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What is W9812G6JH?

This electronic component, produced by the manufacturer "Winbond", performs the same function as "2M X 4 BANKS X 16 BITS SDRAM".


W9812G6JH Datasheet PDF - Winbond

Part Number W9812G6JH
Description 2M X 4 BANKS X 16 BITS SDRAM
Manufacturers Winbond 
Logo Winbond Logo 


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W9812G6JH
2M × 4 BANKS × 16 BITS SDRAM
Table of Contents-
1. GENERAL DESCRIPTION .............................................................................................................. 3
2. FEATURES...................................................................................................................................... 3
3. AVAILABLE PART NUMBER .......................................................................................................... 3
4. PIN CONFIGURATION.................................................................................................................... 4
5. PIN DESCRIPTION ......................................................................................................................... 5
6. BLOCK DIAGRAM........................................................................................................................... 6
7. FUNCTIONAL DESCRIPTION ........................................................................................................ 7
7.1 Power Up and Initialization ................................................................................................. 7
7.2 Programming Mode Register .............................................................................................. 7
7.3 Bank Activate Command .................................................................................................... 7
7.4 Read and Write Access Modes .......................................................................................... 7
7.5 Burst Read Command ........................................................................................................ 8
7.6 Burst Write Command......................................................................................................... 8
7.7 Read Interrupted by a Read ............................................................................................... 8
7.8 Read Interrupted by a Write................................................................................................ 8
7.9 Write Interrupted by a Write ................................................................................................ 8
7.10 Write Interrupted by a Read................................................................................................ 8
7.11 Burst Stop Command.......................................................................................................... 9
7.12 Addressing Sequence of Sequential Mode......................................................................... 9
7.13 Addressing Sequence of Interleave Mode.......................................................................... 9
7.14 Auto-precharge Command................................................................................................ 10
7.15 Precharge Command........................................................................................................ 10
7.16 Self Refresh Command..................................................................................................... 10
7.17 Power Down Mode............................................................................................................ 11
7.18 No Operation Command ................................................................................................... 11
7.19 Deselect Command .......................................................................................................... 11
7.20 Clock Suspend Mode........................................................................................................ 11
8. OPERATION MODE...................................................................................................................... 12
9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13
9.1 Absolute Maximum Ratings .............................................................................................. 13
9.2 Recommended DC Operating Conditions ........................................................................ 13
Publication Release Date: Sep. 08, 2010
- 1 - Revision A04
Datasheet pdf - http://www.DataSheet4U.net/

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W9812G6JH equivalent
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W9812G6JH
5. PIN DESCRIPTION
PIN NUMBER PIN NAME
23 26, 22,
29 35
A0 A11
20, 21
BS0, BS1
FUNCTION
Address
Bank Select
DESCRIPTION
Multiplexed pins for row and column address.
Row address: A0 A11. Column address: A0 A8.
Select bank to activate during row address latch time,
or bank to read/write during address latch time.
2, 4, 5, 7, 8,
10, 11, 13, 42,
44, 45, 47, 48,
50, 51, 53
DQ0
DQ15
Data Input/
Output
Multiplexed pins for data output and input.
Disable or enable the command decoder. When
19 CS Chip Select command decoder is disabled, new command is
ignored and previous operation continues.
18
RAS
Row Address
Strobe
Command input. When sampled at the rising edge of
the clock, RAS , CAS and WE define the
operation to be executed.
17
CAS
Column Address
Strobe
Referred to
RAS
16 WE Write Enable Referred to RAS
39, 15
UDQM/
LDQM
Input/Output
Mask
The output buffer is placed at Hi-Z (with latency of 2)
when DQM is sampled high in read cycle. In write
cycle, sampling DQM high will block the write
operation with zero latency.
38
CLK
Clock Inputs
System clock used to sample inputs on the rising edge
of clock.
CKE controls the clock activation and deactivation.
37
CKE
Clock Enable When CKE is low, Power Down mode, Suspend mode
or Self Refresh mode is entered.
1, 14, 27
28, 41, 54
3, 9, 43, 49
VDD
VSS
VDDQ
Power (+3.3V)
Ground
Power (+3.3V)
for I/O Buffer
Power for input buffers and logic circuit inside DRAM.
Ground for input buffers and logic circuit inside DRAM.
Separated power from VDD, used for output buffers to
improve noise.
6, 12, 46, 52
36, 40
VSSQ
NC
Ground for I/O Separated ground from VSS, used for output buffers to
Buffer
improve noise.
No Connection No connection
-5-
Publication Release Date: Sep. 08, 2010
Revision A04
Datasheet pdf - http://www.DataSheet4U.net/


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W9812G6JHThe function is 2M X 4 BANKS X 16 BITS SDRAM. WinbondWinbond

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