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PDF ACPM-5007 Data sheet ( Hoja de datos )
| Número de pieza | ACPM-5007 | |
| Descripción | Power Amplifier Module | |
| Fabricantes | AVAGO | |
| Logotipo |  |
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ACPM-5007
LTE Band7 (2500-2570 MHz)
3 x 3 mm Power Amplifier Module
Data Sheet
Description
The ACPM-5007 is a fully matched 10-pin surface mount
module developed for LTE Band7. This power amplifier
module operates in the 2500-2570 MHz bandwidth. The
ACPM-5007 meets stringent UMTS (Rel 99) linearity re-
quirements up to 28.5 dBm output power and the LTE (MPR
= 0 dB) to 27.5 dBm. The 3 x 3 mm form factor package is
self contained, incorporating 50 ohm input and output
matching networks.
The ACPM-5007 features 5th generation of CoolPAM circuit
technology which supports 3 power modes – bypass, mid
and high power modes. The CoolPAM is stage bypass
technology enhancing PAE (power added efficiency) at
low and medium power range. Active bypass feature is
added to 5th generation to enhance PAE further at low
output range. This helps to extend talk time. A directional
coupler is integrated into the module and both coupling
and isolation ports are available externally, supporting
daisy chain.
A directional coupler is integrated into the module and
both coupling and isolation ports are available externally,
supporting daisy chain. The integrated coupler has
excellent coupler directivity, which minimizes the coupled
output power variation or delivered power variation
caused by the load mismatch from the antenna. The
coupler directivity, or the output power variation into
the mismatched load, is critical to the TRP and SAR per-
formance of the mobile phones in real field operations as
well as compliance tests for the system specifications.
The ACPM-5007 has integrated on-chip Vref and
on-module bias switch as the one of the key features of
the CoolPAM-5, so an external constant voltage source
is not required, eliminating the external LDO regulators
and switches from circuit boards of mobile devices. It also
makes the PA fully digital-controllable by the Ven pin that
simply turns the PA on and off from the digital control
logic input from baseband chipsets. All of the digital
Features
Thin Package (0.9 mm typ)
Excellent Linearity
3-mode power control with Vbp and Vmode
Bypass/Mid Power Mode/High Power Mode
High Efficiency at max output power
10-pin surface mounting package
Internal 50 ohm matching networks for both RF input
and output
Integrated coupler
Coupler and Isolation ports for daisy chain
Green – Lead-free and RoHS complian
Applications
UMTS & LTE Band7 Handset, Data card
Ordering Information
Part Number
ACPM-5007-TR1
ACPM-5007-BLK
Number of
Devices
1000
100
Container
178 mm (7”) Tape/Reel
Bulk
Description (Cont.)
control input pins such as the Ven, Vmode and Vbp are
fully CMOS compatible and can operate down to the 1.35
V logic. The current consumption by digital control pins is
negligible.
The power amplifier is manufactured on an advanced
InGaP HBT (hetero-junction Bipolar Transistor) MMIC
(microwave monolithic integrated circuit) technology
offering state-of-the-art reliability, temperature stability
and ruggedness.
Free Datasheet http://www.datasheet4u.com/
1 page  
Package Dimensions
Pin 1 Mark
1
2
3
4
5
10
9
8 3 ± 0.1
7
6
3 ± 0.1
All dimensions are in millimeter
Marking Specification
Pin 1 Mark
0.5
0.9 ± 0.1
A5007
PYYWW
AAAAA
Manufacturing Part Number
Lot Number
P Manufacturing Info
YY Manufacturing Year
WW Work Week
AAAAA Assemby Lot Number
Note: Prior to production release, the marking will be ‘E5007’. After the
completion of Avago qualification testing and production release, the
marking will revert to ‘A5007’.
5
Free Datasheet http://www.datasheet4u.com/
5 Page 
Reflow Profile Recommendations
Tp
TL
Tsmax
Tsmin
ts
Preheat
Ramp-up
tp
tL
Critical Zone
TL to Tp
Ramp-down
25
t 25° C to Peak
Time
Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5° C
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (TL)
Peak temperature (TP)
Time within 5° C of actual Peak Temperature (TP)
Ramp-down Rate
Time 25° C to Peak Temperature
Sn-Pb Solder
3° C/sec max
100° C
150° C
60-120 sec
183° C
60-150 sec
240 +0/-5° C
10-30 sec
6° C/sec max
6 min max.
Pb-Free Solder
3° C/sec max
150° C
200° C
60-180 sec
3° C/sec max
217° C
60-150 sec
260 +0/-5° C
20-40 sec
6° C/sec max
8 min max.
11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet ACPM-5007.PDF ] | |
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