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Número de pieza | NCV7703B | |
Descripción | Triple Half-Bridge Driver | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de NCV7703B (archivo pdf) en la parte inferior de esta página. Total 16 Páginas | ||
No Preview Available ! NCV7703B
Triple Half-Bridge Driver
with SPI Control
The NCV7703B is a fully protected Triple Half−Bridge Driver
designed specifically for automotive and industrial motion control
applications. The three half−bridge drivers have independent control.
This allows for high side, low side, and H−Bridge control. H−Bridge
control provides forward, reverse, brake, and high impedance states.
The drivers are controlled via a standard Serial Peripheral Interface
(SPI). This device is fully compatible with ON Semiconductor’s
NCV7708 Double Hex Driver.
Features
• Ultra Low Quiescent Current in Sleep Mode, 1 mA for VS and VCC
• Power Supply Voltage Operation down to 5 V
• 3 High−Side and 3 Low−Side Drivers Connected as Half−Bridges
• Internal Free−Wheeling Diodes
• Configurable as H−Bridge Drivers
• 0.5 A Continuous (1 A peak) Current
• RDS(on) = 0.8 W (typ)
• 5 MHz SPI Control with Daisy Chain Capability
• Compliance with 5 V and 3.3 V Systems
• Overvoltage and Undervoltage Lockout
• Fault Reporting
• 1.4 A Overcurrent Threshold Detection with Optional Shutdownwww.DataSheet.net/
• 3 A Current Limit with Auto Shutdown
• Overtemperature Warning and Protection Levels
• Internally Fused Leads in SOIC−14 Package for Better Thermal
Performance
• ESD Protection up to 6 kV
• These are Pb−Free Devices
Typical Applications
• Automotive
• Industrial
• DC Motor Management
VS
VS
VS
OUT1
M
OUT2
M
OUT3
http://onsemi.com
14
1
14
SOIC−14
D2 SUFFIX
CASE 751A
1
MARKING
DIAGRAM
NCV7703BG
AWLYWW
NCV7703B = Specific Device Code
A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
PIN CONNECTIONS
GND
OUT3
VS
CSB
SI
SCLK
GND
GND
OUT1
OUT2
VCC
EN
SO
GND
ORDERING INFORMATION
Device
Package
Shipping†
NCV7703BD2G
SOIC−14
(Pb−Free)
55 Units / Rail
NCV7703BD2R2G SOIC−14
(Pb−Free)
2500 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Figure 1. Cascaded Application
© Semiconductor Components Industries, LLC, 2010
April, 2010 − Rev. 0
1
Publication Order Number:
NCV7703B/D
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page NCV7703B
ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 150°C, 5.5 V ≤ VS ≤ 40 V, 3 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified)
Characteristic
Conditions
Min Typ Max Unit
GENERAL
Supply Current (VS)
Sleep Mode (Note 5)
VS = 13.2 V, OUTx = 0 V
EN = SI = SCLK = 0 V, CSB = VCC
0 V < VCC < 5.25 V
(TJ = −40°C to 85°C)
− 1.0 5.0 mA
Supply Current (VS)
Active Mode
VS = 13.2 V, OUTx = 0 V
EN = SI = SCLK = 0 V, CSB = VCC
0 V < VCC < 5.25 V, TJ = 25°C
EN = VCC, 5.5 V < VS < 35 V
No Load
Supply Current (VCC)
Sleep Mode (Note 6)
Supply Current (VCC)
Active Mode
VCC = CSB, EN = SI = SCLK = 0 V
(TJ = −40°C to 85°C)
EN = VCC
VCC Power−On−Reset Threshold
VS Undervoltage Detection
Threshold
Hysteresis
VS decreasing
VS Overvoltage Detection
Threshold VS increasing
Hysteresis
Thermal Warning (Note 4)
Threshold
Hysteresis
Thermal Shutdown (Note 4)
Threshold
Hysteresis
Ratio of Thermal Shutdown to Thermal
Warning temperature (Note 4)
www.DataSheet.net/
