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PDF BD6290EFV Data sheet ( Hoja de datos )
| Número de pieza | BD6290EFV | |
| Descripción | Standard 36V Stepping Motor Driver | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Stepping Motor Drivers
Standard 36V
Stepping Motor Driver
BD6290EFV
No.12009EAT03
●Description
BD6290EFV is the simple type that provides the minimum function for driving stepping motor and various protection circuits.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply’s rated
voltage of 36V and rated output current of 0.8A. There are excitation modes of FULL STEP & HALF STEP &, QUARTER
STEP mode. This IC contributes to reduction of mounting area, cost down, safety design.
●Feature
1) Power supply: one system drive (rated voltage of 36V)
2) Rated output current: 0.8A
3) Low ON resistance DMOS output
4) Parallel IN drive mode
5) PWM constant current control (self oscillation)
6) Built-in spike noise cancel function (external noise filter is unnecessary)
7) FULL STEP, HALF STEP, QUARTER STEP
8) Power save function
9) Built-in logic input pull-down resistor
10) Power-on reset function
11) Thermal shutdown circuit (TSD)
12) Over current protection circuit (OCP)
13) Under voltage lock out circuit (UVLO)
14) Over voltage lock out circuit (OVLO)
15) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention Function)
16) Electrostatic discharge: 4kV (HBM specification)
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17) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package (BD6391EFV)
●Application
Laser beam printer, Scanner, Photo printer, FAX, Ink jet printer, Mini printer, Sewing machine, Toy, and Robot etc.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
1/8
2012.02 - Rev.A
Datasheet pdf - http://www.DataSheet4U.net/
1 page  
BD6290EFV
Technical Note
●Power dissipation
○HTSSOP-B24 Package
HTSSOP-B24 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also,
the back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing
power dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is
a possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat
dissipation efficiency.
5.0
4.0W 4
4.0
3.0 2.8W 3
2.0 1.7W 2
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm3
(With through holes on the board)
The exposed metal of the backside is connected to the board with
solder.
Board①：1-layer board(Copper foil on the back 0mm2)
Board②：2-layer board(Copper foil on the back 15*15mm2)
Board③：2-layer board(Copper foil on the back 70*70mm2)
Board④：4-layer board(Copper foil on the back 70*70mm2)
Board①：θja =113.6℃/W
Board②：θja =73.5℃/W
Board③：θja =44.6℃/W
Board④：θja =31.3℃/W
1.1W 1
1.0
0
100 125
Ambient Temperature:Ta[℃]
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Fig.2 HTSSOP-B24 Derating curve
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
5/8
2012.02 - Rev.A
Datasheet pdf - http://www.DataSheet4U.net/
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet BD6290EFV.PDF ] | |
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