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PDF NTMFS4708N Data sheet ( Hoja de datos )
| Número de pieza | NTMFS4708N | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTMFS4708N
Power MOSFET
30 V, 19 A, Single N-Channel, SOIC-8 FL
Features
•ăFast Switching Times
•ăLow Gate Charge
•ăLow RDS(on)
•ăLow Inductance SOIC-8 Package
•ăThese are Pb-Free Devices
Applications
•ăNotebooks, Graphics Cards
•ăDC-DC Converters
•ăSynchronous Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
VDSS 30 V
Gate-to-Source Voltage
VGS ±20 V
Continuous Drain Current Steady TA = 25°C
(Note 1)
State TA = 85°C
ID
11.5 A
8.0
t ≤ 10 s TA = 25°C
19
Power Dissipation
(Note 1)
Steady TA = 25°C
State
PD
2.2 W
Continuous Drain Current
(Note 2)
Power Dissipation
(Note 2)
t ≤ 10 s
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
ID
PD
6.25
7.8 A
5.6
1.0 W
Pulsed Drain Current
tp ≤ 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain-to-Source Avalanche
Energy. VDD = 25 V, VGS = 10 V, IPK = 7.0 A,
L = 10 mH, RG = 25 W
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDM
TJ,
TSTG
IS
EAS
58
-55 to
150
6.25
245
A
°C
A
mJ
TL 260 °C
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction-to-Ambient – Steady State (Note 1)
RqJA
56.5 °C/W
Junction-to-Ambient – t ≤ 10 s (Note 1)
RqJA
20
Junction-to-Ambient – Steady State (Note 2)
RqJA
124
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
www.DataSheet4U.com
http://onsemi.com
V(BR)DSS
30 V
RDS(on) Typ
7.3 mW @ 10 V
10.1 mW @ 4.5 V
ID Max
19 A
N-Channel
D
G
S
MARKING DIAGRAM &
PIN ASSIGNMENT
D
1
SOIC-8 FLAT LEAD
CASE 488AA
STYLE 1
S
S 4708N
S AYWWĂG
GG
D
4708N = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb-Free Package
D
D
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTMFS4708NT1G SOIC-8 FL 1500Ă/ĂaTpe & Reel
(Pb-Free)
NTMFS4708NT3G SOIC-8 FL 5000Ă/ĂaTpe & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
July, 2007 - Rev. 2
1
Publication Order Number:
NTMFS4708N/D
1 page  
NTMFS4708N
PACKAGE DIMENSIONS
DFN6 5x6, 1.27P (SO8 FL)
CASE 488AA-01
ISSUE C
D
2
D1
6
2X
0.20 C
A
B 2X
5 0.20 C
E1
2E
c
1 2 34
TOP VIEW
0.10 C
0.10 C
SIDE VIEW
A
DETAIL A
3X
e
DETAIL A
8X b
0.10 C A B
0.05 c L
1
e/2
4
K
STYLE 1:
PIN 1. SOURCE
2. SOURCE
3. SOURCE
4. GATE
5. DRAIN
6. DRAIN
E2
L1 M
4X
q
A1
C
SEATING
PLANE
NOTES:
1.
DIMENSIONING AND
ASME Y14.5M, 1994.
TOLwERwANwCI.NDGaPtEaRSheet4U.com
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION D1 AND E1 DO NOT INCLUDE
MOLD FLASH PROTRUSIONS OR GATE
BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.90 1.00 1.10
A1 0.00 --- 0.05
b 0.33 0.41 0.51
c 0.23 0.28 0.33
D 5.15 BSC
D1 4.50 4.90 5.10
D2 3.50 --- 4.22
E 6.15 BSC
E1 5.50 5.80 6.10
E2 3.45 --- 4.30
e 1.27 BSC
G 0.51 0.61 0.71
K 0.51 --- ---
L 0.51 0.61 0.71
L1 0.05 0.17 0.20
M 3.00 3.40 3.80
q 0 _ --- 12 _
SOLDERING FOOTPRINT*
3X
1.270
4X
0.750
4X
1.000
0.965
1.330
2X
0.495
3.200
2X
0.905
4.530
0.475
65
G D2
BOTTOM VIEW
2X
1.530
4.560
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
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5
NTMFS4708N/D
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet NTMFS4708N.PDF ] | |
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