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PDF SF2162E Data sheet ( Hoja de datos )
| Número de pieza | SF2162E | |
| Descripción | SAW Filter | |
| Fabricantes | RF Monolithics | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de SF2162E (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Preliminary
• SAW Filter for Digital Television
• Complies with Directive 2002/95/EC (RoHS)
Characteristics :
Balance-to-balanced Operation
Terminating Source/Load Impedance : ZS = 150 Ω
Maximum Rating
Rating
Input Power Level
DC Voltage on any Non-ground Terminal
Operating Temperature Range
Storage Temperature Range in Tape and Reel
Maximum Soldering Profile, 5 cycles/ 10 seconds maximum
Pb
Value
0
3
-40 to +85
-40 to +85
265
Units
dBm
V
°C
°C
°C
SF2162E
1178.12 MHz
SAW Filter
SM3030-8
Electrical Characteristics
Characteristic
Center Frequency
Maximum Insertion Loss, 1158.12 to 1198.12 MHz
1.5 dB Passband
Amplitude Ripple, 1158.12 to 1198.12 MHz
Attenuation, Referenced to ILMAX
50 to 1096.06 MHz
1260.18 to 2000 MHz
2000 to 6000 MHz
Group Delay Ripple, 1158.12 to 1198.12 MHz
Case Style
Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator
Standard Reel Quantity Reel Size 7 Inch
Reel Size 13 Inch
Sym Notes
Min
Typ
Max
fC
ILMAX
1178.12
2.5
50
4.5
1.2 2.3
www.DataSheet.net/
41 45
44 51
15 35
12 25
SM3030-8 3.0 x 3.0 mm Nominal Footprint
857, YWWS
500 Pieces/Reel
3000 Pieces/Reel
Units
MHz
dB
MHz
dB
dB
nsP-P
Electrical Connections
Port 1
Port 2
Dot Indicates Pin 1
Connection
Balanced Input
Balanced Output
Ground
Terminals
1,2
5,6
All Others
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1. US and international patents may apply.
2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
Page 1 of 6
SF2162E - 7/19/10
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
8-Terminal Ceramic Surface-Mount Case
3.0 X 3.0 mm Nominal Footprint
I
JJ
J
K NM
IL
N
K
OO
PCB Footprint Top View
Case and PCB Footprint Dimensions
Dimension
mm
Min Nom Max
Min
A 2.87 3.0 3.13 0.113
B 2.87 3.0 3.13 0.113
C 1.14 1.27 1.40 0.045
D 0.79 0.92 1.05 0.031
E 0.62 0.75 0.88 0.024
F 0.47 0.60 0.73 0.018
G 0.47 0.60 0.73 0.018
H 1.07 1.20 1.33 0.042
I 3.19
J 0.81
K 0.96
L 0.81
M 1.39
N 0.23
O 0.38
Inches
Nom
0.118
0.118
0.050
0.036
0.029
0.024
0.024
0.047
0.126
0.032
0.038
0.032
0.055
0.009
0.015
Max
0.123
0.123
0.055
0.041
0.034
0.029
0.029
0.052
Case Materials
Solder Pad
Plating
www.DataSheet.net/
Lid Plating
Body
Materials
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
2.0 to 3.0 µm Nickel
Al2O3 Ceramic
Pb Free
1
A2
3
TOP VIEW
BOTTOM VIEW
B CE
88
77
H
1
6
5
4
62
G
53
4
DF
www.RFM.com E-mail: [email protected]
©2009-2010 by RF Monolithics, Inc.
Page 5 of 6
SF2162E - 7/19/10
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet SF2162E.PDF ] | |
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