OUTPUTS
Output RDS(on) (Source)
Output RDS(on) (Sink)
Source Leakage Current
Sum of I(OUTx) x = 1, 2, 3
Iout = −500 mA
VS = 13.2 V, TJ = 25°C
VS = 13.2 V
8 V ≤ VS ≤ 40 V
5.5 V ≤ VS ≤ 8 V, TJ = 25°C
5.5 V ≤ VS ≤ 8 V
Iout = 500 mA
VS = 13.2 V, TJ = 25°C
VS = 13.2 V
8 V ≤ VS ≤ 40 V
5.5 V ≤ VS ≤ 8 V, TJ = 25°C
5.5 V ≤ VS ≤ 8 V
OUTx = 0 V, VS = 40 V, EN = 0 V
CSB = VCC
0 V < VCC < 5.25 V
Sum(I(OUTx)
− − 2.0
− 2.0 4.0 mA
− 0 2.5 mA
− 1.5 3.0 mA
2.60 2.80 3.00
V
4.3 4.7 5.1
V
100 − 400 mV
34.0 37.5 40.0
1.5 3.5 5.5
V
120 145 170
− 30 −
°C
155 175 195
− 30 −
°C
1.05 1.20
− °C/°C
−
0.8 0.95
W
− − 1.5 W
− − 1.7 W
− 1.3 −
W
− − 2.0 W
−
0.8 0.95
W
− − 1.5 W
− − 1.7 W
− 1.3 −
W
− − 2.0 W
−5.0
−
− mA
OUTx = 0 V, VS = 40 V, EN = 0 V
CSB = VCC
0 V < VCC < 5.25 V, TJ = 25°C
Sum(I(OUTx)
−1.0
−
−
http://onsemi.com
5
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page NCV7703B
SPI Communication
Standard 16−bit communication has been implemented to
this IC to turn drivers on/off, and to report faults. (See
Figure 11). The LSB (Least Significant Bit) is clocked in
first.
Communication is Implemented as Follows:
1. CSB goes low to allow serial data transfer.
2. A 16 bit word is clocked (SCLK) into the SI
(Serial Input) pin.
3. CSB goes high to transfer the clocked in
information to the data registers.
NOTE: SO is tristate when CSB is high.
CSB
Frame detection starts
after the CSB falling edge
and the SCLK rising edge.
Frame Detection
Input word integrity (SI) is evaluated by the use of a frame
consistency check. The word frame length is compared to an
h x 16 bit acceptable word length before the data is latched
into the input register. This guarantees the proper word
length has been imported and allows for daisy chain
operation applications.
The frame length detector is enabled with the CSB falling
edge and the SCLK rising edge.
SCLK must be low during the CSB rising edge. The fault
register is cleared with a valid frame detection. Existing
faults are re−latched after the fault filter time.
Frame detection mode ends with
CSB rising edge.
SCLK
SI
SRR OUTL1 OUTH1 OUTL2 OUTH2 OUTL3 OUTH3 X
X
X
X
X
X OCD
X OVLO
Internal Counter 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Figure 10. Frame Detection
Valid 16 bits shown
CSB
SI
SCLK
www.DataSheet.net/
SRR OUTL1 OUTH1 OUTL2 OUTH2 OUTL3 OUTH3 X X X X X X OCD X OVLO
SO TW OUTL1 OUTH1 OUTL2 OUTH2 OUTL3 OUTH3 X X X X X X OLD ULD PSF
Figure 11. SPI Communication Frame Format
Table 1 defines the programming bits and diagnostic bits.
Figure 11 displays the timing diagram associated with
Table 1. Fault information is sequentially clocked out the
SO pin of the NCV7703B as programming information is
clocked into the SI pin of the device. Daisy chain
communication between SPI compatible IC’s is possible by
connection of the Serial Output pin (SO) to the input of the
sequential IC (SI) (Reference the Daisy Chain Section).
http://onsemi.com
11
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page |
Páginas | Total 16 Páginas | |
PDF Descargar | [ Datasheet NCV7703B.PDF ] |
Número de pieza | Descripción | Fabricantes |
NCV7703 | Triple Half-Bridge Driver | ON Semiconductor |
NCV7703B | Triple Half-Bridge Driver | ON Semiconductor |
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