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PDF DMA10P1600PZ Data sheet ( Hoja de datos )

Número de pieza DMA10P1600PZ
Descripción Standard Rectifier
Fabricantes IXYS 
Logotipo IXYS Logotipo



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No Preview Available ! DMA10P1600PZ Hoja de datos, Descripción, Manual

Standard Rectifier
Phase leg
Part number
DMA10P1600PZ
1
43
http://www.DataSheet4U.net/
DMA10P1600PZ
VRRM
I FAV
VF
= 2x 1600 V
= 10 A
= 1.21 V
Backside: anode/cathode
Features / Advantages:
Planar passivated chips
Very low leakage current
Very low forward voltage drop
Improved thermal behaviour
Applications:
Diode for main rectification
For single and three phase
bridge configurations
Package: TO-263 (D2Pak-HV)
Industry standard outline
RoHS compliant
Epoxy meets UL 94V-0
High creepage distance
between terminals
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20130108b
datasheet pdf - http://www.DataSheet4U.net/

1 page




DMA10P1600PZ pdf
DMA10P1600PZ
Rectifier
20
100 102
50 Hz, 80%VRRM
VR = 0 V
15
IF
10
[A]
80
IFSM
[A]
TVJ = 45°C
60
5
TVJ = 25°C
TVJ = 125°C
TVJ = 150°C
0
0.5 1.0 1.5 2.0
VF [V]
Fig. 1 Forward current versus
voltage drop per diode
T = 150°C
VJ
40
0.001
0.01
0.1
t [s]
1
Fig. 2 Surge overload current
I2t
[A2s]
TVJ = 45°C
TVJ = 150°C
101
1
2 3 4 5 6 7 8 910
t [ms]
Fig. 3 I2t versus time per diode
18
16
14
12
Ptot 10
[W] 8
DC =
1
0.5
0.4
0.33
0.17
0.08
6
4
2
RthHA =
4 K/W
8 K/W
10 K/W
12 K/W
16 K/W
20 K/W
http://www.DataSheet4U.net/
28
24
20
IF(AV)M
16
[A]
12
8
4
DC =
1
0.5
0.4
0.33
0.17
0.08
0
0 2 4 6 8 10 12 0
50 100 150 200
IF(AV)M [A]
Tamb [°C]
Fig. 4 Power dissipation vs. direct output current and ambient temperature
1.6
0
0 50 100 150 200
TC [°C]
Fig. 5 Max. forward current vs.
case temperature
1.2
ZthJC
0.8
[K/W]
0.4
0.0
1
10 100
t [ms]
Fig. 6 Transient thermal impedance junction to case
1000
10000
Constants for ZthJC calculation:
i Rthi (K/W)
ti (s)
1 0.155
0.0005
2 0.332
0.0095
3 0.713
0.17
4 0.3
0.8
5 0.00001 0.00001
IXYS reserves the right to change limits, conditions and dimensions.
© 2013 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20130108b
datasheet pdf - http://www.DataSheet4U.net/

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