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PDF LV51139T Data sheet ( Hoja de datos )

Número de pieza LV51139T
Descripción 2-Cell Lithium-Ion Secondary Battery Protection IC
Fabricantes Sanyo Semicon Device 
Logotipo Sanyo Semicon Device Logotipo



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No Preview Available ! LV51139T Hoja de datos, Descripción, Manual

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Ordering number : ENA1927
CMOS IC
LV51139T 2-Cell Lithium-Ion Secondary Battery
Protection IC
Overview
The LV51139T is a protection IC for 2-cell lithium-ion secondary batteries.
Features
Monitoring function for each cell:
High detection voltage accuracy:
Hysteresis cancel function:
Discharge current monitoring function:
Low current consumption:
0V cell charging function:
Detects overcharge and over-discharge conditions and controls the
charging and discharging operation of each cell.
Over-charge detection accuracy ±25mV
Over-discharge detection accuracy ±100mV
The hysteresis of over-discharge detection voltage is made small by
sensing the connection of a load after overcharging has been detected.
Detects over-currents, load shorting, and excessively high voltage of a
charger .
Normal operation mode typ. 6.0μA
Stand by mode
max. 0.2μA
Charging is enabled even when the cell voltage is 0V by giving a
potential difference between the VDD pin and V- pin.
Absolute Maximum Ratings at Ta = 25°C
Parameter
Power supply voltage
Input voltage
Charger minus voltage
Output voltage Cout pin voltage
Dout pin voltage
Allowable power dissipation
Operating ambient temperature
Storage temperature
Symbol
VDD
V-
Vcout
Vdout
Pd max
Topr
Tstg
Independent IC
Conditions
Ratings
-0.3 to +12
VDD-28 to VDD+0.3
Unit
V
V
VDD-28 to VDD+0.3
VSS-0.3 to VDD+0.3
170
-30 to +85
-40 to +125
V
V
mW
°C
°C
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment (home appliances, AV equipment,
communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be
intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace
instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety
equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case
of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee
thereof. If you should intend to use our products for applications outside the standard applications of our
customer who is considering such use and/or outside the scope of our intended standard applications, please
consult with us prior to the intended use. If there is no consultation or inquiry before the intended use, our
customer shall be solely responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer's products or
equipment.
21611 SY 20110204-S00003 No.A1927-1/7
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LV51139T pdf
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LV51139T
Excessive charger detection/release
If the voltage between V- pin and VSS pin becomes equal to or less than the excessive charger detection voltage by
connecting a charger, no charging can be made by turning the Cout pin “L” after delay time and turning off the
external Nch MOS FET. If that voltage returns to equal to or more than the excessive charger detection voltage
during detection delay time, the excessive charger detection will be stopped. If the voltage between V- pin and VSS
pin becomes equal to or more than the excessive charger detection voltage after excessive charger detection, the Cout
returns to “H” after delay time. The detection/return delay time is set internally.
If Dout pin is “L”, charging will be made through the parasitic diode of external Nch FET on Dout pin. In that case,
the voltage between V- pin and VSS pin is nearly -Vf which is less than the over-charger detection voltage, therefore
no excessive charger detection will be made during over-discharge, over-current and short-circuit detection.
Furthermore, if excessive voltage charger is connected to the over-discharged battery, no excessive charger detection
is made while the Dout pin is “L”. But the battery is continued charging through the parasitic diode. If the battery
voltage rises to the over-discharge detection voltage and the voltage between V- pin and VSS pin remains equal to or
less than the excessive charger detection voltage, the delay operation will be started after Dout pin turns to “H”.
0V cell charging operation
If voltage between VDD and V becomes equal to or more than the 0V cell charging lowest operation voltage when
the cell voltage is 0V, the Cout pin turns to “H” and charging is enabled.
Shorten the test time
By turning T pin to the VDD, the delay times set by the internal counter can be cut. If T pin is “open”, ”L” the delay
times are normal. Delay time not set by the counter just like as short circuit detection delay cannot be controlled by
this pin. By the substrate layout, the power-supply voltage is lowered due to an excessive current at the load short.
Therefore, we recommend that the T pin is connected to the VSS pin because the problem that this IC enters a
standby mode might be caused.
Operation in case of detection overlap
Overlap state
When, during over-
charge detection,
Over-discharge
detection is made,
Operation in case of
detection overlap
Over-charge detection is preferred. If over-
discharge state continues even after over-
charge detection, over-discharge detection is
resumed.
State after detection
When over-charge detection is made first, V- is
released. When over-discharge is detected
after over-charge detection, the standby state is
not effectuated. Note that V- is connected to
VDD via 200k.
Over-current
(*1) Both detections’ can be made in parallel.
(*2) When over-current is detected first, V- is
detection is made,
Over-charge detection continues even when the connected to VSS via 10k. When over-charge
over-current state occurs. If the over-charge
detection is made first, V- is released.
state occurs first, over-current detection is
interrupted.
During over-discharge Over-charge detection Over-discharge detection is interrupted and
The standby state is not effectuated when over-
detection,
is made,
over-charge detection is preferred. When over-
discharge state continues even after over-
charge detection, over-discharge detection is
discharge detection is made after over-charge
detection. Note that V- is connected to VDD via
200k.
resumed.
Over-current
(*3) Both detections can be made in parallel.
(*4) If over-current state is made first, V- will be
detection is made,
Over-discharge detection continues even when
the over-current state is effectuated first. Over-
connected to VSS via 10k. If over-discharge
detection is made next, V- will be disconnected
current detection is interrupted when the over-
discharge state is effectuated first,
from VSS and connected to VDD via 200kto
get into stand-by mode. If over-discharge state
When, during over-
Over-charge detection (*1)
current detection,
is made,
Over-discharge
(*3)
detection is made,
(Note) Short-circuit detection can be made independently.
is made first, V- will be connected to VDD via
200kto get into stand-by mode.
(*2)
(*4)
Excessive charger detection cannot be made during over-discharge, over-current and short-circuit detection.
And its delay time starts after the Dout pin returns to “H”.
No.A1927-5/7
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