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GS8342T09GE-300 fiches techniques PDF

GSI Technology - (GS8342Txxx) 36Mb SigmaCIO DDR-II Burst of 2 SRAM

Numéro de référence GS8342T09GE-300
Description (GS8342Txxx) 36Mb SigmaCIO DDR-II Burst of 2 SRAM
Fabricant GSI Technology 
Logo GSI Technology 





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GS8342T09GE-300 fiche technique
Preliminary
GS8342T08/09/18/36E-333/300/267*/250/200/167
165-Bump BGA
Commercial Temp
Industrial Temp
36Mb SigmaCIO DDR-II
Burst of 2 SRAM
167 MHz–333 MHz
1.8 V VDD
1.8 V and 1.5 V I/O
Features
• Simultaneous Read and Write SigmaCIO™ Interface
• Common I/O bus
• JEDEC-standard pinout and package
• Double Data Rate interface
• Byte Write (x36 and x18) and Nybble Write (x8) function
• Burst of 2 Read and Write
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation with self-timed Late Write
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
• Pin-compatible with present 9Mb and 18Mb and future 72Mb
and 144Mb devices
Bottom View
165-Bump, 15 mm x 17 mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
SigmaCIOFamily Overview
The GS8342T08/09/18/36E are built in compliance with the
SigmaCIO DDR-II SRAM pinout standard for Common I/O
synchronous SRAMs. They are 37,748,736-bit (36Mb)
SRAMs. The GS8342T08/09/18/36E SigmaCIO SRAMs are
just one element in a family of low power, low voltage HSTL
I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS8342T08/09/18/36E SigmaCIO DDR-II SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer. The device also allows the user to manipulate the
output register clock inputs quasi independently with the C and
C clock inputs. C and C are also independent single-ended
clock inputs, not differential inputs. If the C clocks are tied
high, the K clocks are routed internally to fire the output
registers instead.
http://www.DataSheet4U.net/
Common I/O x36 and x18 SigmaCIO DDR-II B2 RAMs
always transfer data in two packets. When a new address is
loaded, A0 presets an internal 1 bit address counter. The
counter increments by 1 (toggles) for each beat of a burst of
two data transfer.
Common I/O x8 SigmaCIO DDR-II B2 RAMs always transfer
data in two packets. When a new address is loaded, the LSB
is internally set to 0 for the first read or write transfer, and
incremented by 1 for the next transfer. Because the LSB is
tied off internally, the address field of a x8 SigmaCIO DDR-II
B4 RAM is always one address pin less than the advertised
index depth (e.g., the 8M x 8 has a 2M addressable index).
tKHKH
tKHQV
Parameter Synopsis
-333
3.0 ns
0.45 ns
-300
3.3 ns
0.45 ns
-267*
3.75 ns
0.45 ns
-250
4.0 ns
0.45 ns
-200
5.0 ns
0.45 ns
-167
6.0 ns
0.5 ns
* The 267 MHz speed bin is only available on the x18 part.
Rev: 1.02 8/2005
1/37
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2003, GSI Technology
datasheet pdf - http://www.DataSheet4U.net/

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