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PDF LFH1056 Data sheet ( Hoja de datos )
| Número de pieza | LFH1056 | |
| Descripción | SMD | |
| Fabricantes | LUXPIA | |
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Hay una vista previa y un enlace de descarga de LFH1056 (archivo pdf) en la parte inferior de esta página. Total 17 Páginas | ||
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Specification for Approval
( Version 1.0 )
comments
Part No. : LFH1056
LUXPIA Co., Ltd.
Designed by Checked by Approved by
Approved by Approved by Approved by
/
www.DataSheet4U.com
/
/
///
Date : . . .
Date : . . .
LUXPIA CO.,LTD.
948-1, Dunsan-Li Bongdong-Eup, Wanju-Gun, JeonBuk, Korea Tel 82-63-260-4500 Fax 82-63-261-8255
1 page  
4. Electro-Optical Characteristics
4.1 . Red
(Ta=25 )
Item
Rank Symbol Test Condition Min. Typ. Max. Unit
Forward Voltage2)
Dominant
Wavelength
Luminous intensity3)
Reverse Current
0
1
2
-
-
-
1.8 - 2.0
VF IF= 20mA 2.0 - 2.2 V
2.2 - 2.4
λD
IF= 20mA
615 620 635 nm
Iv
IF= 20mA
150 350 850 mcd
IR
VR=5V
- - 10
4.2. Green
Item
Rank Symbol Test Condition Min. Typ. Max. Unit
0 3.0 - 3.2
Forward Voltage2)
1
VF IF= 20mA 3.2 - 3.4 V
Dominant
Wavelength
Luminous intensity3)
Reverse Current
2
-
-
-
3.4 - 3.6
λD
IF= 20mA
520 525 535 nm
Iv
IF= 20mA
300 800 1700 mcd
IR
VR=5V
- - 10
4.3. Blue
Item
Rank Symbol Test Condition Min. Typ. Max.
0 3.0 - 3.2
Forward Voltage2)
1
VF IF= 20mA 3.2 - 3.4
2 3.4 - 3.6
Dominant
Wavelength
-
λD
IF= 20mA
450 457 470
Luminous intensity3)
-
Iv
IF= 20mA
70 150 350
www.DataSheet4U.cRomeverse Current
-
IR
VR=5V
- - 10
2) Forward voltages are tested at a current pulse duration of 10 ms and an accuracy within ±0.1V.
3) The allowance of luminous intensity measurement is within ±11%.
Unit
V
nm
mcd
4/16
5 Page 
condensation can occur.
(3) Heat Generation
• Thermal design of the end product is of paramount importance. Please consider the heat generation of the
LED when the system is designed. The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as
other components. It is necessary to avoid intense heat generation and operate within the maximum ratings
given in the specification.
• The operating current should be decided after considering the ambient maximum temperature of LEDs.
(4) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
• The LEDs can be soldered in place using the reflow soldering method. Luxpia does not make any
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
pre-heat
120~150
180~200
temperature 350 max
pre-heat time
120sec max
120sec max
soldering time 3sec max
peak temperature 240 max
260 max
(one time only)
soldering time
condition
10sec max
refer to profile
5sec max
refer to profile
* After reflow soldering, rapid cooling should be avoided.
[temperature-profile (surface of circuit board)]
Use the conditions shown to the following figures.
< : Lead Solder>
< : Lead-free Solder>
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| PDF Descargar | [ Datasheet LFH1056.PDF ] | |
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