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PDF TGC4403 Data sheet ( Hoja de datos )
| Número de pieza | TGC4403 | |
| Descripción | 8 - 15 Doubler with Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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TGC4403
8 - 15 GHz Doubler with Amplifier
Key Features
• RF Output Frequency Range: 16-30 GHz
• Input Frequency Range: 8 - 15 GHz
• 22 dBm Nominal Pout
• 20 dB Gain
• 10 dBc Input Frequency Isolation
• Bias: Vd = 5 V, Id = 150 mA, Vg = -0.5 V Typical
• Technology: 3MI 0.25 um Power PHEMT
• Chip Dimensions: 2.068 x 0.88 x 0.1 mm
Measured Performance
Bias conditions: Vd = 5 V, Id = 150 mA, Vdbl= -0.8 V,
30 Vg = -0.5 V Typical
Primary Applications
• Point-to-Point Radio
• Ka Band Sat-Com
25
20
15
10
5
0
16
Pin = 2 dBm
18 20 22 24 26 28
2 x Input Frequency (GHz)
30
20
10 Output @
Fund Freq -
Input @
0 Fund Freq
-10
-20
-30
Output @ 3X
Fund Freq -
Input @ Fund
Freq
Fundamental
3x Fund
Product Descriptionwww.DataSheet.net/
The TriQuint TGC4403 MMIC combines a
frequency doubler with a 3-stage amplifier,
operating at input frequencies of 8 - 15 GHz. With
greater than 30 dBc suppression measured at the
output between the input frequency and doubled
frequency, the TGC4403 achieves 22 dBm output
power, with 2 dBm input power. This performance
makes this doubler ideally suited for Point to Point
Radios and Ka Band satellite ground terminal
applications. The TGC4403 utilizes TriQuint’s
robust 0.25um power pHEMT process coupled
with 3 layer Metal Inteconnect (3MI) technology.
The TGC4403 provides the frequency doubling
function in an extremely compact (< 1.8 mm2) chip
footprint.
Each device is 100% DC and RF tested on–wafer
to ensure performance compliance. The device is
available in chip form.
The TGC4403 has a protective surface passivation
layer providing environmental robustness.
-40
5
10 15 20 25 30 35 40 45
Frequency (GHz)
Lead-free and RoHS compliant.
Datasheet subject to change without notice.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Jun 2007 © Rev A
1
Datasheet pdf - http://www.DataSheet4U.co.kr/
1 page  
Measured Data
TGC4403
Bias conditions: Vd = 5 V, Id = 150 mA, Vdbl = -0.8 V, Vg = -0.5 V Typical
30
25
20 Pin = 2 dBm
15
10
5
0
12 14 16 18 20 22 24 26 28 30 32 34
2 x Input Frequency (GHz)
www.DataSheet.net/
20
10 Output @
Fund Freq -
Input @
0 Fund Freq
Output @ 3X
Fund Freq -
Input @ Fund
Freq
-10
-20 Fundamental
3x Fund
-30
-40
5
10 15 20 25 30 35 40 45
Frequency (GHz)
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
Jun 2007 © Rev A
5
Datasheet pdf - http://www.DataSheet4U.co.kr/
5 Page 
TGC4403
Assembly Notes
Component placement and adhesive attachment assembly notes:
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e. epoxy) can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
Thermosonic ball bonding is the preferred interconnect technique.
www.DataSheet.net/
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Ordering Information
Part
TGC4403
Package Style
GaAs MMIC Die
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 [email protected]
11
Jun 2007 © Rev A
Datasheet pdf - http://www.DataSheet4U.co.kr/
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGC4403.PDF ] | |
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