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PDF DMP3010LPS Data sheet ( Hoja de datos )
| Número de pieza | DMP3010LPS | |
| Descripción | P-CHANNEL ENHANCEMENT MODE MOSFET | |
| Fabricantes | Diodes Incorporated | |
| Logotipo |  |
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Product Summary
V(BR)DSS
30V
RDS(ON)
7.5mΩ @ VGS = -10V
10mΩ @ VGS = -4.5V
ID
TA = 25°C
(Note 5)
-36A
-31A
Description and Applications
This new generation 30V P-Channel Enhancement Mode MOSFET
has been designed to minimize RDS(on) and yet maintain superior
switching performance. This device is ideal for use in Notebook
battery power management and Loadswitch.
• Notebook Battery Power Management
• DC-DC Converters
• Loadswitch
DMP3010LPS
P-CHANNEL ENHANCEMENT MODE MOSFET
Features and Benefits
• Thermally Efficient Package-Cooler Running Applications
• High Conversion Efficiency
• Low RDS(on) – Minimizes On State Losses
• Low Input Capacitance
• Fast Switching Speed
• <1.1mm Package Profile – Ideal for Thin Applications
• ESD HBM Protected up to 1kV
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: PowerDI5060-8
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram Below
• Weight: 0.097 grams (approximate)
Drain
Top View
S Pin 1
S
S
G
D
D
D
D
Bottom View
Gate
Source
Internal Schematic
S
S
S
G
Top View
Pin Configuration
D
D
D
D
Ordering Information (Note 3)
Notes:
Part Number
DMP3010LPS-13
Case
PowerDI5060-8
1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Packaging
2500 / Tape & Reel
Marking Information
www.DataSheet4U.com
DMP3010LPS
Document number: DS32239 Rev. 3 - 2
DDDD
P3010LS
YY WW
SS SG
1 of 6
www.diodes.com
Logo
Part no.
Xth week: 01 ~ 53
Year: “09” = 2009
December 2010
© Diodes Incorporated
1 page  
DMP3010LPS
D = 0.7
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
0.001
0.01
Package Outline Dimensions
D = 0.9
RθJA(t) = r(t) * RθJA
RθJA = 97°C/W
P(pk)
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1/t2
DUT mounted on FR-4 PCB with
minimum recommended pad layout
0.1 1 10
t1, PULSE DURATION TIME (s)
Fig. 12 Transient Thermal Response
100 1,000
E E1
A
D DETAIL A
D1
c
L
DETAIL A
E2
e
b (8x)
D2
G
θ (4x)
A1
θ1 (4x)
b2 (4x)
M
M1
L1
PowerDI5060-8L
Dim Min Max Typ
A 0.90 1.10 1.00
A1 0.00 0.05 -
b 0.33 0.51 0.41
b2 0.200 0.350 0.273
c 0.230 0.330 0.277
D 5.15BSC
D1 4.70 5.10 4.90
D2 3.50 4.40 3.90
E 6.15BSC
E1 5.60 6.00 5.80
E2 3.28 3.68 3.48
e 1.27BSC
G 0.51 0.71 0.61
L 0.51 0.71 0.61
L1 0.050 0.20 0.175
M 3.235 4.035 3.635
M1 1.00 1.40 1.21
θ 10° 12° 11°
θ1 6° 8° 7°
All Dimensions in mm
Suggested Pad Layout
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Y1
Y
X
X1
Y2
C
X2 (8x)
G1
Y3 (4x)
G
Dimensions
C
G
G1
X
X1
X2
Y
Y1
Y2
Y3
Value (in mm)
1.270
0.660
0.820
4.420
4.100
0.610
6.610
3.810
1.020
1.270
DMP3010LPS
Document number: DS32239 Rev. 3 - 2
5 of 6
www.diodes.com
December 2010
© Diodes Incorporated
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet DMP3010LPS.PDF ] | |
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