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PDF VEMT3700F Data sheet ( Hoja de datos )
| Número de pieza | VEMT3700F | |
| Descripción | Silicon NPN Phototransisto | |
| Fabricantes | Vishay | |
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VEMT3700F
Vishay Semiconductors
Silicon NPN Phototransistor
19032
DESCRIPTION
VEMT3700F is a high speed silicon NPN epitaxial planar
phototransistor in a miniature PLCC-2 package. The
integrated daylight blocking filter is matched to 950 nm
IR emitters.
PRODUCT SUMMARY
COMPONENT
VEMT3700F
Ica (mA)
0.5
Note
• Test conditions see table “Basic Characteristics”
FEATURES
• Package type: surface mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• High radiant sensitivity
• Fast response times
• Daylight blocking filter matched with 870 nm to
950 nm emitters
• Angle of half sensitivity: ϕ = ± 60°
• Package notch indicates collector
• Package matched with IR emitter series VSML3710
• Floor life: 168 h, MSL 3, acc. J-STD-020
• Lead (Pb)-free reflow soldering
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
• Photo interrupters
• Miniature switches
• Counters
• Encoders
• Position sensors
ϕ (deg)
± 60
λ0.5 (nm)
870 to 1050
ORDERING INFORMATION
ORDERING CODE
VEMT3700F-GS08
VEMT3700F-GS18
Note
• MOQ: minimum order quantity
PACKAGING
Tape and reel
Tape and reel
REMARKS
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
PACKAGE FORM
PLCC-2
PLCC-2
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
Collector emitter voltage
Emitter collector voltage
Collector current
Collector peak current
Power dissipation
tp/T ≤ 0.1, tp ≤ 10 μs
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Acc. reflow solder profile fig. 10
Thermal resistance junction/ambient Soldered on PCB with pad dimensions: 4 mm x 4 mm
VCEO
VECO
IC
ICM
PV
Tj
Tamb
Tstg
Tsd
RthJA
VALUE
70
5
50
100
100
100
- 40 to + 100
- 40 to + 100
260
400
UNIT
V
V
mA
mA
mW
°C
°C
°C
°C
K/W
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902
Document Number: 81584
Rev. 1.6, 14-Jul-10
For technical questions, contact: [email protected]
www.vishay.com
1
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1 page  
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Silicon NPN Phototransistor
VEMT3700F
Vishay Semiconductors
Adhesive tape
Blister tape
Component cavity
Fig. 11 - Blister Tape
94 8670
3.5 2.2
3.1 2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 12 - Tape Dimensions in mm for PLCC-2
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
94 8158
> 160 mm
Tape leader
40 empty
compartments
Carrier leader
min. 75 empty
compartments
Carrier trailer
Fig. 13 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
120°
10.0
9.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
63.5
60.5
180 14.4 max.
178
94 8665
Fig. 14 - Dimensions of Reel-GS08
120°
10.4
8.4
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
321 14.4 max.
329
18857
Fig. 15 - Dimensions of Reel-GS18
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
Document Number: 81584
Rev. 1.6, 14-Jul-10
For technical questions, contact: [email protected]
www.vishay.com
5
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| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet VEMT3700F.PDF ] | |
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