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PDF NCV70522 Data sheet ( Hoja de datos )
| Número de pieza | NCV70522 | |
| Descripción | Micro-Stepping Motor Driver | |
| Fabricantes | ON Semiconductor | |
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AMIS-30522, NCV70522
Micro-Stepping Motor Driver
Introduction
The AMIS−30522/NCV70522 is a micro−stepping stepper motor
driver for bipolar stepper motors. The chip is connected through I/O
pins and a SPI interface with an external microcontroller. The
AMIS−30522/NCV70522 contains a current−translation table. It takes
the next micro−step depending on the clock signal on the “NXT” input
pin and the status of the “DIR” (= direction) register or input pin. The
chip provides a so−called “Speed and Load Angle” output. This allows
the creation of stall detection algorithms and control loops based on
load−angle to adjust torque and speed. It is using a proprietary PWM
algorithm for reliable current control.
The AMIS−30522/NCV70522 is implemented in I2T100
technology, enabling both high voltage analog circuitry and digital
functionality on the same chip. The chip is fully compatible with the
automotive voltage requirements.
The 522 is ideally suited for general purpose stepper motor
applications in the automotive, industrial, medical and marine
environment. The AMIS−30522 is intended for use in industrial
applications. The NCV70522 version is qualified for use in
automotive applications.
Features
• Dual H−Bridge for 2 Phase Stepper Motors
• Programmable Peak−Current up to 1.2 A Continuous (1.5 A Short
Time), Using a 5−Bit Current DAC
• On−Chip Current Translator
• SPI Interface
• Speed and Load−Angle Output
• 7 Step Modes from Full−Step up to 32 Micro−Steps
• Fully Integrated Current−Sense
• PWM Current Control with Automatic Selection of Fast and Slow
Decay
• Low EMC PWM with Selectable Voltage Slopes
• Active Fly−back Diodes
• Full Output Protection and Diagnosis
• Thermal Warning and Shutdown
• Digital IO’s Compatible with 5 V and 3.3 V Microcontrollers
• Integrated 5 V Voltage Regulator to Supply an External
Microcontroller
• Integrated Reset Function to Reset External Microcontroller
• Integrated Watchdog Function
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
• These are Pb−Free Devices*
http://onsemi.com
PINOUT
32 31 30 29 28 27 26 25
GND 1
DI 2
CLK 3
NXT 4
DIR 5
ERR 6
SLA 7
8
AMIS−30522/
NCV70522
24 GND
23 GND
22 MOTXN
21 MOTXN
20 MOTYN
19 MOTYN
18 GND
17 GND
9 10 11 12 13 14 15 16
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 27 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
December, 2009 − Rev. 0
www.DataSheet.in
1
Publication Order Number:
AMIS−30522/D
1 page  
AMIS−30522, NCV70522
PACKAGE THERMAL CHARACTERISTICS
The 522 is available in a NQFP32 package. For cooling
optimizations, the NQFP has an exposed thermal pad which
has to be soldered to the PCB ground plane. The ground
plane needs thermal vias to conduct the heat to the bottom
layer. Figure 3 gives an example for good power distribution
solutions.
For precise thermal cooling calculations the major
thermal resistances of the device are given. The thermal
media to which the power of the devices has to be given are:
• Static environmental air (via the case)
• PCB board copper area (via the exposed pad)
The thermal resistances are presented in Table 5: DC
Parameters.
