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PDF ACPM-5251 Data sheet ( Hoja de datos )
| Número de pieza | ACPM-5251 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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ACPM-5251
4x5 UMTS Band I & Band V Dual-Band Power Amplifier Module
with Integrated Coupler
Data Sheet
Description
The ACPM-5251 is the dual-band power amplifier module
with integrated directional coupler designed for UMTS
Band 1 and Band 5 uplink transmission in the mobile
handsets, data cards or dongles supporting WCDMA and/
or HSPA. This product has been designed, tested and
characterized to the stringent spectral linearity and other
requirements of the 3GPP standards including the HSDPA,
HSUPA and HSPA+ UL transmission while keeping the
key emphasis on the excellent PAE over the entire power
range, i.e. the exceptional average power consumption
and talk-time.
The ACPM-5251 contains all of the input and output
matching networks, Vcc decoupling/bypass capacitors,
RF input & output DC blocking capacitors as well as the
daisy-chained directional coupler integrated into the
module substrate PCB, all in a single 14-pad surface-
mount leadless package with 4x5 mm from factor and
1mm thickness.
The integrated directional coupler has a single coupled-
out port and is daisy-chained between the both bands
with internally 50-terminated isolation port. It also has
excellent coupler directivity in both bands allowing small
coupled out power variation or delivered power variation
caused by the load mismatch from the antenna. The
coupler directivity, i.e. the power variation into the mis-
matched load is critical to the TRP performance of the
mobile phones in the real operation as well as the spec.
compliance test.
The ACPM-5251 features CoolPAM-5 circuit technology
which supports 3 power/gain modes – active bypass (low
power), mid power, and high power modes. CoolPAM is
the stage bypass technology that enables very lower
power consumption especially in the low and mid output
power ranges. The active bypass technology added in the
CoolPAM-5 further enhances the PAE at low output power
range together with the exceptionally low quiescent
current. It dramatically saves the average power consump-
tion extending the talk time of the phones and battery life
of the other mobile data devices even much longer.
The ACPM-5251 has integrated on-chip Vref and
on-module bias switch as the one of the key features of
the CoolPAM-5, so the external Vref is not required elimi-
nating the external LDO regulators and switches from the
circuit boards of the mobile devices. It also makes the PA
fully digital-controllable by the Ven pin that simply turns
the PA on and off from the digital control logic inputs
Features
UMTS Band 1 and Band 5 dual-band PA
Integrated directional coupler (daisy-chained between
both bands with single coupled out port and internally
terminated isolation port)
High directivity (small coupled power or delivered
power variation into mismatched load)
3-mode power/gain control (active bypass, mid power,
and high power modes)
Excellent PAE in low and mid power ranges.
3.5mA quiescent current in active bypass (low-power)
mode
Excellent average power consumption and talk-time
Spectral linearity supporting HSDPA, HSUPA, and HSPA+
Internally matched 50Ω RF input & output ports
Internal RF input & output DC blocking capacitors
Internal Vcc bypass capacitors
Internal Vref eliminating external LDO regulators and
switches
1.8V CMOS compatible control logics (VH=1.35V~3.1V)
4 x 5 x 1mm 14-pad leadless surface-mount package
Lead-free, RoHS compliant, Halogen-free, Sb-free, Green
Applications
UMTS Band 1 and Band 5 Uplink Transmission in
WCDMA / HSDPA / HSUPA / HSPA+ handsets, data cards
and dongles
Ordering Information
Part Number
ACPM-5251-TR1
ACPM-5251-BLK
Number of Devices
1000
100
Container
7” Tape/Reel
Bulk
Description (Cont.)
from the baseband chipsets. All of the digital control input
pins such as the Ven, Vmode and Vbp are fully CMOS
compatible down to the 1.8V logic and all they needs just
several uA of current drawn per pin to be driven.
The CoolPAM series of power amplifiers are manufactured
on an advanced InGaP HBT technology offering excellent
performance, temperature stability, ruggedness, and
reliability.
