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Número de pieza | SF2109D | |
Descripción | SAW Filter | |
Fabricantes | RF Monolithics | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de SF2109D (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! SF2109D
• Low Insertion Loss
• 3.8 X 3.8 X 1.2 mm Surface-Mount Case
• Differential 750 Ohm IN and 900 Ohm OUT
• Complies with Directive 2002/95/EC (RoHS)
Pb
305.00 MHz
SAW Filter
Absolute Maximum Ratings
Rating
Maximum Incident Power in Passband
Max. DC voltage between any 2 terminals
Storage Temperature Range
Operating Temperature
Suitable for lead-free soldering - Max Soldering Profile
Value
Units
+10 dBm
30 VDC
-40 to +85
°C
-15 to +85
°C
260°C for 30 s
SM3838-8
Electrical Characteristics
Characteristic
Center Frequency
Insertion Loss
Amplitude Ripple (p-p)
fc-4.0 to fc+4.0 MHz
Low Side Attenuation (fc-9.28 MHz)
Low Side Attenuation (fc-5.78 MHz)
High Side Attenuation (fc+5.78 MHz)
High Side Attenuation (fc+9.28 MHz)
Delay Ripple (p-p)
fc-4.0 to fc+4.0 MHz
Group Delay in Passband
Case Style
Lid Symbolization (Y=year, WW=week, S=shift) See note 4
Sym
fC
IL
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Notes
1
1, 2
1, 2, 3
6
Min Typ Max Units
305 MHz
7 10 dB
1.2 2.0 dB
30 35
25 35
20 26
dB
30 35
300
ns
500
SM3838-8 3.8 x 3.8 mm Nominal Footprint
607 YWWS
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance
matching to 50 Ω and measured with 50 Ω network analyzer.
2. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc.
3. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external
impedance matching design. See Application Note No. 42 for details.
4. The design, manufacturing process, and specifications of this filter are subject to change.
5. Tape and Reel Standard Per ANSI / EIA 481.
6. US and international patents may apply.
7. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
8. ©Copyright 1999, RF Monolithics Inc.
www.RFM.com E-mail: [email protected]
©2008 by RF Monolithics, Inc.
Page 1 of 6
SF2109D - 9/18/08
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page SM3838-8 Case
8-Terminal Ceramic Surface-Mount Case
3.8 X 3.8 mm Nominal Footprint
0.066
(1.68)
0.055 TYP.
(1.40)
PCB Footprint
TOP VIEW
Case Dimensions
mm
Dimension Min Nom Max Min
A 3.6 3.8 4.0 0.142
B 3.6 3.8 4.0 0.142
C 1.05 1.20 1.35 0.041
D 0.95 1.10 1.25 0.037
E 0.90 1.00 1.10 0.035
F 0.50 0.60 0.70 0.020
G 2.39 2.54 2.69 0.090
H 1.40 1.75 2.05 0.055
Inches
Nom
0.150
0.150
0.047
0.043
0.040
0.024
0.100
0.069
Max
0.157
0.157
0.053
0.049
0.043
0.028
0.110
0.080
Electrical Connections
Connection
Port 1
Differential Input
Port 2
Differential Output
Ground
Single Ended Operation
Differential Operation
Dot Indicates Pin 1
Terminals
1, 2
5, 6
All Others
Return is Ground
Return is Hot
Materials
Solder Pad Ter- Au plating 30 - 60 uInches (76.2-152 uM) over 80-200
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mination
uInches (203-508 uM) Ni.
Lid Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phospho-
rus) 100-200 uInches Thick
Body
Al2O3 Ceramic
Pb Free
BOTTOM VIEW
B CE
88
1
A2
3
7 H7
66
55
1
2G
3
44
DF
www.RFM.com E-mail: [email protected]
©2008 by RF Monolithics, Inc.
Page 5 of 6
SF2109D - 9/18/08
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet SF2109D.PDF ] |
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