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Numéro de référence | BAS21DW | ||
Description | SURFACE MOUNT LOW LEAKAGE DIODE | ||
Fabricant | Diodes | ||
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1 Page
BAS20DW-BAS21DW
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
Mechanical Data
• Fast Switching Speed
• Surface Mount Package Ideally Suited for Automated Insertion
• High Reverse Breakdown Voltage
• Low Leakage Current
• Lead Free By Design/RoHS Compliant (Note 3)
• "Green" Device (Notes 4 and 5)
• Case: SOT-363
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminal Connections: See Diagram
• Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 2
• Ordering Information: See Page 2
• Weight: 0.003 grams (approximate)
SOT-363
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
Symbol
VRRM
VRWM
VR
VR(RMS)
IFM
IO
IFSM
IFRM
BAS20DW
200
150
106
BAS21DW
250
200
141
400
200
2.5
0.5
625
Unit
V
V
V
mA
mA
A
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
PD
RθJA
TJ, TSTG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
www.DR@aetvRaeaSrtsheeedeCDtu4CrUreB.nclotocmking Voltage (Note 2)
Total Capacitance
Reverse Recovery Time
BAS20DW
BAS21DW
Symbol
V(BR)R
VF
IR
CT
trr
Min
200
250
⎯
⎯
⎯
⎯
Max
⎯
⎯
1.0
1.25
100
15
5.0
50
Unit
V
V
nA
μA
pF
ns
Test Condition
IR = 100μA
IF = 100mA
IF = 200mA
Tj = 25°C
Tj = 100°C
VR = 0, f = 1.0MHz
IF = IR = 30mA,
Irr = 0.1 x IR, RL = 100Ω
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
BAS20DW-BAS21DW
Document number: DS30617 Rev. 10 - 2
1 of 4
www.diodes.com
May 2009
© Diodes Incorporated
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Pages | Pages 4 | ||
Télécharger | [ BAS21DW ] |
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