000 V
CDM
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
±200 V
Classification
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Class 2
Table 6. Moisture Classification Level and Floor Life
MSL Level
1
2
2a
3
4
5
5a
6
Floor Life (Out of Bag) at Factory Ambient = < 30°C/60% RH or As Stated
Unlimited at = < 30°C/85% RH
1 year
4 weeks
168 hours
72 hours
48 hours
24 hours
Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label.
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
11
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