The major thermal resistances of the device are the Rth
from the junction−to−ambient (Rthja) and the overall Rth
from the junction−to−exposed pad (Rthjp). In the table
below one can find the values for the Rthja and Rthjp,
simulated according to JESD−51:
The Rthja for 2S2P is simulated conform JEDEC JESD−51
as follows:
• A 4−layer printed circuit board with inner power planes
and outer (top and bottom) signal layers is used
• Board thickness is 1.46 mm (FR4 PCB material)
• The 2 signal layers: 70 mm thick copper with an area of
5500 mm2 copper and 20% conductivity
• The 2 power internal planes: 36 mm thick copper with
an area of 5500 mm2 copper and 90% conductivity
The Rthja for 1S0P is simulated conform JEDEC JESD−51
as follows:
• A 1−layer printed circuit board with only 1 layer
• Board thickness is 1.46 mm (FR4 PCB material)
• The layer has a thickness of 70 mm copper with an area
of 5500 mm2 copper and 20% conductivity
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNÎÎÎÎQFPÎÎÎÎ−32ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)
ELECTRICAL SPECIFICATION
Recommended Operation Conditions
Operating ranges define the limits for functional
operation and parametric characteristics of the device. Note
that the functionality of the chip outside these operating
Table 4. OPERATING RANGES
Symbol
Parameter
VBB Analog DC supply
VDD Logic supply output voltage
TJ Junction temperature
5. No more than 100 cumulative hours in life time above Ttw
ranges is not guaranteed. Operating outside the
recommended operating ranges for extended periods of time
may affect device reliability.
Min Max
+6 +30
4.75 5.25
−40 +172 (Note 5)
Unit
V
V
°C
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5
5 Page 
AMIS−30522, NCV70522
FUNCTIONAL DESCRIPTION
H−Bridge Drivers
A full H−bridge is integrated for each of the two stator
windings. Each H−bridge consists of two low−side and two
high−side N−type MOSFET switches. Writing logic ‘0’ in
bit <MOTEN> disables all drivers (High−Impedance).
Writing logic ‘1’ in this bit enables both bridges and current
can flow in the motor stator windings.
In order to avoid large currents through the H−bridge
switches, it is guaranteed that the top− and bottom switches
of the same half−bridge are never conductive
simultaneously (interlock delay).
A two−stage protection against shorts on motor lines is
implemented. In a first stage, the current in the driver is
limited. Secondly, when excessive voltage is sensed across
the transistor, the transistor is switched−off.
In order to reduce the radiated/conducted emission,
voltage slope control is implemented in the output switches.
The output slope is defined by the gate−drain capacitance of
output transistor and the (limited) current that drives the
gate. There are two trimming bits for slope control (See
Table 12 SPI Control Parameter Overview EMC[1:0]).
The power transistors are equipped with so−called “active
diodes”: when a current is forced through the transistor
switch in the reverse direction, i.e. from source to drain, then
the transistor is switched on. This ensures that most of the
current flows through the channel of the transistor instead of
through the inherent parasitic drain−bulk diode of the
transistor.
Depending on the desired current range and the
micro−step position at hand, the RDS(on) of the low−side
transistors will be adapted such that excellent current−sense
accuracy is maintained. The RDS(on) of the high−side
transistors remain unchanged, see also the DC−parameter
table for more details.
PWM Current Control
A PWM comparator compares continuously the actual
winding current with the requested current and feeds back
the information to a digital regulation loop. This loop then
generates a PWM signal, which turns on/off the H−bridge
switches. The switching points of the PWM duty−cycle are
synchronized to the on−chip PWM clock.
The frequency of the PWM controller can be doubled to
reduce the over−all current−ripple with a factor of two.
To further reduce the emission, an artificial jitter can be
added to the PWM frequency. (see Table 12, SPI Control
Register 1). The PWM frequency will not vary with changes
in the supply voltage. Also variations in motor−speed or
load−conditions of the motor have no effect. There are no
external components required to adjust the PWM frequency.
Automatic Forward & Slow−Fast Decay
The PWM generation is in steady−state using a
combination of forward and slow−decay. The absence of
fast−decay in this mode, guarantees the lowest possible
current−ripple “by design”. For transients to lower current
levels, fast−decay is automatically activated to allow
high−speed response. The selection of fast or slow decay is
completely transparent for the user and no additional
parameters are required for operation.
Icoil
Set value
Actual value
0
TPWM
t
Forward & Slow Decay
Fast Decay & Forward
Forward & Slow Decay
Figure 7. Forward & Slow/Fast Decay PWM
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| Páginas | Total 29 Páginas | |
| PDF Descargar | [ Datasheet NCV70522.PDF ] | |
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