Free Datasheet http://www.datasheet4u.com/
1 page  
Band 1
Characteristics
Operating Frequency Range
Max. Linear Output Power
Gain
PAE
Total Supply Current
Quiescent Current
Enable Control Current
Mode Control Current
Bypass Control Current
Total Current in Power Down Mode
Adjacent Channel +/-5MHz Offset
Leakage Ratio
+/-5MHz Offset
+/-5MHz Offset
Adjacent Channel +/-10MHz Offset
Leakage Ratio
+/-10MHz Offset
+/-10MHz Offset
Harmonic
Suppression
EVM
2nd
3rd
Input VSWR
Condition
HPM, WCDMA (CM=0 / MPR=-1dB)
HPM, HSDPA MPR=0dB
HPM, HSUPA MPR=0dB
MPM, WCDMA (CM=0 / MPR=-1dB)
MPM, HSPA MPR=0dB
BPM, WCDMA (CM=0 / MPR=-1dB)
BPM, HSPA MPR=0dB
HPM, Pout=27.5dBm
MPM, Pout=18.0dBm
BPM, Pout=12.0dBm
HPM, Pout=27.5dBm
MPM, Pout=18.0dBm
BPM, Pout=12.0dBm
HPM, Pout=27.5dBm
MPM, Pout=18.0dBm
BPM, Pout=12.0dBm
HPM
MPM
BPM
HPM, Ven_HB=1.8V
MPM, Ven_HB=1.8V
BPM, Ven_HB=1.8V
MPM, Vmode=1.8V
BPM, Vmode=1.8V
BPM, Vbp=1.8V
Ven_LB=Ven_HB=0V, Vmode=Vbp=0V
HPM, WCDMA R’99, Pout=27.5dBm
HPM, HSDPA MPR=0dB, Pout=26.5dBm
HPM, HSUPA MPR=0dB, Pout=26.0dBm
MPM, WCDMA R’99, Pout=18.0dBm
MPM, HSPA MPR=0dB, Pout=17.0dBm
BPM, WCDMA R’99, Pout=12.0dBm
BPM, HSPA MPR=0dB, Pout=11.0dBm
HPM, WCDMA R’99, Pout=27.5dBm
HPM, HSDPA MPR=0dB, Pout=26.5dBm
HPM, HSUPA MPR=0dB, Pout=26.0dBm
MPM, WCDMA R’99, Pout=18.0dBm
MPM, HSPA MPR=0dB, Pout=17.0dBm
BPM, WCDMA R’99, Pout=12.0dBm
BPM, HSPA MPR=0dB, Pout=11.0dBm
HPM, Pout=27.5dBm, Meas.BW=1MHz
Pout ≤ Max.Pout – MPR
Pout ≤ Max.Pout – MPR – 3dB
Min
1920
27.5
26.5
26.0
18.0
17.0
12.0
11.0
24
15
8
34.0
18.3
8.7
360
50
20
85
15
2
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Typ
–
–
–
–
–
–
–
–
27.5
19.5
11.7
38.4
24.5
11.7
430
75
37
115
22
3.5
10
10
10
10
10
10
1
-43
–
–
-42
–
-39
–
-55
–
–
-63
–
-58
–
-44
-64
2.2:1
Max
1980
–
–
–
–
–
–
–
31
24
16
–
–
–
485
100
50
145
30
5
50
50
50
50
50
50
5
-36
-36
-36
-36
-36
-36
-36
-46
-46
-46
-46
-46
-46
-46
-30
-40
5
4
2.5:1
Unit
MHz
dB
dB
dB
dB
dB
dB
%
%
%
mA
mA
mA
mA
mA
mA
A
A
A
A
A
A
A
dBc
dBc
dBc
dBc
dBc
dBc
dBc
% rms
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
PCB layout and part placement on phone board
4
3
1
5
2 Via hole
Figure 2. PCB guideline on phone board
Notes:
1. To prevent voltage drop, make the bias lines as wide as possible (Red line).
2. Use many via holes to fence off PA RF input and output traces for better isolation. Output
signal of the PA should be isolated from input signal and the receive signal. Output signal
should not be fed into PA input. (Yellow line)
3. Use via holes to connect outer ground planes to internal ground planes. They help heat
spread out more easily and accordingly the board temperature can be lowered. They also
help to improve RF stability.
4. PA which has a ground slug requires many via holes which go through all the layers (Pink
square).
5. CPL_out line and RFout line are recommended to be at the different layer for better CPL_out/
RF_out isolation (Green line).
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 19 Páginas | |
| PDF Descargar | [ Datasheet ACPM-5251.PDF ] | |
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