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Número de pieza | P2784 | |
Descripción | General Purpose EMI Reduction IC | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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No Preview Available ! P2781/82/84
General Purpose EMI
Reduction IC
Features
• Provides up to 15dB of EMI suppression
• FCC approved method of EMI attenuation
• Generates a 1X, 2X, and 4X low EMI spread spectrum
clock of the input frequency
• Input frequency range from 3 to 78MHz
• External loop filter for spread % adjustment
• Spreading ranges from ±0.25% to ±5.0%
• Ultra low cycle-to-cycle jitter
• Zero-cycle slip
• 3.3V operating voltage range
• Ultra-low power CMOS design
• P278xA is available in an 8 pin SOIC Package
Product Description
The P278xA is a versatile spread spectrum frequency
modulator designed specifically for digital camera and other
digital video and imaging applications. The P278xA
reduces electromagnetic interference (EMI) at the clock
source, which provides system wide reduction of EMI of all
clock dependent signals. The P278xA allows significant
system cost savings by reducing the number of circuit
board layers and shielding that are traditionally required to
pass EMI regulations.
The P278xA uses the most efficient and optimized
modulation profile approved by the FCC. The P278xA
modulates the output of a single PLL in order to “spread”
the bandwidth of a synthesized clock and, more
importantly, decreases the peak amplitudes of its
harmonics. This result in significantly lower system EMI
compared to the typical narrow band signal produced by
oscillators and most frequency generators. Lowering EMI
by increasing a signal’s bandwidth is called spread
spectrum clock generation.
Applications
The P278xA is targeted towards MFP, xDSL, fax modem,
set-top box, USB controller, DSC, and embedded systems.
Block Diagram
FS0 FS1 LF
VDD
XIN / CLKIN
XOUT
Crystal
Oscillator
www.DataSheet4U.com
Frequency
Divider
Feedback
Divider
Modulation
PLL
Phase
Detector
VCO
Output
Divider
ModOUT
©2010 SCILLC. All rights reserved.
JANUARY 2010 – Rev. 2
VSS
Publication Order Number:
P2781/82/84
1 page P2781/82/84
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
VDD, VIN Voltage on any pin with respect to Ground
-0.5 to +4.6
V
TSTG
Storage temperature
-65 to +125
°C
Ts Max. Soldering Temperature (10 sec)
260 °C
TJ Junction Temperature
150 °C
TDV Static Discharge Voltage (As per JEDEC STD22- A114-B)
2 KV
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Operating Conditions
Parameter
Description
VDD
Supply Voltage
TA Operating Temperature (Ambient Temperature)
CL Load Capacitance
CIN Input Capacitance
Min Max Unit
3.0 3.6 V
-40 +85 °C
15 pF
7 pF
DC Electrical Characteristics
(Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated.)
Symbol
Parameter
Min
VIL Input low voltage
VSS – 0.3
VIH Input high voltage
IIL
Input low current
(internal input pull-up resistor on FS0 and FS1)
IIH
Input high current
(internal input pull-up resistor on FS0 and FS1)
IXOL XOUT output low current
2.0
IXOH XOUT output high current
VOL Output low voltage (VDD = 3.3V, IOL = 20mA)
VOH
IDD
ICC
VDD
Output high voltage (VDD = 3.3V, IOH = 20mA)
Static supply current
Typical dynamic supply current
(25pF scope probe loading)
Operating voltage
2.5
5.2 at 3MHz
3.0
Typ Max Unit
0.8 V
VDD +0.3
V
60 µA
60 µA
10 mA
10 mA
0.4 V
V
3 mA
21.2 at 82MHz mA
3.3 3.6 V
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Rev. 2 | Page 5 of 8 | www.onsemi.com
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet P2784.PDF ] |
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