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PDF NTZD3152P Data sheet ( Hoja de datos )
| Número de pieza | NTZD3152P | |
| Descripción | Small Signal MOSFET | |
| Fabricantes | ON Semiconductor | |
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NTZD3152P
Small Signal MOSFET
−20 V, −430 mA, Dual P−Channel
with ESD Protection, SOT−563
Features
• Low RDS(on) Improving System Efficiency
• Low Threshold Voltage
• ESD Protected Gate
• Small Footprint 1.6 x 1.6 mm
• These are Pb−Free Devices
Applications
• Load/Power Switches
• Power Supply Converter Circuits
• Battery Management
• Cell Phones, Digital Cameras, PDAs, Pagers, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted.)
Parameter
Symbol Value
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain Current
(Note 1)
Steady
State
TA = 25°C
TA = 85°C
VDSS
VGS
ID
−20
±6.0
−430
−310
Power Dissipation
(Note 1)
Steady State
PD 250
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
tv5s
TA = 25°C
TA = 85°C
tv5s
ID
PD
−455
−328
280
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
TJ,
TSTG
IS
TL
−750
−55 to
150
−350
260
Unit
V
V
mA
mW
mA
mW
mA
°C
mA
°C
THERMAL RESISTANCE RATINGS
Parameter
Junction−to−Ambient – Steady State (Note 1)
www.DaJtauSnhcteioent4−Uto−.cAommbient – t v 5 s (Note 1)
Symbol
RqJA
Max
500
447
Unit
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in. sq. pad size
(Cu. area = 1.127 in. sq. [1 oz.] including traces).
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) Typ
0.5 W @ −4.5 V
0.6 W @ −2.5 V
1.0 W @ −1.8 V
D1
ID Max
−430 mA
D2
G1 G2
P−Channel
S1
MOSFET
S2
6 MARKING DIAGRAM
1
SOT−563−6
CASE 463A
TU M G
1G
TU = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
PINOUT: SOT−563
S1 1
6 D1
G1 2
5 G2
D2 3
4 S2
Top View
ORDERING INFORMATION
Device
Package
Shipping†
NTZD3152PT1G
NTZD3152PT1H
NTZD3152PT5G
NTZD3152PT5H
SOT−563
(Pb−Free)
SOT−563
(Pb−Free)
4000 / Tape & Reel
8000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
March, 2010 − Rev. 2
1
Publication Order Number:
NTZD3152P/D
1 page  
NTZD3152P
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
A
L
654
12 3
e
E
−Y−
b 65 PL
0.08 (0.003) M X Y
HE
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.50 0.55 0.60 0.020 0.021 0.023
b 0.17 0.22 0.27 0.007 0.009 0.011
C 0.08 0.12 0.18 0.003 0.005 0.007
D 1.50 1.60 1.70 0.059 0.062 0.066
E 1.10 1.20 1.30 0.043 0.047 0.051
e 0.5 BSC
0.02 BSC
L 0.10 0.20 0.30 0.004 0.008 0.012
HE 1.50 1.60 1.70 0.059 0.062 0.066
SOLDERING FOOTPRINT*
0.3
0.0118
1.35
0.0531
1.0
0.0394
0.45
0.0177
0.5 0.5
0.0197 0.0197
ǒ ǓSCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
www.DataBuSyherepeutrc4hUas.ecoor muse SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NTZD3152P/D
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